JPH042019A - Manufacture of vacuum interrupter - Google Patents
Manufacture of vacuum interrupterInfo
- Publication number
- JPH042019A JPH042019A JP10267890A JP10267890A JPH042019A JP H042019 A JPH042019 A JP H042019A JP 10267890 A JP10267890 A JP 10267890A JP 10267890 A JP10267890 A JP 10267890A JP H042019 A JPH042019 A JP H042019A
- Authority
- JP
- Japan
- Prior art keywords
- vacuum interrupter
- side member
- brazing
- soldering
- lead rod
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 10
- 239000000463 material Substances 0.000 claims abstract description 57
- 229910052751 metal Inorganic materials 0.000 claims abstract description 44
- 239000002184 metal Substances 0.000 claims abstract description 44
- 229910052802 copper Inorganic materials 0.000 claims abstract description 18
- 238000010438 heat treatment Methods 0.000 claims abstract description 13
- 229910052698 phosphorus Inorganic materials 0.000 claims abstract description 8
- 229910052718 tin Inorganic materials 0.000 claims abstract description 8
- 238000005219 brazing Methods 0.000 claims description 66
- 239000010949 copper Substances 0.000 claims description 31
- 238000002844 melting Methods 0.000 claims description 29
- 230000008018 melting Effects 0.000 claims description 22
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 17
- 238000000034 method Methods 0.000 claims description 16
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 8
- 238000005304 joining Methods 0.000 claims description 5
- 238000005476 soldering Methods 0.000 abstract description 14
- 229910052759 nickel Inorganic materials 0.000 abstract description 5
- 229910052797 bismuth Inorganic materials 0.000 abstract description 4
- 229910052804 chromium Inorganic materials 0.000 abstract description 2
- 235000014676 Phragmites communis Nutrition 0.000 abstract 3
- 230000004927 fusion Effects 0.000 abstract 1
- 150000002739 metals Chemical class 0.000 description 11
- 238000010586 diagram Methods 0.000 description 6
- 238000001704 evaporation Methods 0.000 description 6
- 238000009792 diffusion process Methods 0.000 description 5
- 230000008020 evaporation Effects 0.000 description 5
- 239000011651 chromium Substances 0.000 description 4
- 230000002411 adverse Effects 0.000 description 3
- 229910045601 alloy Inorganic materials 0.000 description 3
- 239000000956 alloy Substances 0.000 description 3
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 3
- 230000001590 oxidative effect Effects 0.000 description 3
- 239000000843 powder Substances 0.000 description 3
- 238000007789 sealing Methods 0.000 description 3
- 229910018651 Mn—Ni Inorganic materials 0.000 description 2
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 description 2
- 239000000470 constituent Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000002474 experimental method Methods 0.000 description 2
- 238000001764 infiltration Methods 0.000 description 2
- 230000008595 infiltration Effects 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 239000013585 weight reducing agent Substances 0.000 description 2
- 229910001316 Ag alloy Inorganic materials 0.000 description 1
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- 229910016897 MnNi Inorganic materials 0.000 description 1
- 229910004837 P—Sn Inorganic materials 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 229910052787 antimony Inorganic materials 0.000 description 1
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000002542 deteriorative effect Effects 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 239000001307 helium Substances 0.000 description 1
- 229910052734 helium Inorganic materials 0.000 description 1
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- 238000011835 investigation Methods 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 230000007935 neutral effect Effects 0.000 description 1
- 231100000989 no adverse effect Toxicity 0.000 description 1
- 230000001376 precipitating effect Effects 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 230000004580 weight loss Effects 0.000 description 1
Landscapes
- High-Tension Arc-Extinguishing Switches Without Spraying Means (AREA)
Abstract
Description
【発明の詳細な説明】
A 産業上の利用分野
本発明は、真空インタラプタの製造方法に係り、特に電
極が低融点金属を含有している真空インクラブタの製造
方法に関したものである。DETAILED DESCRIPTION OF THE INVENTION A. Field of Industrial Application The present invention relates to a method for manufacturing a vacuum interrupter, and particularly to a method for manufacturing a vacuum interrupter whose electrodes contain a low melting point metal.
B8発明の概要
本発明は、電極が低融点金属を含有している真空インタ
ラプタの最後の組立段階における気密ロウ材は接合部に
CuとNiとPとSnとからなるアモルファス質のロウ
材を用い、且つロウ付け加熱温度を700℃以下にして
組み立てた後に真空引きすることにより、ロウ付け強度
、気密接合の向上を図ったものである。B8 Summary of the Invention The present invention uses an amorphous brazing material made of Cu, Ni, P, and Sn in the joint part as an airtight brazing material in the final assembly stage of a vacuum interrupter whose electrodes contain a low melting point metal. In addition, by setting the brazing heating temperature to 700° C. or lower and evacuating after assembly, the brazing strength and airtight joint are improved.
C1従来の技術
第4図は、この種真空インタラプタの従来の概略構成図
である。C1 Prior Art FIG. 4 is a schematic diagram of a conventional vacuum interrupter of this type.
図中において、1は固定側部材であり、固定電極11を
内端に具備するリード棒12と、固定側端板】3とを主
要な部材として構成している。2は可動側部材であり、
可動電極21を内端に具備するリード棒22と、可動側
端板23と、ベローズ24とを主要な部材として構成し
ている。3はセラミックス等の部材からなる絶縁筒であ
り、31は絶縁筒の内側に設けた金属シールドである。In the figure, reference numeral 1 denotes a fixed side member, and the main members are a lead rod 12 having a fixed electrode 11 at its inner end and a fixed side end plate 3. 2 is a movable member;
The main members are a lead rod 22 having a movable electrode 21 at its inner end, a movable end plate 23, and a bellows 24. 3 is an insulating cylinder made of a member such as ceramics, and 31 is a metal shield provided inside the insulating cylinder.
このように構成した真空インタラプタは、可動電極21
を図中で上下方向に可動することにより電流の開閉を行
うものである。The vacuum interrupter configured in this way has a movable electrode 21
The electric current is switched on and off by moving up and down in the figure.
このような構成からなる真空インタラプタの製造は、一
般には次のような手段により製造されている。A vacuum interrupter having such a configuration is generally manufactured by the following method.
■ 第4図のように構成各部材の接合部に、板ロウ、線
ロウからなるロウ材41〜47を配置して仮組立し、こ
れを真空炉に入れて加熱排気とロウ付けを同時に行って
真空インクラブタを一括して製造する。■ As shown in Figure 4, soldering materials 41 to 47 consisting of plate soldering and wire soldering are placed at the joints of each constituent member and temporarily assembled, and this is placed in a vacuum furnace to perform heating exhaust and brazing at the same time. Vacuum ink cleaners are manufactured in bulk.
■ 第4図のように構成各部材の接合部に、板ロウ、線
ロウからなるロウ材41〜47を配置して仮組立し、こ
れを非酸化性雰囲気中(例えば水素雰囲気)でロウ付け
を行い、その後図示省略の排気管を介して大気中にて加
熱排気して真空インタラプタを製造する。■ As shown in Fig. 4, soldering materials 41 to 47 made of sheet soldering and wire soldering are placed at the joints of each constituent member and temporarily assembled, and then brazed in a non-oxidizing atmosphere (for example, hydrogen atmosphere). After that, the vacuum interrupter is manufactured by heating and exhausting in the atmosphere through an exhaust pipe (not shown).
■ 固定側部材1と可動側部材2とを予め前工程で製造
しておき、そして、絶縁筒3との闇にロウ材42.47
を介在させて、真空中でロウ付けする。または、ロウ付
け後に真空引きして真空インタラプタを製造する。■ The fixed side member 1 and the movable side member 2 are manufactured in advance in the previous process, and the brazing material 42.47 is placed between the insulating cylinder 3 and the insulating cylinder 3.
Brazing is performed in a vacuum with the help of Alternatively, a vacuum interrupter is manufactured by vacuuming after brazing.
なお、前記■、■の場合には各所に同じロウ材(例えば
Cu系のロウ材)を配置し、■の場合には溶融点の異な
るロウ材(例えばCu系とAg系)を使用するのが一般
的である。In addition, in the cases of (1) and (2) above, the same brazing material (for example, Cu-based brazing material) is placed in each location, and in the case of (2), brazing materials with different melting points (for example, Cu-based and Ag-based brazing material) are used. is common.
D 発明が解決しようとする課題
従来、真空インタラプタに要求される種々の特性を満た
すために電極−に低融点金属、例えばBi(ビスマス)
を、0.1〜20重量%含有することが一般的に行われ
ている。D Problems to be Solved by the Invention Conventionally, in order to satisfy the various characteristics required for vacuum interrupters, low melting point metals such as Bi (bismuth) have been used for electrodes.
It is generally practiced to contain 0.1 to 20% by weight.
しかし、電極がこのような低融点金属を含有している場
合には、ロウ付け時の温度(700〜1OOO℃)にて
電極より低融点金属の一部が蒸発することが知られてい
る。この蒸発した金属は、真空容器内部材に付着するば
かりか、その一部は溶融しているロウ村山に侵入してロ
ウ付け接合に悪影響を及ぼす問題がある。However, when the electrode contains such a low melting point metal, it is known that a part of the low melting point metal evaporates from the electrode at the temperature during brazing (700 to 100° C.). This evaporated metal not only adheres to the internal materials of the vacuum container, but also partially intrudes into the melted wax material, which poses a problem of adversely affecting the brazing joint.
このような弊害の程度は、低融点金属の含有量との関係
もあるが、特に問題となるのは気密シール接合部である
。Although the degree of such adverse effects is partly related to the content of low-melting point metals, the hermetic seal joints are particularly problematic.
つまり、機械的な接合強度は十分であったとしても気密
シール接合としては不十分なものとなってしまうおそれ
があるからである。In other words, even if the mechanical bonding strength is sufficient, there is a risk that the hermetic sealing bond may be insufficient.
このような気密シール接合部きしては、肪述の第4図に
おける41,42,45,46.47のロウ材の部位が
各々該当する箇所であり、■ 真空炉中で一括組立する
場合には、これらのロウ材の箇所全部が該当する。しか
も、真空中で一括ロウ付けの場合には、高温加熱状態で
真空インクラブタ内が完全密閉となることから、蒸発し
たB1が内部にこもりやすく、気密接合特性を一層悪化
させやすい問題がある。For such an airtight seal joint, the brazing metal parts 41, 42, 45, 46, and 47 in Figure 4 of the fat description are the corresponding parts, and ■ When assembling all at once in a vacuum furnace This applies to all of these brazing metal locations. Moreover, in the case of bulk brazing in a vacuum, the vacuum ink tank becomes completely airtight under high-temperature heating, which causes the problem that evaporated B1 tends to stay inside, further deteriorating the airtight joint characteristics.
■ 前工程で固定側、可動側部材を予め製作しておき次
工程で一体化する場合には、42.47のロウ材の箇所
が該当する。■ If the fixed side and movable side members are manufactured in advance in the previous process and then integrated in the next process, the brazing material part 42.47 corresponds to this.
80課題を解決するための手段
発明者らは、種々の実験を行った結果、■ まず低融点
金属(例えばBi)を含有する金属におけるB1の蒸発
飛散が活発となる温度に着目した。As a result of various experiments, the inventors focused on the temperature at which evaporation and scattering of B1 becomes active in a metal containing a low melting point metal (eg, Bi).
第3図は、50Cu−40Cr−10Bi (重量%)
の組成からなる金属部材において、加熱温度(横軸)と
重量減少率(縦軸)との関係を不活性雰囲気(真空中)
で調べたものである。Figure 3 shows 50Cu-40Cr-10Bi (wt%)
The relationship between heating temperature (horizontal axis) and weight loss rate (vertical axis) in a metal member with the composition of inert atmosphere (vacuum)
This is what I investigated.
この図から、温度700℃辺りから急激に重量が減少す
る、つまりBiの蒸発飛散が700℃辺りから活発とな
ることが判った。換言すれば700℃以下の温度でロウ
付けすれば、Biの蒸発飛散はほとんどなく、悪影響は
ないことが判った。From this figure, it was found that the weight suddenly decreased from around 700°C, that is, the evaporation and scattering of Bi became active from around 700°C. In other words, it was found that when brazing is performed at a temperature of 700° C. or lower, there is almost no evaporation and scattering of Bi, and there is no adverse effect.
■ 上記■のことから700℃以下の温度でロウ付けで
きるロウ材として、CuとNiとPとSnとからなり且
つアモルファス質で形成すれば、安定にロウ付け□接合
できることを見い出した。(2) Based on the above (2), it has been found that if the brazing material is made of Cu, Ni, P, and Sn and is amorphous and can be brazed at a temperature of 700° C. or lower, stable soldering can be achieved.
CuとNiとPとSnとからなり且つアモルファス質で
ロウ材を形成すれば、Biの蒸発飛散のない700℃以
下の温度でロウ付けできるばかりでなく、ロウ付け部に
Cu−Nj−P−8nの拡散層が存在し、これによって
低融点金属の接合界面への侵入を抑制でき、安定にロウ
付けできることが判った。If the brazing material is made of Cu, Ni, P, and Sn and is amorphous, not only can brazing be performed at temperatures below 700°C without evaporation and scattering of Bi, but also Cu-Nj-P- It was found that the presence of a 8n diffusion layer suppressed the intrusion of the low melting point metal into the bonding interface and enabled stable brazing.
■ 更には、真空中で真空インタラプタを一括して製造
するのではなく、ロウ付け接合した後に真空排気(真空
引き)して製造すれば一層気密ソール接合特性が安定で
あることが判った。(2) Furthermore, it has been found that the hermetic sole bonding characteristics are more stable if the vacuum interrupter is not manufactured all at once in a vacuum, but is manufactured by evacuating (evacuating) after brazing and bonding.
従って、本発明は、例えば低融点金属を含有していても
これの悪影響を受けないロウ材とロウ付け方法を提供す
るものであり、
(1)’CuとNiとPとSnとからなるアモルファス
質のロウ材であって、Cuを77〜80重量%、Niを
38〜53重量%、Pを7〜8重量%、S、nを4〜1
0重量%で形成したロウ材。Therefore, the present invention provides a brazing material and a brazing method that are not adversely affected even if it contains low-melting point metals. A high-quality brazing material containing 77 to 80% by weight of Cu, 38 to 53% by weight of Ni, 7 to 8% by weight of P, and 4 to 1% of S and n.
A brazing material made of 0% by weight.
(2)そして、630℃以上の温度で且つ低融点金属を
含有する金属部材におけるこの低融点金属の蒸発飛散が
活発とならない700℃以下の温度にてロウ付けする方
法である。(2) This is a method of brazing at a temperature of 630° C. or higher and at a temperature of 700° C. or lower, at which the evaporation and scattering of the low-melting point metal in the metal member containing the low-melting point metal does not become active.
しかして、Cu N N l % P 、S nの割合
、また温度が上記の関係より外れる場合には安定したロ
ウ付け接合を得ることが出来なかった。However, if the proportions of CuNNl%P, Sn, or temperature deviate from the above relationships, a stable brazed joint could not be obtained.
なお、
(1)低融点金属としては、例えば、Bi(ビスマス)
、Sb(アンチモン)等の低融点金属として良く知られ
ている金属が該当する。(1) As the low melting point metal, for example, Bi (bismuth)
, Sb (antimony), and other metals that are well known as low melting point metals.
(2)低融点金属を含有する金属としては、銅。(2) Copper is a metal containing a low melting point metal.
銅合金、銀、銀合金9等の導電性に富む金属が該当する
。Metals with high conductivity such as copper alloys, silver, and silver alloys 9 fall under this category.
(3)真空インタラプタの一体化としては、■ 固定側
部材、可動側部材を各々形成しておき、これらと絶縁筒
とを一体化する場合。(3) When integrating a vacuum interrupter, (1) A fixed side member and a movable side member are formed separately, and these are integrated with an insulating tube.
■ 固定側部材、可動側部材の一方と絶縁筒とを予め一
体化し、その後全体を一体化する場合。■ When one of the fixed side member and the movable side member is integrated with the insulating cylinder in advance, and then the whole is integrated.
の何れかが該当する。Any of the following applies.
(4)電極は、前工程で予めリード棒にロウ付けしても
良い。また低融点金属の含有量が少ない電極とり−ド棒
との接合の場合は本発明で用いたInを含有したロウ材
でなく、従来−船釣に使用されているCu−Mn−Ni
等のロウ材であっても差し支えない。ただし、本発明で
使用したInを含有したロウ材を用いるのが望ましい。(4) The electrode may be brazed to the lead rod in advance in the previous step. In addition, in the case of joining with an electrode rod containing a small amount of low melting point metal, instead of using the In-containing brazing material used in the present invention, Cu-Mn-Ni, which is conventionally used for boat fishing, is used.
There is no problem even if it is a brazing material such as. However, it is desirable to use the brazing material containing In used in the present invention.
(5)本発明においては、接合部がCuであれば良く、
部材全体がCu、またはCuを主成分とする材料である
必要はない。(5) In the present invention, the joint portion may be made of Cu;
The entire member does not need to be made of Cu or a material containing Cu as a main component.
F1作用
ロウ付け温度は約700℃以下で良いことから低融点金
属の飛散は少なく、またロウ付け時には真空インタラプ
タ内は完全密閉ではないので、蒸発した低融点金属が真
空インタラプタの内部にこもることは減少する。しかも
ロウ付け接合部にCu−N1−P−5nの拡散層が存在
することで低融点金属の接合界面への侵入を抑制でき、
低融点金属を含有する電極を備えた真空インタラプタの
気密シール接合を確実に且つ信頼性の高いものにてきる
。Since the brazing temperature for F1 action is approximately 700℃ or less, there is little scattering of low-melting point metals, and since the inside of the vacuum interrupter is not completely sealed during brazing, evaporated low-melting point metals will not be trapped inside the vacuum interrupter. Decrease. Moreover, the presence of the Cu-N1-P-5n diffusion layer in the brazed joint can suppress the intrusion of low-melting point metals into the joint interface.
To ensure reliable and highly reliable hermetic sealing of a vacuum interrupter equipped with an electrode containing a low melting point metal.
G、実施例 本発明を以下の実施例に基づいて詳細に説明する。G. Example The present invention will be explained in detail based on the following examples.
まずロウ材の特性について調べた実験結果を説明する。First, we will explain the results of experiments that investigated the properties of brazing filler metal.
(実験例)
Cuが50重量%、Orが40重量%、Biが10重量
%の成分からなる、低融点金属含有の金属部材と無酸素
銅との接合例である。(Experimental Example) This is an example of joining a metal member containing a low melting point metal and oxygen-free copper, which is composed of 50% by weight of Cu, 40% by weight of Or, and 10% by weight of Bi.
(a)低融点金属を含有した部材について100メツシ
ユの粒径のCr(−クロム)粉末を、アルミナ容器(内
径68mm)に約160g入れ、このCr粉末上にCu
−B1合金(約400g)を載置し、容器に蓋をかぶせ
、これを真空炉内にで脱ガスと共にCu−B1合金の融
点以下の温度で加熱処理して、まずCr粒子を拡散結合
させて多孔質の溶浸母材を形成する。(a) For a member containing a low melting point metal, approximately 160 g of Cr (-chromium) powder with a particle size of 100 mesh is placed in an alumina container (inner diameter 68 mm), and Cu powder is placed on top of the Cr powder.
- B1 alloy (approximately 400 g) is placed, the container is covered with a lid, and this is degassed in a vacuum furnace and heat treated at a temperature below the melting point of the Cu-B1 alloy to first diffuse bond the Cr particles. to form a porous infiltration matrix.
その後温度を上げて、Cu、Biを溶浸母材に溶浸させ
る。Thereafter, the temperature is raised to infiltrate Cu and Bi into the infiltration base material.
この際にアルミナ容器内は、Bi蒸気を含んだ雰囲気と
なり、Biを多量に含有した複合金属が得られる。At this time, the inside of the alumina container becomes an atmosphere containing Bi vapor, and a composite metal containing a large amount of Bi is obtained.
こうして得られた金属材料を、容器から取り出し、外面
を機械加工して所定の寸法形状にする。The metal material thus obtained is removed from the container and its outer surface is machined into a predetermined size and shape.
(b)ロウ材について
77.6Cu−5,7Ni−7P−9,7Sn(重量%
)のアモルファス質のロウ材を用意する。(b) About the brazing material 77.6Cu-5,7Ni-7P-9,7Sn (wt%
) Prepare an amorphous wax material.
(c)ロウ付けについて
上記ロウ材(Cu−Ni−P−5n)を、耐記Cu−C
r−B1合金部材と、無酸素銅からなる部材との間に入
れ、これらをアルミナ容器内に設置し、真空炉にて加熱
処理(700℃、15分間)して接合した。(c) About brazing The above brazing material (Cu-Ni-P-5n) is
It was placed between the r-B1 alloy member and the member made of oxygen-free copper, placed in an alumina container, and bonded by heat treatment (700° C., 15 minutes) in a vacuum furnace.
(d)ロウ付けの結果について
上記のようにして得られた接合物は、強固に接合されて
おり、しかもロウ材も十分に流動していることが確認さ
れた。(d) Results of brazing It was confirmed that the bonded product obtained as described above was firmly bonded, and that the brazing material was sufficiently fluid.
また、X線マイクロアナライザにて接合部の断面を観察
すると、Ag、Cu、Inの拡散層によって、Biの界
面への析出は防止され、安定したロウ付け接合層が形成
されていることが確認された。Furthermore, when observing the cross section of the joint using an X-ray microanalyzer, it was confirmed that the diffusion layer of Ag, Cu, and In prevented Bi from precipitating at the interface, forming a stable brazed joint layer. It was done.
(比較実験例)
比較のために一般的に知られている、63Ag27Cu
−10Inoつ材、Cu −Mn−Ni系ロウ材を用い
、温度条件を前者は80o℃、後者は950℃とし、且
つ他の条件は上記実験例と同様にしてロウ付けを試みた
がいずれも剥離し、ロウ付けができなかった。(Comparative Experimental Example) For comparison, commonly known 63Ag27Cu
-10 Ino material and Cu-Mn-Ni brazing material were used, and the temperature conditions were 80°C for the former and 950°C for the latter, and the other conditions were the same as in the above experimental example. It peeled off and could not be brazed.
(一実施例)
上述の結果からCu−N1−P−Snのアモルファス質
のロウ材であれば低融点金属を含有するCu(銅)部材
を直接接合しても十分な接合強度が得られることが判っ
たので、このロウ材を用いて第1図に示す真空インタラ
プタを構成した。(One example) From the above results, it is clear that sufficient bonding strength can be obtained even if Cu (copper) members containing low melting point metals are directly bonded using an amorphous brazing material of Cu-N1-P-Sn. Since this was found, the vacuum interrupter shown in FIG. 1 was constructed using this brazing material.
すなわち、第1図に示す真空インタラプタを構成するに
際して、まず第2図(a)に示す固定側部材11及び第
2図(b)に示す可動側部材2を各々前工程で形成する
。That is, when constructing the vacuum interrupter shown in FIG. 1, first, the fixed side member 11 shown in FIG. 2(a) and the movable side member 2 shown in FIG. 2(b) are each formed in a pre-process.
固定側部材lは、Cu(銅)からなる固定側端板13、
Cuからなるリード棒12、Cuからなる排気管14か
らなるもので、これらの各部材の間に、ロウ材(板状ロ
ウ材、線状aつ材)を配置して仮組立し、非酸化性雰囲
気中(真空中)にて約1000℃の温度に加熱して接合
形成する。The fixed side member l includes a fixed side end plate 13 made of Cu (copper),
It consists of a lead rod 12 made of Cu and an exhaust pipe 14 made of Cu. A brazing material (plate-like brazing material, linear axle material) is placed between these parts for temporary assembly, and non-oxidized The bond is formed by heating to a temperature of about 1000° C. in a neutral atmosphere (vacuum).
また、可動側部材2は、Cuからなる固定側端板23、
Cuからなるリード棒22.5US(ステンレス鯛)か
らなるベローズ24からなるもので、これら各部材間に
、ロウ材を配置して仮組立し、非酸化性雰囲気中(真空
中)にて約1000℃の温度に加熱して接合形成する。Moreover, the movable side member 2 includes a fixed side end plate 23 made of Cu,
It consists of a bellows 24 made of a lead rod 22.5US (stainless steel) made of Cu, and a brazing material is placed between each of these parts to temporarily assemble it and heat it in a non-oxidizing atmosphere (vacuum) for about 1,000 yen. The bond is formed by heating to a temperature of °C.
なお、上記ロウ材は、−船釣なCu −M nNiロウ
材を使用した。Note that the above-mentioned brazing material used was a Cu-MnNi brazing material.
上述のように予め形成した固定側部材1と可動側部材2
とは、第1図に示すように、各リード棒12.22の内
端部にロウ材43.44 (板状ロウ材)を介して、電
極(Cuが50重量%、Crが40重量%、Biが10
重量%の成分)を設けて仮組立する。また、両端部にC
u(銅)からなる補助部材131,231を備えた絶縁
筒3に各々ロウ材42.47(板状ロウ材)を介して仮
組立する。これらロウ材42.43.44.47は、7
7.6Cu−5,7Ni−7P−9,7Sn(重量%)
のアモルファス質であり、非酸化性雰囲気中(真空)に
て前工程のロウ材は温度より低い温度の約700℃でロ
ウ材は接合して所定の真空インタラプタを一体化構成し
、その後、加熱すると共に排気管14を介して真空引き
して排気し、排気管14をピンチオフすることにより所
望の真空インタラプタを得る。Fixed side member 1 and movable side member 2 formed in advance as described above
As shown in FIG. , Bi is 10
% by weight) and temporarily assemble. Also, C at both ends.
It is temporarily assembled to the insulating cylinder 3 provided with auxiliary members 131 and 231 made of u (copper) via brazing materials 42 and 47 (plate-shaped brazing materials), respectively. These brazing materials 42.43.44.47 are 7
7.6Cu-5,7Ni-7P-9,7Sn (wt%)
The solder metal is amorphous and is bonded in a non-oxidizing atmosphere (vacuum) at a temperature of approximately 700°C lower than the temperature of the solder metal used in the previous process to form a predetermined vacuum interrupter, and then heated. At the same time, the vacuum is evacuated through the exhaust pipe 14, and the desired vacuum interrupter is obtained by pinching off the exhaust pipe 14.
このようにして形成した真空インタラプタにおける端板
13,23と補助金具131,231とは強固に接合さ
れ、ヘリウム・リークデテクターにより調査した結果リ
ークの全く無いことが確認できた。The end plates 13, 23 and the auxiliary fittings 131, 231 in the vacuum interrupter thus formed were firmly joined, and an investigation using a helium leak detector confirmed that there was no leakage at all.
H0発明の効果
本発明によるロウ材は、CuとNiとPとSnからなり
且つアモルファス質であるから、ロウ材は加熱温度を7
00℃以下で行うことができるので、低融点金属の蒸発
飛散を効果的に防止でき、これによってロウ材は部に低
融点金属の侵入がなくなる。しかも、ロウ材は部にCu
−N1−PSnの拡散層が形成されるので、この拡散層
が低融点金属の接合界面への侵入を抑制できることから
、低融点金属を含有(0,1〜20重量%)する電極を
備えた真空インタラプタにおいても気密シール接合を確
実且つ安定なものにできる。H0 Effects of the Invention Since the brazing material according to the present invention is made of Cu, Ni, P, and Sn and is amorphous, the heating temperature of the brazing material is 7.
Since it can be carried out at a temperature of 00° C. or lower, it is possible to effectively prevent the low melting point metal from evaporating and scattering, thereby eliminating the intrusion of the low melting point metal into the brazing material. Moreover, the brazing material has Cu in the part.
- Since a diffusion layer of -N1-PSn is formed, this diffusion layer can suppress the intrusion of low melting point metal into the bonding interface. Even in a vacuum interrupter, airtight sealing can be achieved reliably and stably.
また、ロウ材は温度が約700℃以下の比較的低い温度
のロウ材であるから、接合部材及び他の構成部材に与え
る熱的影響を軽減することができる。Further, since the brazing material has a relatively low temperature of about 700° C. or less, the thermal influence on the joining member and other structural members can be reduced.
更には、真空インタラプタをロウ材は一体化した後に排
気管を介して真空引きして所望の真空インタラブタを得
るので、ロウ付け時には真空インタラプタ構成部材内は
、完全密閉体ではないので、蒸発したBi等の金属が内
部にこもることは減少し、気密シール接合を一層確実で
安定なものにできる。Furthermore, after the vacuum interrupter is integrated with the brazing material, it is evacuated through an exhaust pipe to obtain the desired vacuum interrupter, so the inside of the vacuum interrupter component is not completely sealed during brazing, so evaporated Bi It is possible to reduce the amount of metals such as those trapped inside, making the airtight seal joint more reliable and stable.
従って、真空インタラプタにおける信頼性、耐久性の向
上が図れ、品質向上に寄与できるものである。Therefore, the reliability and durability of the vacuum interrupter can be improved, contributing to quality improvement.
第1図は、本発明の一実施例における真空インクラブタ
の概略構成図、第2図(a)、(b)は、第1図におけ
る真空インタラプタの部分組立図、第3図は、加熱温度
と重量減少率との関係図、第4図は、従来の真空インタ
ラプタの概略構成図である。
1・・・固定側部材、2・・・可動側部材、11・・・
固定電極、12・・・リード棒、13・・・固定側端板
、14・排気管、21・・可動電極、22・・・リード
棒、23・・・可動側端板、131−・・補助部材、2
31・・・補助部材。
第1図
ヂ施網の11■416゛田
第2図(a)
節分#flユ圀
郡今岨fL図FIG. 1 is a schematic configuration diagram of a vacuum interrupter according to an embodiment of the present invention, FIGS. 2(a) and (b) are partial assembly diagrams of the vacuum interrupter in FIG. 1, and FIG. 3 is a diagram showing heating temperature and FIG. 4, which is a diagram showing the relationship between the weight reduction rate and the weight reduction rate, is a schematic configuration diagram of a conventional vacuum interrupter. 1... Fixed side member, 2... Movable side member, 11...
Fixed electrode, 12... Lead rod, 13... Fixed side end plate, 14... Exhaust pipe, 21... Movable electrode, 22... Lead rod, 23... Movable side end plate, 131-... Auxiliary member, 2
31... Auxiliary member. Figure 1 Jisami no 11■416゛Diagram 2 (a) Setsubun#flYukuni-gun ImashimafL map
Claims (4)
と、少なくともリード棒とベローズとを備えた可動側部
材と、これらの部材の端板が気密接合される絶縁筒と、
各リード棒の内端に設けた電極とを主要な構成部材とし
た真空インタラプタの製造方法において、 前記固定側部材、及び可動側部材を形成する第1工程と
、 形成した固定側部材及び可動側部材と絶縁筒とのロウ付
け気密接合、及び各リード棒の内端に電極をロウ付け接
合して真空インタラプタを組み立てる第2工程と、 組み立てた真空インタラプタ内を真空排気して真空イン
タラプタを得る第3工程とからなり、前記電極は低融点
金属を含有する材料で形成し、前記第2工程におけるロ
ウ付け部分となる部材の少なくとも端部を銅材で形成し
、 前記第2工程における少なくとも気密接合部にCuとN
iとPとSnとからなるアモルファス質のロウ材を用い
、且つロウ付け加熱温度を700℃以下としたことを特
徴とする真空インタラプタの製造方法。(1) A fixed side member including at least a lead rod and an end plate, a movable side member including at least a lead rod and a bellows, and an insulating cylinder in which the end plates of these members are hermetically joined;
A method for manufacturing a vacuum interrupter whose main component is an electrode provided at the inner end of each lead rod, comprising: a first step of forming the fixed side member and the movable side member; and the formed fixed side member and the movable side member. A second step of assembling a vacuum interrupter by brazing and joining the members and the insulating cylinder and an electrode to the inner end of each lead rod, and a second step of evacuating the inside of the assembled vacuum interrupter to obtain a vacuum interrupter. The electrode is formed of a material containing a low melting point metal, at least the end portion of the member to be brazed in the second step is formed of a copper material, and at least the airtight joint in the second step is Cu and N in the part
A method for manufacturing a vacuum interrupter, characterized in that an amorphous brazing material made of i, P, and Sn is used, and the brazing heating temperature is 700° C. or less.
にロウ付けすることを特徴とする請求項1項に記載の真
空インタラプタの製造方法。(2) The method for manufacturing a vacuum interrupter according to claim 1, characterized in that in the first step, at least one of the electrodes is brazed to the inner end of the lead rod.
と、少なくともリード棒とベローズとを備えた可動側部
材と、これらの部材の端板が気密接合される絶縁筒と、
各リード棒の内端に設けた電極とを主要な構成部材とし
た真空インタラプタの製造方法において、 前記固定側部材または可動側部材の何れか一方の部材を
形成する第1工程と、 固定側部材または可動側部材の何れか他方の部材を絶縁
筒の一方の端部にロウ付け気密接合する第2工程と、 前記第1工程で得た部材と絶縁筒の他方の端部とのロウ
付け気密接合、及び各リード棒の内端に電極をロウ付け
接合して真空インタラプタを構成する第3工程と、 組み立てた真空インタラプタの真空容器内を真空排気し
て真空インタラプタを得る第4工程とからなり、 前記電極は低融点金属を含有する材料で形成し、前記第
3工程におけるロウ付け部分となる部材の少なくとも端
部を銅材で形成し、 前記第3工程における少なくとも気密接合部にCuとN
iとPとSnとからなるアモルファス質のロウ材を用い
、且つロウ付け加熱温度を700℃以下としたことを特
徴とする真空インタラプタの製造方法。(3) a fixed side member including at least a lead rod and an end plate, a movable side member including at least a lead rod and a bellows, and an insulating cylinder in which the end plates of these members are hermetically joined;
A method for manufacturing a vacuum interrupter whose main component is an electrode provided at the inner end of each lead rod, comprising: a first step of forming either the fixed side member or the movable side member; and the fixed side member. or a second step of brazing the other member of the movable side member to one end of the insulating tube, and brazing the other end of the insulating tube to the member obtained in the first step; The third step consists of joining and brazing an electrode to the inner end of each lead rod to form a vacuum interrupter, and the fourth step consists of evacuating the inside of the vacuum container of the assembled vacuum interrupter to obtain a vacuum interrupter. , the electrode is formed of a material containing a low melting point metal, at least the end portion of the member to be brazed in the third step is formed of a copper material, and Cu and N are added to at least the airtight joint in the third step.
A method for manufacturing a vacuum interrupter, characterized in that an amorphous brazing material made of i, P, and Sn is used, and the brazing heating temperature is 700° C. or less.
リード棒内端にロウ付けすることを特徴とする請求項3
項に記載の真空インタラプタの製造方法。(4) Claim 3 characterized in that at least one of the electrodes is brazed to the inner end of the lead rod in the first step and the second step.
The method for manufacturing the vacuum interrupter described in Section 1.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10267890A JPH042019A (en) | 1990-04-18 | 1990-04-18 | Manufacture of vacuum interrupter |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10267890A JPH042019A (en) | 1990-04-18 | 1990-04-18 | Manufacture of vacuum interrupter |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH042019A true JPH042019A (en) | 1992-01-07 |
Family
ID=14333894
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10267890A Pending JPH042019A (en) | 1990-04-18 | 1990-04-18 | Manufacture of vacuum interrupter |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH042019A (en) |
-
1990
- 1990-04-18 JP JP10267890A patent/JPH042019A/en active Pending
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