JPH0428433U - - Google Patents
Info
- Publication number
- JPH0428433U JPH0428433U JP1990069076U JP6907690U JPH0428433U JP H0428433 U JPH0428433 U JP H0428433U JP 1990069076 U JP1990069076 U JP 1990069076U JP 6907690 U JP6907690 U JP 6907690U JP H0428433 U JPH0428433 U JP H0428433U
- Authority
- JP
- Japan
- Prior art keywords
- die bonding
- suction nozzle
- bonding head
- supply unit
- mounting table
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/01—Manufacture or treatment
- H10W72/011—Apparatus therefor
- H10W72/0113—Apparatus for manufacturing die-attach connectors
Landscapes
- Die Bonding (AREA)
Description
第１図は本考案の実施例１を示すブロツク図、
第２図は本考案の実施例２を示すブロツク図、第
３図は従来の手作業によるダイボンデイングを示
す断面図、第４図は従来の自動機の実施例を示す
斜視図である。
１……ワーク載置台、２……雰囲気用カバー、
３……不活性ガス導通管、４……接合剤、５……
半導体素子、６……ダイボンデイングヘツド、７
……吸着ノズル、８……半導体素子供給トレー、
９……ソルダ供給ユニツト、１０……半導体装置
パツケージ、１１……ダイボンデイングヘツド制
御部。
FIG. 1 is a block diagram showing Embodiment 1 of the present invention;
FIG. 2 is a block diagram showing a second embodiment of the present invention, FIG. 3 is a sectional view showing conventional manual die bonding, and FIG. 4 is a perspective view showing an embodiment of a conventional automatic machine. 1... Workpiece mounting table, 2... Atmosphere cover,
3... Inert gas conduction pipe, 4... Bonding agent, 5...
Semiconductor element, 6...Die bonding head, 7
...Suction nozzle, 8...Semiconductor element feeding tray,
9...Solder supply unit, 10...Semiconductor device package, 11...Die bonding head control section.
Claims (1)
、ダイボンデイングヘツド制御部と、ソルダ供給
ユニツトと、ワーク載置台とを有するダイボンデ
イング装置であつて、 吸着ノズルは、半導体素子を吸させるものであ
り、 ダイボンデイングヘツドは、吸着ノズルに吸着
させた半導体素子をパツケージ面にダイボンデイ
ングさせるものであり、 ダイボンデイングヘツド制御部は、ダイボンデ
イングヘツドによるダイボンデイング条件を任意
に設定させるものであり、 ソルダ供給ユニツトは、半導体素子をパツケー
ジ面に接合するための接合剤を任意の大きさにし
てパツケージ面に供給させるものであり、 ワーク載置台は、各々半導体素子に適した温度
及び雰囲気に設定させるものであることを特徴と
するダイボンデイング装置。 (2) 前記吸着ノズル、ダイボンデイングヘツド
、ソルダ供給ユニツト、ワーク載置台の組を複数
組有することを特徴とする請求項第(1)項記載の
ダイボンデイング装置。 (3) 前記ダイボンデイングヘツド、ソルダ供給
ユニツト、ワーク載置台の組を一組有し、 前記吸着ノズルは、半導体素子の形態に合せて
複数組有することを特徴とする請求項第(1)項記
載のダイボンデイング装置。[Claims for Utility Model Registration] (1) A die bonding device having a suction nozzle, a die bonding head, a die bonding head control section, a solder supply unit, and a workpiece mounting table, wherein the suction nozzle The die bonding head is used to die bond the semiconductor device adsorbed by the suction nozzle onto the package surface, and the die bonding head control section arbitrarily sets die bonding conditions using the die bonding head. The solder supply unit supplies a bonding agent of arbitrary size to the package surface for bonding the semiconductor element to the package surface, and the workpiece mounting table has a temperature suitable for each semiconductor element. and an atmosphere. (2) The die bonding apparatus according to claim 1, further comprising a plurality of sets of the suction nozzle, die bonding head, solder supply unit, and workpiece mounting table. (3) The device has one set of the die bonding head, the solder supply unit, and the workpiece mounting table, and the suction nozzle has a plurality of sets according to the form of the semiconductor element. The die bonding apparatus described.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990069076U JPH0428433U (en) | 1990-06-29 | 1990-06-29 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990069076U JPH0428433U (en) | 1990-06-29 | 1990-06-29 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0428433U true JPH0428433U (en) | 1992-03-06 |
Family
ID=31604069
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1990069076U Pending JPH0428433U (en) | 1990-06-29 | 1990-06-29 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0428433U (en) |
-
1990
- 1990-06-29 JP JP1990069076U patent/JPH0428433U/ja active Pending
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