JPH042053U - - Google Patents
Info
- Publication number
- JPH042053U JPH042053U JP4181690U JP4181690U JPH042053U JP H042053 U JPH042053 U JP H042053U JP 4181690 U JP4181690 U JP 4181690U JP 4181690 U JP4181690 U JP 4181690U JP H042053 U JPH042053 U JP H042053U
- Authority
- JP
- Japan
- Prior art keywords
- package
- recesses
- leads
- recess
- tips
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005452 bending Methods 0.000 claims 1
- 239000004065 semiconductor Substances 0.000 claims 1
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Description
第１図ａ，ｂは本考案の一実施例を示す斜視図
と一部断面図、第２図は、従来例の斜視図と一部
断面図である。
１０１……パツケージ、１０２……外部リード
、１０３……外部リードの付け根、１０４……パ
ツケージ本体の凹部、２０１……パツケージ、２
０２……外部リード。
1A and 1B are a perspective view and a partially sectional view showing an embodiment of the present invention, and FIG. 2 is a perspective view and a partially sectional view of a conventional example. 101... Package cage, 102... External lead, 103... Base of external lead, 104... Recess in package body, 201... Package cage, 2
02...External lead.
Claims (1)
を設け、かつ、パツケージから導出された複数本
の外部リードをパツケージ本体の凹部方向に折り
曲げて、リードの先端を前記凹部に収めてなる事
を特徴とする半導体装置。 It is characterized by providing a plurality of recesses in a part of a package housing an IC, and bending a plurality of external leads led out from the package toward the recess of the package body, so that the tips of the leads are accommodated in the recesses. semiconductor device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4181690U JPH042053U (en) | 1990-04-19 | 1990-04-19 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4181690U JPH042053U (en) | 1990-04-19 | 1990-04-19 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH042053U true JPH042053U (en) | 1992-01-09 |
Family
ID=31552811
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4181690U Pending JPH042053U (en) | 1990-04-19 | 1990-04-19 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH042053U (en) |
-
1990
- 1990-04-19 JP JP4181690U patent/JPH042053U/ja active Pending