JPH04224824A - 低ｔｃｅポリイミド - Google Patents

低ｔｃｅポリイミド

Info

Publication number
JPH04224824A
JPH04224824A JP3055666A JP5566691A JPH04224824A JP H04224824 A JPH04224824 A JP H04224824A JP 3055666 A JP3055666 A JP 3055666A JP 5566691 A JP5566691 A JP 5566691A JP H04224824 A JPH04224824 A JP H04224824A
Authority
JP
Japan
Prior art keywords
polyimide
polyamic acid
layer
bpda
pda
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP3055666A
Other languages
English (en)
Japanese (ja)
Inventor
Krishna G Sachdev
クリシユナ・ガンデイー・サクデブ
John P Hummel
ジヨン・パトリツク・ハメル
Ranee Wai-Ling Kwong
ラニー・ワイ−リン・クウオン
Robert Neal Lang
ロバート・ニール・ラング
Leo L Linehan
リーオウ・ロレンス・ラインハン
Harbans S Sachdev
ハーバンズ・シング・サクデブ
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Publication of JPH04224824A publication Critical patent/JPH04224824A/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/40—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes
    • H10W20/45—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes characterised by their insulating parts
    • H10W20/48—Insulating materials thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1003—Preparatory processes
    • C08G73/1007—Preparatory processes from tetracarboxylic acids or derivatives and diamines
    • C08G73/101—Preparatory processes from tetracarboxylic acids or derivatives and diamines containing chain terminating or branching agents
    • C08G73/1014—Preparatory processes from tetracarboxylic acids or derivatives and diamines containing chain terminating or branching agents in the form of (mono)anhydrid
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/69—Insulating materials thereof
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4673—Application methods or materials of intermediate insulating layers not specially adapted to any one of the previous methods of adding a circuit layer
    • H05K3/4676—Single layer compositions

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Polymers With Sulfur, Phosphorus Or Metals In The Main Chain (AREA)
  • Formation Of Insulating Films (AREA)
JP3055666A 1990-03-30 1991-02-28 低ｔｃｅポリイミド Pending JPH04224824A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US503401 1990-03-30
US07/503,401 US5115090A (en) 1990-03-30 1990-03-30 Viscosity stable, essentially gel-free polyamic acid compositions

Publications (1)

Publication Number Publication Date
JPH04224824A true JPH04224824A (ja) 1992-08-14

Family

ID=24001937

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3055666A Pending JPH04224824A (ja) 1990-03-30 1991-02-28 低ｔｃｅポリイミド

Country Status (3)

Country Link
US (1) US5115090A (fr)
EP (1) EP0455571A3 (fr)
JP (1) JPH04224824A (fr)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013508534A (ja) * 2009-10-27 2013-03-07 イー・アイ・デュポン・ドウ・ヌムール・アンド・カンパニー 高温摩耗用途向けポリイミド樹脂
JP2013105834A (ja) * 2011-11-11 2013-05-30 Hitachi Chemical Co Ltd 半導体装置の製造方法、半導体装置及び電子部品
JP2013155281A (ja) * 2012-01-30 2013-08-15 Hitachi Cable Ltd 絶縁塗料、該絶縁塗料を用いた絶縁電線および該絶縁電線を用いたコイル
WO2016013403A1 (fr) * 2014-07-24 2016-01-28 デクセリアルズ株式会社 Polyimide, acide polyamique, composition de résine et substrat pour dispositif d'affichage flexible
KR20190057924A (ko) * 2017-11-21 2019-05-29 주식회사 엘지화학 디스플레이 기판용 폴리이미드 필름
JP2019189872A (ja) * 2019-06-06 2019-10-31 宇部興産株式会社 ポリイミド、積層体およびそれらを含む電子デバイス
JP2020509127A (ja) * 2017-09-04 2020-03-26 エルジー・ケム・リミテッド フレキシブルディスプレイ素子基板用ポリイミドフィルム
JP2022518984A (ja) * 2019-02-01 2022-03-18 エルジー・ケム・リミテッド ポリイミド前駆体組成物およびそれから製造されたポリイミドフィルム、ディスプレイ装置用基板、および光学装置
US11898009B2 (en) 2018-04-20 2024-02-13 Ube Corporation Polyimide, laminate, and electronic device including same

Families Citing this family (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06105836B2 (ja) * 1990-10-05 1994-12-21 富士通株式会社 薄膜多層基板の製造方法
JP2868167B2 (ja) * 1991-08-05 1999-03-10 インターナショナル・ビジネス・マシーンズ・コーポレイション 多重レベル高密度相互接続構造体及び高密度相互接続構造体
US5260408A (en) * 1991-10-29 1993-11-09 E. I. Du Pont De Nemours And Company Low thermal expansion coefficient polyimides with improved elongation
US5264534A (en) * 1991-10-31 1993-11-23 Foster-Miller, Inc. Oriented semicrystalline polymer films
DE69300616T2 (de) * 1992-04-30 1996-05-30 Ibm Silikon enthaltendes positives Photoresistmaterial und dessen Verwendung in Dünnfilm-Verpackung-Technologie.
US5307357A (en) * 1992-11-05 1994-04-26 International Business Machines Corporation Protection means for ridge waveguide laser structures using thick organic films
US5310863A (en) * 1993-01-08 1994-05-10 International Business Machines Corporation Polyimide materials with improved physico-chemical properties
US5431328A (en) * 1994-05-06 1995-07-11 Industrial Technology Research Institute Composite bump flip chip bonding
US5707902A (en) * 1995-02-13 1998-01-13 Industrial Technology Research Institute Composite bump structure and methods of fabrication
US5760480A (en) * 1995-09-20 1998-06-02 Advanced Micro Devics, Inc. Low RC interconnection
JP3213291B2 (ja) * 1999-06-29 2001-10-02 ソニーケミカル株式会社 多層基板及び半導体装置
US20040132900A1 (en) * 2003-01-08 2004-07-08 International Business Machines Corporation Polyimide compositions and use thereof in ceramic product defect repair
US20070063243A1 (en) * 2004-11-26 2007-03-22 Wei-Chun Yang Structure Of Embedded Capacitors And Fabrication Method Thereof
US20060240060A1 (en) * 2005-04-22 2006-10-26 Cardiac Pacemakers, Inc. Lubricious compound and medical device made of the same
US20060241000A1 (en) * 2005-04-22 2006-10-26 Cardiac Pacemakers, Inc. Lubricious compound and medical device made of the same
US20060240253A1 (en) * 2005-04-22 2006-10-26 Cardiac Pacemakers, Inc. Guidewire and tube with lubricious coating
US20060240059A1 (en) * 2005-04-22 2006-10-26 Cardiac Pacemakers, Inc. Lubricious eluting polymer blend and coating made from the same
US20070155949A1 (en) * 2005-12-30 2007-07-05 Saint-Gobain Performance Plastics Corporation Thermally stable composite material
US7476339B2 (en) 2006-08-18 2009-01-13 Saint-Gobain Ceramics & Plastics, Inc. Highly filled thermoplastic composites
US8242604B2 (en) * 2009-10-28 2012-08-14 International Business Machines Corporation Coaxial through-silicon via
EP2596949A4 (fr) * 2010-07-22 2014-01-15 Ube Industries Procédé de fabrication d'un stratifié de film de polyimide, et stratifié de film de polyimide
KR102264420B1 (ko) 2017-11-03 2021-06-11 주식회사 엘지화학 디스플레이 기판용 폴리이미드 필름
JP7772590B2 (ja) * 2018-11-19 2025-11-18 ピーアイ・アドバンスド・マテリアルズ・カンパニー・リミテッド 電子部品のパッケージング用ポリアミック酸組成物およびこれを利用して電子部品をパッケージングする方法
KR102262507B1 (ko) * 2019-02-14 2021-06-08 주식회사 엘지화학 폴리이미드 전구체 조성물 및 이를 이용하여 제조된 폴리이미드 필름
WO2020166913A1 (fr) * 2019-02-14 2020-08-20 주식회사 엘지화학 Composition de précurseur de polyimide et film de polyimide fabriqué en utilisant celle-ci

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6032827A (ja) * 1983-08-01 1985-02-20 Hitachi Ltd 低熱膨張樹脂材料
JPS60250031A (ja) * 1984-05-28 1985-12-10 Hitachi Ltd 低熱膨張性樹脂材料
JPS6160725A (ja) * 1984-08-31 1986-03-28 Hitachi Ltd 電子装置用多層配線基板の製法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA901701A (en) * 1972-05-30 General Electric Company Process for producing polyamide acid and polyimides
US3663728A (en) * 1968-07-25 1972-05-16 Gen Electric Process for producing polyamide acid and polyimides
US4728697A (en) * 1985-09-27 1988-03-01 General Electric Company Novel copolyamideimides, prepolymers therefor and method for their preparation
JPH0819234B2 (ja) * 1987-06-29 1996-02-28 チッソ株式会社 低熱膨脹性かつ高接着性のシリコン含有ポリイミド前駆体の製造法
US5041520A (en) * 1988-07-05 1991-08-20 Mitsui Toatsu Chemicals, Inc. Process for preparing polyimide having excellent high temperature stability

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6032827A (ja) * 1983-08-01 1985-02-20 Hitachi Ltd 低熱膨張樹脂材料
JPS60250031A (ja) * 1984-05-28 1985-12-10 Hitachi Ltd 低熱膨張性樹脂材料
JPS6160725A (ja) * 1984-08-31 1986-03-28 Hitachi Ltd 電子装置用多層配線基板の製法

Cited By (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013508534A (ja) * 2009-10-27 2013-03-07 イー・アイ・デュポン・ドウ・ヌムール・アンド・カンパニー 高温摩耗用途向けポリイミド樹脂
JP2013105834A (ja) * 2011-11-11 2013-05-30 Hitachi Chemical Co Ltd 半導体装置の製造方法、半導体装置及び電子部品
JP2013155281A (ja) * 2012-01-30 2013-08-15 Hitachi Cable Ltd 絶縁塗料、該絶縁塗料を用いた絶縁電線および該絶縁電線を用いたコイル
WO2016013403A1 (fr) * 2014-07-24 2016-01-28 デクセリアルズ株式会社 Polyimide, acide polyamique, composition de résine et substrat pour dispositif d'affichage flexible
JP2020509127A (ja) * 2017-09-04 2020-03-26 エルジー・ケム・リミテッド フレキシブルディスプレイ素子基板用ポリイミドフィルム
US11485859B2 (en) 2017-09-04 2022-11-01 Lg Chem, Ltd. Polyimide film for flexible display device substrate
KR20190057924A (ko) * 2017-11-21 2019-05-29 주식회사 엘지화학 디스플레이 기판용 폴리이미드 필름
US11891483B2 (en) 2017-11-21 2024-02-06 Lg Chem, Ltd. Polyimide film for display substrate
US11898009B2 (en) 2018-04-20 2024-02-13 Ube Corporation Polyimide, laminate, and electronic device including same
JP2022518984A (ja) * 2019-02-01 2022-03-18 エルジー・ケム・リミテッド ポリイミド前駆体組成物およびそれから製造されたポリイミドフィルム、ディスプレイ装置用基板、および光学装置
US11999823B2 (en) 2019-02-01 2024-06-04 Lg Chem, Ltd. Polyimide-based polymer film, substrate for display device, and optical device using the same
US12060456B2 (en) 2019-02-01 2024-08-13 Lg Chem, Ltd. Polyimide precursor composition and polyimide film, substrate for display device, and optical device prepared by using same
US12065543B2 (en) 2019-02-01 2024-08-20 Lg Chem, Ltd. Polyimide-based polymer film, substrate for display device, and optical device using the same
US12552900B2 (en) 2019-02-01 2026-02-17 Lg Chem, Ltd. Polyimide-based polymer film, substrate for display device, and optical device using the same
JP2019189872A (ja) * 2019-06-06 2019-10-31 宇部興産株式会社 ポリイミド、積層体およびそれらを含む電子デバイス

Also Published As

Publication number Publication date
US5115090A (en) 1992-05-19
EP0455571A3 (en) 1992-01-22
EP0455571A2 (fr) 1991-11-06

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