JPH0415857U - - Google Patents

Info

Publication number
JPH0415857U
JPH0415857U JP1990057433U JP5743390U JPH0415857U JP H0415857 U JPH0415857 U JP H0415857U JP 1990057433 U JP1990057433 U JP 1990057433U JP 5743390 U JP5743390 U JP 5743390U JP H0415857 U JPH0415857 U JP H0415857U
Authority
JP
Japan
Prior art keywords
slits
electronic components
lead frame
tab
inner lead
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1990057433U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1990057433U priority Critical patent/JPH0415857U/ja
Publication of JPH0415857U publication Critical patent/JPH0415857U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/931—Shapes of bond pads
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Lead Frames For Integrated Circuits (AREA)

Description

【図面の簡単な説明】
第１図は本考案の電子部品用リードフレームの
第１の実施例に係る構成を示す平面図、第２図は
第１図の−線に係る断面図、第３図は第２の
実施例の構成を示す平面図、第４図は従来の技術
に係る電子部品用リードフレームの平面図、第５
図は第４図の−線に係る断面図である。 １１……タブ部、１１……半導体素子、１２…
…インナーリード部、１２ａ，１２ｂ……インナ
ーリード、１３，１４，１５……貫通スリツト、
１７……導電性接着材、２０，２２，２４、２６
……区分、３０，３２……配線ワイヤ。

Claims (1)

    【実用新案登録請求の範囲】
  1. 少なくとも素子が配設されるタブと結線用イン
    ナーリードを備え、上記タブには夫々交わること
    なく貫通スリツトが設けられ、且つ上記貫通スリ
    ツトで区分される部分の面積が実質的に均等に形
    成されることを特徴とする電子部品用リードフレ
    ーム。
JP1990057433U 1990-05-31 1990-05-31 Pending JPH0415857U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1990057433U JPH0415857U (ja) 1990-05-31 1990-05-31

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1990057433U JPH0415857U (ja) 1990-05-31 1990-05-31

Publications (1)

Publication Number Publication Date
JPH0415857U true JPH0415857U (ja) 1992-02-07

Family

ID=31582133

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1990057433U Pending JPH0415857U (ja) 1990-05-31 1990-05-31

Country Status (1)

Country Link
JP (1) JPH0415857U (ja)

Similar Documents

Publication Publication Date Title
JPH0415857U (ja)
JPH0292927U (ja)
JPH0410346U (ja)
JPS63134552U (ja)
JPH03116043U (ja)
JPS6016568U (ja) 光起電力装置
JPS63178348U (ja)
JPS61112650U (ja)
JPS62168677U (ja)
JPS63140652U (ja)
JPS63134558U (ja)
JPH0233434U (ja)
JPS62188144U (ja)
JPS62188731U (ja)
JPS6183072U (ja)
JPS6377355U (ja)
JPS62163963U (ja)
JPS63102250U (ja)
JPH0423092U (ja)
JPH01165603U (ja)
JPH04759U (ja)
JPH0375527U (ja)
JPS648746U (ja)
JPS6349252U (ja)
JPS63118236U (ja)