JPH042018A - Manufacture of vacuum interrupter - Google Patents
Manufacture of vacuum interrupterInfo
- Publication number
- JPH042018A JPH042018A JP10267590A JP10267590A JPH042018A JP H042018 A JPH042018 A JP H042018A JP 10267590 A JP10267590 A JP 10267590A JP 10267590 A JP10267590 A JP 10267590A JP H042018 A JPH042018 A JP H042018A
- Authority
- JP
- Japan
- Prior art keywords
- vacuum interrupter
- side member
- brazing
- soldering
- lead rod
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 10
- 239000000463 material Substances 0.000 claims abstract description 59
- 229910052751 metal Inorganic materials 0.000 claims abstract description 42
- 239000002184 metal Substances 0.000 claims abstract description 42
- 238000002844 melting Methods 0.000 claims abstract description 28
- 230000008018 melting Effects 0.000 claims abstract description 20
- 238000010438 heat treatment Methods 0.000 claims abstract description 13
- 229910052802 copper Inorganic materials 0.000 claims abstract description 10
- 238000005219 brazing Methods 0.000 claims description 74
- 239000010949 copper Substances 0.000 claims description 22
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 16
- 238000000034 method Methods 0.000 claims description 15
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 8
- 238000005304 joining Methods 0.000 claims description 6
- 238000005476 soldering Methods 0.000 abstract description 13
- 238000001704 evaporation Methods 0.000 abstract description 7
- 229910052797 bismuth Inorganic materials 0.000 abstract description 4
- 229910052804 chromium Inorganic materials 0.000 abstract description 2
- 235000014676 Phragmites communis Nutrition 0.000 abstract 3
- 150000002739 metals Chemical class 0.000 description 13
- 229910052737 gold Inorganic materials 0.000 description 7
- 229910052738 indium Inorganic materials 0.000 description 7
- 238000010586 diagram Methods 0.000 description 6
- 230000008020 evaporation Effects 0.000 description 6
- 238000009792 diffusion process Methods 0.000 description 5
- 239000011651 chromium Substances 0.000 description 4
- 239000000203 mixture Substances 0.000 description 4
- 239000002245 particle Substances 0.000 description 4
- 239000000843 powder Substances 0.000 description 4
- 229910045601 alloy Inorganic materials 0.000 description 3
- 239000000956 alloy Substances 0.000 description 3
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 3
- 238000002474 experimental method Methods 0.000 description 3
- 230000001590 oxidative effect Effects 0.000 description 3
- 229910018651 Mn—Ni Inorganic materials 0.000 description 2
- 230000002411 adverse Effects 0.000 description 2
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 description 2
- 238000000748 compression moulding Methods 0.000 description 2
- 239000000470 constituent Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000005496 eutectics Effects 0.000 description 2
- 239000000945 filler Substances 0.000 description 2
- 239000011812 mixed powder Substances 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 229910001316 Ag alloy Inorganic materials 0.000 description 1
- -1 Bi inside is reduced Chemical class 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- 229910016897 MnNi Inorganic materials 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 238000009825 accumulation Methods 0.000 description 1
- 229910052787 antimony Inorganic materials 0.000 description 1
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 description 1
- 239000011324 bead Substances 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000002542 deteriorative effect Effects 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 239000001307 helium Substances 0.000 description 1
- 229910052734 helium Inorganic materials 0.000 description 1
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 238000001764 infiltration Methods 0.000 description 1
- 230000008595 infiltration Effects 0.000 description 1
- 238000011835 investigation Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 231100000989 no adverse effect Toxicity 0.000 description 1
- 230000001376 precipitating effect Effects 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 230000004580 weight loss Effects 0.000 description 1
- 239000013585 weight reducing agent Substances 0.000 description 1
Landscapes
- High-Tension Arc-Extinguishing Switches Without Spraying Means (AREA)
- Manufacture Of Switches (AREA)
Abstract
Description
【発明の詳細な説明】
A、産業上の利用分野
本発明は、真空インタラプタの製造方法に係り、特に電
極が低融点金属を含有している真空インタラプタの製造
方法に関したものである。DETAILED DESCRIPTION OF THE INVENTION A. Field of Industrial Application The present invention relates to a method for manufacturing a vacuum interrupter, and particularly to a method for manufacturing a vacuum interrupter whose electrodes contain a low melting point metal.
B8発明の概要
本発明は、電極が低融点金属を含有している真空インタ
ラプタの最後の組立段階における気密口つ付け部にAu
−Inを主成分とするaつ材を用い、且つロウ付け温度
を700℃以下にして組み立てた後に真空引きすること
により、ロウ付け強度、気密接合の向上を図ったもので
ある。B8 Summary of the Invention The present invention provides the use of Au in the airtight port part in the final assembly stage of a vacuum interrupter whose electrodes contain a low melting point metal.
The brazing strength and airtightness are improved by using an axle material containing -In as a main component and by vacuuming after assembly at a brazing temperature of 700° C. or less.
C9従来の技術
第5図は、この種真空インタラプタの従来の概略構成図
である。C9 Prior Art FIG. 5 is a schematic diagram of a conventional vacuum interrupter of this type.
図中において、1は固定側部材であり、固定電極11を
内端に具備するり−ド棒12と、固定側端板13とを主
要な部材として構成している。2は可動側部材であり、
可動電極21を内端に具備するリード棒22と、可動側
端板23と、ベローズ24とを主要な部材として構成し
ている。3はセラミックス等の部材からなる絶縁筒であ
り、31は絶縁筒の内側に設けた金属シールドである。In the figure, reference numeral 1 denotes a stationary member, and its main members include a lead rod 12 having a fixed electrode 11 at its inner end, and a stationary end plate 13. 2 is a movable member;
The main members are a lead rod 22 having a movable electrode 21 at its inner end, a movable end plate 23, and a bellows 24. 3 is an insulating cylinder made of a member such as ceramics, and 31 is a metal shield provided inside the insulating cylinder.
このように構成した真空インタラプタは、可動電極21
を図中で上下方向に可動することにより電流の開閉を行
うものである。The vacuum interrupter configured in this way has a movable electrode 21
The electric current is switched on and off by moving up and down in the figure.
このような構成からなる真空インタラプタの製造は、一
般には次のような手段により製造されている。A vacuum interrupter having such a configuration is generally manufactured by the following method.
■ 第5図のように構成各部材の接合部に、板ロウ、線
ロウからなるロウ材41〜47を配置して仮組立し、こ
れを真空炉に入れて加熱排気とロウ付けを同時に行って
真空インタラプタを一括して製造する。■ As shown in Figure 5, soldering materials 41 to 47 consisting of plate soldering and wire soldering are placed at the joints of each constituent member and temporarily assembled, and this is placed in a vacuum furnace to perform heating exhaust and brazing at the same time. Vacuum interrupters are manufactured in bulk.
■ 第5図のように構成各部材の接合部に、板ロウ、線
ロウからなるロウ材41〜47を配置して仮組立し、こ
れを非酸化性雰囲気中(例えば水素雰囲気)でロウ付け
を行い、その後図示省略の排気管を介して大気中にて加
熱排気して真空インタラプタを製造する。■ As shown in Fig. 5, soldering materials 41 to 47 made of sheet soldering and wire soldering are placed at the joints of each constituent member and temporarily assembled, and then brazed in a non-oxidizing atmosphere (for example, a hydrogen atmosphere). After that, the vacuum interrupter is manufactured by heating and exhausting in the atmosphere through an exhaust pipe (not shown).
■ 固定側部材1と可動側部材2とを予め前工程で製造
しておき、そして、絶縁筒3との間にロウ材42.47
を介在させて、真空中でロウ付けする。または、ロウ付
け後に真空引きして真空インタラプタを製造する。■ The fixed side member 1 and the movable side member 2 are manufactured in advance in the previous process, and a brazing material 42.47 mm is placed between the insulating cylinder 3
Brazing is performed in a vacuum with the help of Alternatively, a vacuum interrupter is manufactured by vacuuming after brazing.
なお、前記■、■の場合には各所に同じロウ材(例えば
Cu系のロウ材)を配置し、■の場合には溶融点の異な
るロウ材(例えばCu系とAg系)を使用するのが一般
的である。In addition, in the cases of (1) and (2) above, the same brazing material (for example, Cu-based brazing material) is placed in each location, and in the case of (2), brazing materials with different melting points (for example, Cu-based and Ag-based brazing material) are used. is common.
D0発明が解決しようとする課題
従来、真空インタラプタに要求される種々の特性を満た
すために電極に低融点金属、例えばBi(ビスマス)を
、0.1〜20重量%含有することが一般的に行われて
いる。D0 Problems to be Solved by the Invention Conventionally, in order to satisfy the various characteristics required for vacuum interrupters, it has been common to contain 0.1 to 20% by weight of a low melting point metal, such as Bi (bismuth), in the electrode. It is being done.
しかし、電極がこのような低融点金属を含有している場
合には、ロウ付け時の温度(700〜1000℃)にて
電極より低融点金属の一部が蒸発することが知られてい
る。この蒸発した金属は、真空容器内部材に付着するば
かりか、その一部は溶融しているロウ社内に侵入してロ
ウ付け接合に悪影響を及ぼす問題がある。However, when the electrode contains such a low melting point metal, it is known that a part of the low melting point metal evaporates from the electrode at the temperature (700 to 1000° C.) during brazing. This evaporated metal not only adheres to the internal materials of the vacuum container, but also partially enters the molten solder, which poses a problem of adversely affecting the brazing joint.
このような弊害の程度は、低融点金属の含有量との関係
もあるが、特に問題となるのは気密シール接合部である
。Although the degree of such adverse effects is partly related to the content of low-melting point metals, the hermetic seal joints are particularly problematic.
つまり、機械的な接合強度は十分であったとしても気密
シール接合としては不十分なものとなってしまうおそれ
があるからである。In other words, even if the mechanical bonding strength is sufficient, there is a risk that the hermetic sealing bond may be insufficient.
このような気密シール接合部としては、前述の第4図に
おける41,42,45.46.47のロウ材の部位が
各々該当する箇所であり、■ 真空炉中で一括組立する
場合には、これらのロウ材の箇所全部が該当する。しか
も、真空中で一括ロウ付けの場合には、高温加熱状態で
真空インタラプタ内が完全密閉となることから、蒸発し
たBjが内部にこもりやすく、気密接合特性を一層悪化
させやすい問題がある。Such hermetic seal joints correspond to the brazing metal parts 41, 42, 45, 46, and 47 in Fig. 4 mentioned above.■ When assembling in a vacuum furnace, This applies to all of these brazing metal locations. Moreover, in the case of batch brazing in a vacuum, the inside of the vacuum interrupter becomes completely hermetically sealed under the high temperature heating state, so there is a problem that evaporated Bj tends to be trapped inside, further deteriorating the airtight joint characteristics.
■ 前工程で固定側、可動側部材を予め製作しておき次
工程で一体化する場合には、42.47のロウ材の箇所
が該当する。■ If the fixed side and movable side members are manufactured in advance in the previous process and then integrated in the next process, the brazing material part 42.47 corresponds to this.
E8課題を解決するための手段
発明者らは、種々の実験を行った結果、■ まず低融点
金属(例えばBi)を含有する金属におけるBiの蒸発
飛散が活発となる温度に着目した。As a result of various experiments, the inventors focused on the temperature at which evaporation and scattering of Bi becomes active in a metal containing a low melting point metal (eg, Bi).
第4図は、50Cu−40Cr−10Bf (重量%)
の組成からなる金属部材において、加熱温度(横軸)と
重量減少率(縦軸)との関係を不活性雰囲気(真空中)
で調べたものである。Figure 4 shows 50Cu-40Cr-10Bf (wt%)
The relationship between the heating temperature (horizontal axis) and weight loss rate (vertical axis) in a metal member with the composition of inert atmosphere (vacuum)
This is what I investigated.
この図から、温度700℃辺りから急激に重量が減少す
る、つまりBiの蒸発飛散が700℃辺りから活発とな
ることが判った。換言すれば700℃以下の温度でロウ
付けすれば、Biの蒸発飛散はほとんどなく、悪影響は
ないことが判った。From this figure, it was found that the weight suddenly decreased from around 700°C, that is, the evaporation and scattering of Bi became active from around 700°C. In other words, it was found that when brazing is performed at a temperature of 700° C. or lower, there is almost no evaporation and scattering of Bi, and there is no adverse effect.
■ 上記■のことから700℃以下の温度でロウ付けで
き□るロウ材として、Au−Inで形成すれば、安定に
ロウ付け接合できることを見い出した。すなわち、Au
−Inでロウ材を形成すれば、Biの蒸発飛散のない7
00℃以下の温度でロウ付けできるばかりでなく、ロウ
付け部にAu −Inの拡散層が存在し、これによって
低融点金属の接合界面への侵入を抑制でき、安定にロウ
付けできることが判った。(2) Based on the above (2), we have found that if Au-In is used as a brazing material that can be brazed at a temperature of 700° C. or lower, stable brazing bonding can be achieved. That is, Au
-If the brazing material is made of In, there will be no evaporation and scattering of Bi7.
It was found that not only can brazing be performed at temperatures below 00°C, but also that there is an Au-In diffusion layer in the brazing area, which suppresses the intrusion of low-melting point metals into the bonding interface, allowing stable brazing. .
■ 更には、真空中で真空インタラプタを一括して製造
するのではなく、ロウ付け接合した後に真空排気(真空
引き)して製造すれば一層気密シール接合特性が安定で
あることが判った。(2) Furthermore, it has been found that the hermetic seal bonding characteristics are more stable if the vacuum interrupter is manufactured by brazing and then evacuating (vacuuming) instead of manufacturing the vacuum interrupter all at once in a vacuum.
従って、本発明は、真空インタラプタ一体化時における
気密シール接合部のロウ材として、第3図に示す組成範
囲のロウ材、すなわち、(1)■AuとInが21〜3
6重量%で形成したロウ材。Therefore, the present invention uses a brazing material having a composition range shown in FIG.
A wax material made of 6% by weight.
■AuとInが38〜53重量%で形成したロウ材。■A brazing material made of 38 to 53% by weight of Au and In.
(2)そして、AuとInとの共晶点以上の温度である
500℃以上の温度で且つ低融点金属を含有する金属部
材におけるこの低融点金属の蒸発飛散が活発とならない
700”C以下の温度にてロウ付けする方法である。(2) At a temperature of 500°C or higher, which is the temperature above the eutectic point of Au and In, and at a temperature of 700"C or lower, at which the evaporation and scattering of this low-melting point metal in a metal member containing a low-melting-point metal does not become active. This is a method of brazing at high temperatures.
しかして、Au、Inの割合、また温度が上記の関係よ
り外れる場合には安定したロウ付け接合を得ることが出
来なかった。However, if the proportions of Au and In or the temperature deviate from the above relationships, a stable brazed joint could not be obtained.
なお、
(1)低融点金属としては、例えば、Bi(ビスマス)
、Sb(アンチモン)等の低融点金属として良く知られ
ている金属が該当する。(1) As the low melting point metal, for example, Bi (bismuth)
, Sb (antimony), and other metals that are well known as low melting point metals.
(2)低融点金属を含有する金属としては、銅。(2) Copper is a metal containing a low melting point metal.
銅合金、銀、銀合金1等の導電性に富む金属が該当する
。Metals with high conductivity such as copper alloy, silver, and silver alloy 1 fall under this category.
(3)ロウ材は各成分の粉末を所定量混合して所定の形
状に加工するのが各成分の特性が活かされるので好まし
い。(3) It is preferable to mix powders of each component in predetermined amounts and process the brazing material into a predetermined shape so that the characteristics of each component can be utilized.
また、所望のロウ材形成は、金型にてリング状、円板状
に圧縮成形する、または、まず板状に圧縮成形した後に
レーザ等にて簡便に得られる。Further, the desired brazing material can be easily formed by compression molding into a ring shape or disk shape using a mold, or by first compression molding into a plate shape and then using a laser or the like.
又は、混合粉末に有機バインダーを混ぜてペースト状に
して塗布することでも差し支えない。なお、粉末は、−
100メツシユ以下(149μm以下)の粒径のものが
好ましい。Alternatively, an organic binder may be mixed with the mixed powder to form a paste and then applied. In addition, the powder is -
A particle size of 100 mesh or less (149 μm or less) is preferable.
(4)真空インタラプタの一体化としては、■ 固定側
部材、可動側部材を各々形成しておき、これらと絶縁筒
とを一体化する場合。(4) When integrating a vacuum interrupter, (1) A fixed side member and a movable side member are formed separately, and these are integrated with an insulating cylinder.
■ 固定側部材、可動側部材の一方と絶縁筒とを予め一
体化し、その後全体を一体化する場合。■ When one of the fixed side member and the movable side member is integrated with the insulating cylinder in advance, and then the whole is integrated.
の何れかが該当する。Any of the following applies.
(5)電極は、前工程で予めリード棒にロウ付けしても
良い。また低融点金属の含有量が少ない電極とり−ド棒
との接合の場合は本発明で用いたInを含有したロウ材
でなく、従来一般的に使用されているCu−Mn−Ni
等のロウ材であっても差し支えない。ただし、本発明で
使用したInを含有したロウ材を用いるのが望ましい。(5) The electrode may be brazed to the lead rod in advance in the previous step. In addition, in the case of joining with an electrode lead rod containing a small amount of low melting point metal, instead of using the In-containing brazing material used in the present invention, the conventionally commonly used Cu-Mn-Ni brazing material is used.
There is no problem even if it is a brazing material such as. However, it is desirable to use the brazing material containing In used in the present invention.
(6)本発明においては、接合部がCuであれば良く、
部材全体がCu、またはCuを主成分とする材料である
必要はない。(6) In the present invention, the joint portion may be made of Cu;
The entire member does not need to be made of Cu or a material containing Cu as a main component.
F1作用
ロウ付け温度は約700℃以下で良いことから低融点金
属の飛散は少なく、またロウ付け時には真空インタラプ
タ内は完全密閉ではないので、蒸発した低融点金属が真
空インタラプタの内部にこもることは減少する。しかも
ロウ付け接合部にAu、Inの拡散層が存在することで
低融点金属の接合界面への侵入を抑制でき、低融点金属
を含有する電極を備えた真空インタラプタの気密シール
接合を確実に且つ信頼性の高いものにできる。Since the brazing temperature for F1 action is approximately 700℃ or less, there is little scattering of low-melting point metals, and since the inside of the vacuum interrupter is not completely sealed during brazing, evaporated low-melting point metals will not be trapped inside the vacuum interrupter. Decrease. Moreover, the existence of a diffusion layer of Au and In in the brazed joint can suppress the intrusion of low-melting point metals into the joint interface, ensuring airtight sealing of vacuum interrupters equipped with electrodes containing low-melting point metals. It can be made highly reliable.
G、実施例 本発明を以下の実施例に基づいて詳細に説明する。G. Example The present invention will be explained in detail based on the following examples.
まずロウ材の特性について調べた実験結果を説明する。First, we will explain the results of an experiment that investigated the properties of brazing filler metal.
(実験例)
Cuが50重量%、Crが40重量%、Biが10重量
%の成分からなる、低融点金属含有の金属部材と無酸素
銅との接合例である。(Experimental Example) This is an example of joining a metal member containing a low melting point metal and oxygen-free copper, which is composed of 50% by weight of Cu, 40% by weight of Cr, and 10% by weight of Bi.
(a)低融点金属を含有した部材について100メツシ
ユの粒径のCr(クロム)粉末を、アルミナ容器(内径
68mm)に約160g入れ、このCr粉末上にCu−
B1合金(約400g)を載置し、容器に蓋をかぶせ、
これを真空炉内にて脱ガスと共にCu−B1合金の融点
以下の温度で加熱処理して、まずCr粒子を拡散結合さ
せて多孔質の溶浸母材を形成する。(a) For a member containing a low melting point metal, approximately 160 g of Cr (chromium) powder with a particle size of 100 mesh is placed in an alumina container (inner diameter 68 mm), and Cu-
Place B1 alloy (approximately 400 g) and cover the container with a lid.
This is degassed and heat treated in a vacuum furnace at a temperature below the melting point of the Cu-B1 alloy to first diffusely bond the Cr particles to form a porous infiltrated base material.
その後温度を上げて、Cu、Biを溶浸母材に溶浸させ
る。Thereafter, the temperature is raised to infiltrate Cu and Bi into the infiltration base material.
この際にアルミナ容器内は、Bi蒸気を含んだ雰囲気と
なり、Biを多量に含有した複合金属が得られる。At this time, the inside of the alumina container becomes an atmosphere containing Bi vapor, and a composite metal containing a large amount of Bi is obtained.
こうして得られた金属材料を、容器から取り出し、外面
を機械加工して所定の寸法形状にする。The metal material thus obtained is removed from the container and its outer surface is machined into a predetermined size and shape.
(b)ロウ材について
325メツシユの粒径のAu、Inの粉末を用意し、A
uを53g、Inを27gの割合で混合機にて充分に混
合する。(b) For the brazing material, prepare Au and In powders with a particle size of 325 mesh,
Thoroughly mix 53 g of U and 27 g of In using a mixer.
得られた混合粉末から約1.5g 分取し、径が40m
mの金型に均一に充填し、30トンで加圧成形して厚さ
約0.4mmの円形状の薄い成形体を得る。Approximately 1.5 g was collected from the obtained mixed powder, and the diameter was 40 m.
The mixture was uniformly filled into a mold of 300 m in diameter and press-molded at 30 tons to obtain a circular thin molded product with a thickness of about 0.4 mm.
(c)ロウ付けについて
上記ロウ材(Au−In)を、前記Cu−CrB1合金
部材と、無酸素銅からなる部材との間に入れ、これらを
アルミナ容器内に設置し、且つ蓋をし、真空炉にて加熱
処理(500℃、15分間)して接合した。(c) Regarding brazing, the brazing material (Au-In) is placed between the Cu-CrB1 alloy member and the member made of oxygen-free copper, and these are placed in an alumina container and covered with a lid. They were bonded by heat treatment (500° C., 15 minutes) in a vacuum furnace.
(d)ロウ付けの結果について
上記のようにして得られた接合物は、強固に接合されて
おり、しかもロウ材も十分に流動していることが確認さ
れた。(d) Results of brazing It was confirmed that the bonded product obtained as described above was firmly bonded, and that the brazing material was sufficiently fluid.
また、X線マイクロアナライザにて接合部の断面を観察
すると、Au、Inの拡散層によって、Biの界面への
析出は防止され、安定したロウ付け接合層が形成されて
いることが確認された。Furthermore, when observing the cross section of the joint using an X-ray microanalyzer, it was confirmed that the diffusion layer of Au and In prevented Bi from precipitating at the interface, forming a stable brazed joint layer. .
(その他の実験例)
上述の実験例と同様な条件で、ロウ材の成分を変えてロ
ウ付け接合について調べた。その結果は第1図に示す共
晶点(イ)及び(ロ)の近傍における組織であれば上述
の場合と同様の結果が得られることが判った。すなわち
、ロウ材をAuInで形成し、且つInが21〜36重
量%及び38〜53重量%とすれば良いことが判った。(Other Experimental Examples) Under the same conditions as the above-mentioned experimental examples, brazing joints were investigated by changing the components of the brazing material. The results showed that the same results as in the above case can be obtained if the structure is in the vicinity of the eutectic points (a) and (b) shown in FIG. That is, it has been found that the brazing material may be formed of AuIn, and the In content may be 21 to 36% by weight and 38 to 53% by weight.
(比較実験例)
比較のために一般的に知られている、63Ag−27C
u−1,01nロウ材、Cu −M n −N i系ロ
ウ材を用い、温度条件を前者は800℃、後者は950
℃とし、且つ他の条件は上記実験と同様にしてロウ付け
を試みたが剥離し、ロウ付けができなかった。(Comparative Experimental Example) For comparison, commonly known 63Ag-27C
U-1,01n brazing material and Cu-Mn-Ni-based brazing material were used, and the temperature conditions were 800°C for the former and 950°C for the latter.
℃ and other conditions were the same as in the above experiment, but peeling occurred and brazing could not be performed.
(一実施例)
上述の結果からAu−Inを含有するロウ材であれば低
融点金属を含有するCu(銅)部材を直接接合しても十
分な接合強度が得られることが判ったので、このロウ材
を用いて第1図に示す真空インタラプタを構成した。(One Example) From the above results, it was found that a brazing material containing Au-In can provide sufficient bonding strength even when directly bonding a Cu (copper) member containing a low melting point metal. A vacuum interrupter shown in FIG. 1 was constructed using this brazing material.
すなわち、第1図に示す真空インタラプタを構成するに
際して、まず第2図(a)に示す固定側部材1、及び第
2図(b)に示す可動側部材2を各々前工程で形成する
。That is, when constructing the vacuum interrupter shown in FIG. 1, first, the fixed side member 1 shown in FIG. 2(a) and the movable side member 2 shown in FIG. 2(b) are each formed in a pre-process.
固定側部材lは、Cu(銅)からなる固定側端板13、
Cuからなるリード棒12、Cuからなる排気管14か
らなるもので、これらの各部材の間に、ロウ材(板状ロ
ウ材、線状ロウ材)を配置して仮組立し、非酸化性雰囲
気中(真空中)にて約1000℃の温度に加熱して接合
形成する。The fixed side member l includes a fixed side end plate 13 made of Cu (copper),
It consists of a lead rod 12 made of Cu and an exhaust pipe 14 made of Cu, and a brazing material (plate-shaped brazing material, linear brazing material) is placed between these parts for temporary assembly. The bond is formed by heating to a temperature of about 1000° C. in an atmosphere (vacuum).
また、可動側部材2は、Cuからなる固定側端板23、
Cuからなるリード棒22.5US(ステンレス鋼)か
らなるべb−ズ24からなるもので、これら各部材間に
、ロウ材を配置して仮組立し、非酸化性雰囲気中(真空
中)にて約1000℃の温度に加熱して接合形成する。Moreover, the movable side member 2 includes a fixed side end plate 23 made of Cu,
It consists of a lead rod 22.5 made of Cu (stainless steel) and a bead 24 made of stainless steel.A brazing material is placed between these parts to temporarily assemble them, and then they are placed in a non-oxidizing atmosphere (vacuum). The bond is formed by heating to a temperature of approximately 1000°C.
なお、上記ロウ材は、−船釣なCu −M nNiロウ
材を使用した。Note that the above-mentioned brazing material used was a Cu-MnNi brazing material.
上述のように予め形成した固定側部材lと可動側部材2
とは、第1図に示すように、各リード棒12.22の内
端部にロウ材43.44(板状ロウ材)を介して、電極
(Cuが50重量%、Crが40重量%、Biが10重
量%の成分)を設けて仮組立する。また、両端部にCu
(銅)からなる補助部材131,231を備えた絶縁筒
3に各々ロウ材42.47(板状ロウ材)を介して仮組
立する。これらロウ材42.43.44.47は、67
Au−33In (重量%)であり、非酸化性雰囲気中
(真空)にて前工程のロウ付け温度より低い温度の約5
00℃でロウ付け接合して所定の真空インタラプタを一
体化構成し、その後、加熱すると共に排気管14を介し
て真空引きして排気し、排気管14をピンチオフするこ
とにより所望の真空インタラプタを得る。Fixed side member l and movable side member 2 formed in advance as described above
As shown in FIG. , a component containing 10% by weight of Bi) and temporarily assembled. Also, Cu is added to both ends.
The insulating tube 3 is temporarily assembled to the insulating cylinder 3 provided with auxiliary members 131 and 231 made of (copper) via brazing materials 42 and 47 (plate-shaped brazing materials), respectively. These brazing materials 42.43.44.47 are 67
Au-33In (wt%), in a non-oxidizing atmosphere (vacuum) at a temperature lower than the brazing temperature in the previous step, about 5%.
A predetermined vacuum interrupter is integrally formed by brazing and joining at 00°C, and then heated and evacuated through the exhaust pipe 14, and the desired vacuum interrupter is obtained by pinching off the exhaust pipe 14. .
このようにして形成した真空インタラプタにおける端板
13,23と補助金具131,231とは強固に接合さ
れ、ヘリウム・リークデテクターにより調査した結果リ
ークの全く無いことが確認できた。The end plates 13, 23 and the auxiliary fittings 131, 231 in the vacuum interrupter thus formed were firmly joined, and an investigation using a helium leak detector confirmed that there was no leakage at all.
H1発明の効果
本発明によるロウ材は、A u −I nを主成分とし
ていることから、ロウ材は加熱温度を700℃以下で行
うことができるので、低融点金属の蒸発飛散を効果的に
防止でき、これによってロウ材は部に低融点金属の侵入
がなくなる。しかも、ロウ材は部にAu、Inの拡散層
が形成されるので、この拡散層が低融点金属の接合界面
への侵入を抑制できることから、低融点金属を含有(0
,1〜20重量%)する電極を備えた真空インタラプタ
においても気密シール接合を確実且つ安定なものにでき
る。H1 Effects of the Invention Since the brazing material according to the present invention has Au-In as its main component, the brazing material can be heated at a temperature of 700°C or less, which effectively prevents the evaporation and scattering of low-melting point metals. This prevents low melting point metals from entering the brazing filler metal. Moreover, since a diffusion layer of Au and In is formed in the brazing material, this diffusion layer can suppress the intrusion of low melting point metals into the bonding interface.
, 1 to 20% by weight) can also provide a reliable and stable hermetic seal connection.
また、ロウ材は温度が約700℃以下の比較的低い温度
のロウ材であるから、接合部材及び他の構成部材に与え
る熱的影響を軽減することができる。Further, since the brazing material has a relatively low temperature of about 700° C. or less, the thermal influence on the joining member and other structural members can be reduced.
更には、真空インタラプタをロウ材は一体化した後に排
気管を介して真空引きして所望の真空インタラプタを得
るので、ロウ材は時には真空インタラプタ構成部材内は
、完全密閉体ではないので、蒸発したBi等の金属が内
部にこもることは減少し、気密シール接合を一層確実で
安定なものにできる。Furthermore, after the vacuum interrupter is integrated with the brazing material, it is evacuated through an exhaust pipe to obtain the desired vacuum interrupter. The accumulation of metals such as Bi inside is reduced, and the hermetic seal joint can be made more reliable and stable.
従って、真空インタラプタにおける信頼性、耐久性の向
上が図れ、品質向上に寄与できるものである。Therefore, the reliability and durability of the vacuum interrupter can be improved, contributing to quality improvement.
第1図は、本発明の一実施例における真空インタラプタ
の概略構成図、第2図(a)、(b)は、第1図におけ
る真空インタラプタの部分組立図、第3図は、本発明の
ロウ材に係る組成範囲の説明図、第4図は、加熱温度と
重量減少率との関係図、第5図は、従来の真空インタラ
プタの概略構成図である。
311図
吸泥#I4晧鵬′困
外2名
第2図(−)
節分ta江閉
郡々岨二図
第;1図
本発明のロウ叙1;琢7I岨威範囲の斂明図u
重
!
(’/、)
nFIG. 1 is a schematic configuration diagram of a vacuum interrupter according to an embodiment of the present invention, FIGS. 2(a) and (b) are partial assembly diagrams of the vacuum interrupter in FIG. 1, and FIG. 3 is a diagram of a vacuum interrupter according to an embodiment of the present invention. FIG. 4 is a diagram showing the relationship between heating temperature and weight reduction rate, and FIG. 5 is a schematic diagram of a conventional vacuum interrupter. Figure 311 Mud sucking #I4 Jin Peng' External 2 people Figure 2 (-) Setsubunta Jiangheigun Jiji Figure 2 Figure 1 Law description of the present invention 1; ! ('/,) n
Claims (4)
と、少なくともリード棒とベローズとを備えた可動側部
材と、これらの部材の端板が気密接合される絶縁筒と、
各リード棒の内端に設けた電極とを主要な構成部材とし
た真空インタラプタの製造方法において、 前記固定側部材、及び可動側部材を形成する第1工程と
、 形成した固定側部材及び可動側部材と絶縁筒とのロウ付
け気密接合、及び各リード棒の内端に電極をロウ付け接
合して真空インタラプタを組み立てる第2工程と、 組み立てた真空インタラプタ内を真空排気して真空イン
タラプタを得る第3工程とからなり、前記電極は低融点
金属を含有する材料で形成し、前記第2工程におけるロ
ウ付け部分となる部材の少なくとも端部を銅材で形成し
、 前記第2工程における少なくとも気密接合部にAu−I
nを主成分とするロウ材を用い、且つロウ付け加熱温度
を700℃以下としたことを特徴とする真空インタラプ
タの製造方法。(1) A fixed side member including at least a lead rod and an end plate, a movable side member including at least a lead rod and a bellows, and an insulating cylinder in which the end plates of these members are hermetically joined;
A method for manufacturing a vacuum interrupter whose main component is an electrode provided at the inner end of each lead rod, comprising: a first step of forming the fixed side member and the movable side member; and the formed fixed side member and the movable side member. A second step of assembling a vacuum interrupter by brazing and joining the members and the insulating cylinder and an electrode to the inner end of each lead rod, and a second step of evacuating the inside of the assembled vacuum interrupter to obtain a vacuum interrupter. The electrode is formed of a material containing a low melting point metal, at least the end portion of the member to be brazed in the second step is formed of a copper material, and at least the airtight joint in the second step is Au-I on the part
A method for manufacturing a vacuum interrupter, characterized in that a brazing material containing n as a main component is used, and the brazing heating temperature is 700° C. or less.
にロウ付けすることを特徴とする請求項1項に記載の真
空インタラプタの製造方法。(2) The method for manufacturing a vacuum interrupter according to claim 1, characterized in that in the first step, at least one of the electrodes is brazed to the inner end of the lead rod.
と、少なくともリード棒とベローズとを備えた可動側部
材と、これらの部材の端板が気密接合される絶縁筒と、
各リード棒の内端に設けた電極とを主要な構成部材とし
た真空インタラプタの製造方法において、 前記固定側部材または可動側部材の何れか一方の部材を
形成する第1工程と、 固定側部材または可動側部材の何れか他方の部材を絶縁
筒の一方の端部にロウ付け気密接合する第2工程と、 前記第1工程で得た部材と絶縁筒の他方の端部とのロウ
付け気密接合、及び各リード棒の内端に電極をロウ付け
接合して真空インタラプタを構成する第3工程と、 組み立てた真空インタラプタの真空容器内を真空排気し
て真空インタラプタを得る第4工程とからなり、 前記電極は低融点金属を含有する材料で形成し、前記第
3工程におけるロウ付け部分となる部材の少なくとも端
部を銅材で形成し、 前記第3工程における少なくとも気密接合部にAu−I
nを主成分とするロウ材を用い、且つロウ付け加熱温度
を700℃以下としたことを特徴とする真空インタラプ
タの製造方法。(3) a fixed side member including at least a lead rod and an end plate, a movable side member including at least a lead rod and a bellows, and an insulating cylinder in which the end plates of these members are hermetically joined;
A method for manufacturing a vacuum interrupter whose main component is an electrode provided at the inner end of each lead rod, comprising: a first step of forming either the fixed side member or the movable side member; and the fixed side member. or a second step of brazing the other member of the movable side member to one end of the insulating tube, and brazing the other end of the insulating tube to the member obtained in the first step; The third step consists of joining and brazing an electrode to the inner end of each lead rod to form a vacuum interrupter, and the fourth step consists of evacuating the inside of the vacuum container of the assembled vacuum interrupter to obtain a vacuum interrupter. , the electrode is formed of a material containing a low melting point metal, at least the end of the member that will be the brazed part in the third step is formed of a copper material, and at least the airtight joint part in the third step is made of Au-I.
A method for manufacturing a vacuum interrupter, characterized in that a brazing material containing n as a main component is used, and the brazing heating temperature is 700° C. or less.
リード棒内端にロウ付けすることを特徴とする請求項3
項に記載の真空インタラプタの製造方法。(4) Claim 3 characterized in that at least one of the electrodes is brazed to the inner end of the lead rod in the first step and the second step.
The method for manufacturing the vacuum interrupter described in Section 1.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10267590A JPH042018A (en) | 1990-04-18 | 1990-04-18 | Manufacture of vacuum interrupter |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10267590A JPH042018A (en) | 1990-04-18 | 1990-04-18 | Manufacture of vacuum interrupter |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH042018A true JPH042018A (en) | 1992-01-07 |
Family
ID=14333810
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10267590A Pending JPH042018A (en) | 1990-04-18 | 1990-04-18 | Manufacture of vacuum interrupter |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH042018A (en) |
-
1990
- 1990-04-18 JP JP10267590A patent/JPH042018A/en active Pending
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