JPH0385642U - - Google Patents
Info
- Publication number
- JPH0385642U JPH0385642U JP1989147970U JP14797089U JPH0385642U JP H0385642 U JPH0385642 U JP H0385642U JP 1989147970 U JP1989147970 U JP 1989147970U JP 14797089 U JP14797089 U JP 14797089U JP H0385642 U JPH0385642 U JP H0385642U
- Authority
- JP
- Japan
- Prior art keywords
- electrode
- front side
- circuit board
- circuit element
- semiconductor circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/072—Connecting or disconnecting of bump connectors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
- H10W72/241—Dispositions, e.g. layouts
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Wire Bonding (AREA)
Description
第１図は本考案に係る電極構造の一実施例を示
す概略断面図である。第２，３図はそれぞれ従来
の電極構造を示す概略断面図である。 １２……半導体素子（半導体回路素子）、１３
……回路基板、１５……アルミニウム電極（Ｂ電
極）、１８……突起電極（電極構造）、２０……
Ａ電極、２１……絶縁層、Ｔ２１……突起厚さ。
す概略断面図である。第２，３図はそれぞれ従来
の電極構造を示す概略断面図である。 １２……半導体素子（半導体回路素子）、１３
……回路基板、１５……アルミニウム電極（Ｂ電
極）、１８……突起電極（電極構造）、２０……
Ａ電極、２１……絶縁層、Ｔ２１……突起厚さ。
Claims (1)
- 半導体回路素子の表部と回路基板の表部とを接
続する電極構造において、導体からなり、半導体
回路素子および回路基板のいずれか一方の表部上
に、他方の表部上に形成されたＢ電極に対向して
設けられたＡ電極と、絶縁部材からなり、Ａ電極
と一方の表部との間に、一方の表部から他方の表
部側に突起しＡ電極がＢ電極に接続可能な突起厚
さを有するよう設けられた絶縁層と、を備えたこ
とを特徴とする電極構造。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989147970U JPH0385642U (ja) | 1989-12-22 | 1989-12-22 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989147970U JPH0385642U (ja) | 1989-12-22 | 1989-12-22 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0385642U true JPH0385642U (ja) | 1991-08-29 |
Family
ID=31694439
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989147970U Pending JPH0385642U (ja) | 1989-12-22 | 1989-12-22 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0385642U (ja) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2000070670A1 (fr) * | 1999-05-12 | 2000-11-23 | Hitachi, Ltd. | Dispositif a semi-conducteur, procede de fabrication associe, et dispositif electronique |
| WO2008072510A1 (ja) * | 2006-12-15 | 2008-06-19 | Sharp Kabushiki Kaisha | 半導体装置 |
-
1989
- 1989-12-22 JP JP1989147970U patent/JPH0385642U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2000070670A1 (fr) * | 1999-05-12 | 2000-11-23 | Hitachi, Ltd. | Dispositif a semi-conducteur, procede de fabrication associe, et dispositif electronique |
| WO2008072510A1 (ja) * | 2006-12-15 | 2008-06-19 | Sharp Kabushiki Kaisha | 半導体装置 |