JPH0428433U - - Google Patents
Info
- Publication number
- JPH0428433U JPH0428433U JP1990069076U JP6907690U JPH0428433U JP H0428433 U JPH0428433 U JP H0428433U JP 1990069076 U JP1990069076 U JP 1990069076U JP 6907690 U JP6907690 U JP 6907690U JP H0428433 U JPH0428433 U JP H0428433U
- Authority
- JP
- Japan
- Prior art keywords
- die bonding
- suction nozzle
- bonding head
- supply unit
- mounting table
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/01—Manufacture or treatment
- H10W72/011—Apparatus therefor
- H10W72/0113—Apparatus for manufacturing die-attach connectors
Landscapes
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990069076U JPH0428433U (cs) | 1990-06-29 | 1990-06-29 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990069076U JPH0428433U (cs) | 1990-06-29 | 1990-06-29 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0428433U true JPH0428433U (cs) | 1992-03-06 |
Family
ID=31604069
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1990069076U Pending JPH0428433U (cs) | 1990-06-29 | 1990-06-29 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0428433U (cs) |
-
1990
- 1990-06-29 JP JP1990069076U patent/JPH0428433U/ja active Pending
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