JPH0428754A - Epoxy resin composition suitable for laser printing - Google Patents
Epoxy resin composition suitable for laser printingInfo
- Publication number
- JPH0428754A JPH0428754A JP2132647A JP13264790A JPH0428754A JP H0428754 A JPH0428754 A JP H0428754A JP 2132647 A JP2132647 A JP 2132647A JP 13264790 A JP13264790 A JP 13264790A JP H0428754 A JPH0428754 A JP H0428754A
- Authority
- JP
- Japan
- Prior art keywords
- epoxy resin
- resin composition
- copper
- gluconate
- laser
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000003822 epoxy resin Substances 0.000 title claims abstract description 37
- 229920000647 polyepoxide Polymers 0.000 title claims abstract description 37
- 239000000203 mixture Substances 0.000 title claims abstract description 25
- 238000007648 laser printing Methods 0.000 title description 3
- OCUCCJIRFHNWBP-IYEMJOQQSA-L Copper gluconate Chemical compound [Cu+2].OC[C@@H](O)[C@@H](O)[C@H](O)[C@@H](O)C([O-])=O.OC[C@@H](O)[C@@H](O)[C@H](O)[C@@H](O)C([O-])=O OCUCCJIRFHNWBP-IYEMJOQQSA-L 0.000 claims abstract description 21
- 239000011642 cupric gluconate Substances 0.000 claims abstract description 14
- 235000019856 cupric gluconate Nutrition 0.000 claims abstract description 14
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 4
- 239000000945 filler Substances 0.000 claims abstract 2
- 239000002245 particle Substances 0.000 claims description 13
- 239000000843 powder Substances 0.000 abstract description 19
- 238000007639 printing Methods 0.000 abstract description 10
- 239000011342 resin composition Substances 0.000 abstract description 9
- 229920005989 resin Polymers 0.000 abstract description 6
- 239000011347 resin Substances 0.000 abstract description 6
- QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical compound [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 abstract description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 abstract description 4
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 abstract description 4
- 229910002026 crystalline silica Inorganic materials 0.000 abstract description 3
- 238000002156 mixing Methods 0.000 abstract description 3
- 235000012239 silicon dioxide Nutrition 0.000 abstract description 3
- 239000011256 inorganic filler Substances 0.000 abstract description 2
- 229910003475 inorganic filler Inorganic materials 0.000 abstract description 2
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 abstract 2
- -1 imidazole compound Chemical class 0.000 abstract 1
- 238000000576 coating method Methods 0.000 description 16
- 239000011248 coating agent Substances 0.000 description 14
- 238000000034 method Methods 0.000 description 14
- 241000270281 Coluber constrictor Species 0.000 description 4
- 229940108925 copper gluconate Drugs 0.000 description 4
- OQZCSNDVOWYALR-UHFFFAOYSA-N flurochloridone Chemical compound FC(F)(F)C1=CC=CC(N2C(C(Cl)C(CCl)C2)=O)=C1 OQZCSNDVOWYALR-UHFFFAOYSA-N 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- RGHNJXZEOKUKBD-SQOUGZDYSA-M D-gluconate Chemical compound OC[C@@H](O)[C@@H](O)[C@H](O)[C@@H](O)C([O-])=O RGHNJXZEOKUKBD-SQOUGZDYSA-M 0.000 description 2
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
- CPLXHLVBOLITMK-UHFFFAOYSA-N Magnesium oxide Chemical compound [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 238000005266 casting Methods 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 230000002542 deteriorative effect Effects 0.000 description 2
- 238000007598 dipping method Methods 0.000 description 2
- 238000002845 discoloration Methods 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 229960004887 ferric hydroxide Drugs 0.000 description 2
- 229940050410 gluconate Drugs 0.000 description 2
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 2
- 239000011810 insulating material Substances 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- IEECXTSVVFWGSE-UHFFFAOYSA-M iron(3+);oxygen(2-);hydroxide Chemical compound [OH-].[O-2].[Fe+3] IEECXTSVVFWGSE-UHFFFAOYSA-M 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000012778 molding material Substances 0.000 description 2
- 238000010298 pulverizing process Methods 0.000 description 2
- 239000007921 spray Substances 0.000 description 2
- LXBGSDVWAMZHDD-UHFFFAOYSA-N 2-methyl-1h-imidazole Chemical compound CC1=NC=CN1 LXBGSDVWAMZHDD-UHFFFAOYSA-N 0.000 description 1
- 238000012935 Averaging Methods 0.000 description 1
- 229920001342 Bakelite® Polymers 0.000 description 1
- 239000005751 Copper oxide Substances 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 150000008065 acid anhydrides Chemical class 0.000 description 1
- 125000002015 acyclic group Chemical group 0.000 description 1
- 125000001931 aliphatic group Chemical group 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 239000000378 calcium silicate Substances 0.000 description 1
- 229910052918 calcium silicate Inorganic materials 0.000 description 1
- OYACROKNLOSFPA-UHFFFAOYSA-N calcium;dioxido(oxo)silane Chemical compound [Ca+2].[O-][Si]([O-])=O OYACROKNLOSFPA-UHFFFAOYSA-N 0.000 description 1
- 239000001569 carbon dioxide Substances 0.000 description 1
- 229910002092 carbon dioxide Inorganic materials 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 229910000431 copper oxide Inorganic materials 0.000 description 1
- FPAFDBFIGPHWGO-UHFFFAOYSA-N dioxosilane;oxomagnesium;hydrate Chemical compound O.[Mg]=O.[Mg]=O.[Mg]=O.O=[Si]=O.O=[Si]=O.O=[Si]=O.O=[Si]=O FPAFDBFIGPHWGO-UHFFFAOYSA-N 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 239000005350 fused silica glass Substances 0.000 description 1
- BEBCJVAWIBVWNZ-UHFFFAOYSA-N glycinamide Chemical compound NCC(N)=O BEBCJVAWIBVWNZ-UHFFFAOYSA-N 0.000 description 1
- 239000008187 granular material Substances 0.000 description 1
- 150000002460 imidazoles Chemical class 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 238000004898 kneading Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000000395 magnesium oxide Substances 0.000 description 1
- 239000010680 novolac-type phenolic resin Substances 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 229920000768 polyamine Polymers 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 150000003512 tertiary amines Chemical class 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 229910052845 zircon Inorganic materials 0.000 description 1
- GFQYVLUOOAAOGM-UHFFFAOYSA-N zirconium(iv) silicate Chemical compound [Zr+4].[O-][Si]([O-])([O-])[O-] GFQYVLUOOAAOGM-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Thermal Transfer Or Thermal Recording In General (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、電気電子部品の絶縁被覆に用いられ、レーサ
ーの照射によりその絶縁被覆表面に鮮明な印字を施すこ
とのできるレーサー印字に適したエポキシ樹脂組成物に
関するものである。[Detailed Description of the Invention] [Field of Industrial Application] The present invention is suitable for racer printing, which is used for insulating coatings of electrical and electronic components, and is capable of making clear marks on the surface of the insulating coating by irradiation with a laser beam. The present invention relates to an epoxy resin composition.
従来、エポキシ樹脂組成物により絶縁被覆された電気電
子部品に特性や型番を明示するため印字をする際、熱硬
化性のインクや紫外線硬化性のインクか用いられている
か、工程の合理化を目的としてより短時間で印字できる
方法か要求されている。Conventionally, when printing to clearly indicate the characteristics and model number of electrical and electronic components coated with insulation using epoxy resin compositions, it has been investigated whether thermosetting ink or ultraviolet curable ink is used for the purpose of streamlining the process. There is a demand for a method that can print in a shorter time.
この対応方法の１つとして、レーザーの照射による印字
システムか注目されている。このレーサー印字システム
は、文字やパターン状にレーザーを照射された部分か熱
エネルギーにより変色する、あるいは照射された部分か
昇華し表面粗化され、光の散乱によって文字やパターン
か識別できるものであり、この方法の印字時間は０．０
１秒以下であり、従来の熱あるいは紫外線硬化性のイン
クが硬化に数分〜数ｌＯ分を必要とするのに比べ、大幅
に短縮されるものである。As one way to address this issue, a printing system using laser irradiation is attracting attention. In this racer printing system, the part of the text or pattern that is irradiated with the laser changes color due to heat energy, or the part that is irradiated sublimates and becomes roughened, and the text or pattern can be identified by the scattering of light. , the printing time of this method is 0.0
The curing time is less than 1 second, which is significantly shorter than the conventional heat or ultraviolet curable ink, which requires several minutes to several 10 minutes for curing.
しかし、従来のエポキシ樹脂組成物の絶縁被覆にレーサ
ーを照射した場合、単に被覆表面を粗化するのみて、変
色かおこらず、鮮明な文字やパターンを印字することか
できなかった。However, when a conventional insulating coating made of an epoxy resin composition is irradiated with a laser beam, the surface of the coating is simply roughened, discoloration occurs, and clear characters and patterns cannot be printed.
最近、従来のエポキシ樹脂組成物に黄色の水酸化第二鉄
を含有させるとレーサー照射によって黄色から褐色に変
色することか見い出された。（特開昭６２．−５０３６
０号公報）。Recently, it has been discovered that when a conventional epoxy resin composition contains yellow ferric hydroxide, the composition changes color from yellow to brown when exposed to laser irradiation. (Unexamined Japanese Patent Publication No. 1983-5036
Publication No. 0).
しかし、水酸化第二鉄は黄色であるため、黄、橙色のよ
うな色相にしか用いることかてきず、青や緑色の下地、
特に淡色系の下地に黒色のレーザ印字を施すことか、こ
れからの課題とされてきた。However, since ferric hydroxide is yellow, it can only be used for hues such as yellow and orange;
In particular, the ability to perform black laser printing on light-colored bases has been considered an issue for the future.
本発明は、従来不可能であった青や緑の明色からレーザ
ーにより黒色に変色する樹脂組成物を得んとして鋭意検
討した結果、グルコン酸銅（ＩＩ）を含有させるとレー
サーを照射した際淡青色から黒色に変色することを見出
し、更にこの知見に基づき種々研究を進めて本発明を完
成するに至ったものである。As a result of intensive studies in an effort to obtain a resin composition that changes color from bright blue or green to black when exposed to a laser, which was previously impossible, the present invention revealed that copper (II) gluconate can be added to the resin composition when irradiated with a laser. It was discovered that the color changes from pale blue to black, and based on this knowledge, various studies were conducted and the present invention was completed.
本発明の目的とするところは電気的特性および他の諸特
性を低下させることなく、レーサーの照射により樹脂表
面に鮮明な印字を施すことのできる硬化物を与えるエポ
キシ樹脂組成物を提供することにある。An object of the present invention is to provide an epoxy resin composition that provides a cured product that can be clearly printed on the resin surface by irradiation with a laser beam, without deteriorating the electrical properties and other various properties. be.
本発明は、グルコン酸銅（ＩＩ）を含有することを特徴
とするレーザー印字に適したエポキシ樹脂組成物に関す
るものである。The present invention relates to an epoxy resin composition suitable for laser printing, which is characterized by containing copper (II) gluconate.
本発明のエポキシ樹脂組成物にグルコン酸銅（ｎ）を用
いる理由を以下述へる。The reason for using copper (n) gluconate in the epoxy resin composition of the present invention will be described below.
グルコン酸銅（ＩＩ）は淡青色の粉末であり、加熱する
と２００〜３００°Ｃて脱炭酸し酸化銅（■）に変化し
、黒色となる。Copper (II) gluconate is a pale blue powder, and when heated, it decarboxylates at 200 to 300°C and changes to copper oxide (■), turning black.
従って、グルコン酸銅（ＩＩ）を含有したエポキシ樹脂
組成物に対し文字やパターン状にレーザーを照射すると
、樹脂表面かレーザーの熱エネルギーにより加熱され、
樹脂中に含有されたグルコン酸銅（ｎ）が上記化学反応
を生じ黒色となる。すなわちレーサーに照射された部分
のみ黒色となり、照射されない部分は淡青色のままのた
め、淡青色の下地に黒色の文字やパターンを鮮明に印字
することかできる。Therefore, when an epoxy resin composition containing copper(II) gluconate is irradiated with a laser in the form of letters or patterns, the resin surface is heated by the thermal energy of the laser.
Copper gluconate (n) contained in the resin causes the above chemical reaction and becomes black. In other words, only the area irradiated by the racer becomes black, and the area not irradiated remains pale blue, making it possible to clearly print black letters and patterns on a pale blue background.
本発明に用いられるグルコン酸銅（ＩＩ）の粒度は平均
粒径か１００μｍ以下であることか好ましい。その理由
はエポキシ樹脂組成物にグルコン酸銅（ＩＩ）を混合分
散させた際、１００μｍ以上の平均粒径ては電子電気部
品に被覆させた際表面に斑点状となり、部品の商品価値
を低下させるばかりてなく、分散か不充分となりやす（
、レーサーか照射された際、グルコン酸銅（ＩＩ）か存
在しない部分ては変色かおこらず、文字やパターンかと
ぎれ鮮明な印字かできなくなる場合かある。The particle size of copper (II) gluconate used in the present invention is preferably an average particle size of 100 μm or less. The reason for this is that when copper (II) gluconate is mixed and dispersed in an epoxy resin composition, particles with an average particle size of 100 μm or more will form spots on the surface when coated on electronic and electrical parts, reducing the commercial value of the parts. Not only that, but the dispersion is also likely to be insufficient (
When the laser is irradiated, the areas where copper(II) gluconate is not present will not change color, and letters and patterns may be cut off and clear printing may not be possible.
なお、この平均粒径はコールタ−カウンター（日科機■
製）により得られる粒度分布を重量平均することにより
求めるのか適当であるが、コールタ−カウンター以外の
測定方法により求めてもよい。Note that this average particle size is measured using a Coulter counter (Nikkaki ■).
It is appropriate to determine the particle size distribution by weight averaging the particle size distribution obtained by the following methods, but it may also be determined by a measuring method other than the Coulter counter.
グルコン酸銅（Ｉ［）の含有量としては０．５〜２０重
二％か好ましい。この理由は、含有量か０．５重量９６
以下では、レーサーか照射されても変色する度合か小さ
く鮮明な印字とならず、一方、２０重量％を越えると、
樹脂組成物の電気絶縁性か低下し電子電気部品用絶縁材
料としての本来の性能を満足しにくくなるためである。The content of copper (I[) gluconate is preferably 0.5 to 20% by weight. The reason for this is the content or 0.5 weight 96
If the amount is below 20% by weight, the print will not be clear or small due to the degree of discoloration even if the laser is irradiated.
This is because the electrical insulation properties of the resin composition deteriorate, making it difficult to satisfy the original performance as an insulating material for electronic and electrical parts.
本発明に用いられるエポキシ樹脂としては１例えばヒス
フェノールＡ型エポキシ樹脂、ヒスフェノールＦ型エポ
キン樹脂等のジグリノジルエーテル型エボキノ樹脂、フ
ェノールノホラノク型エポキシ樹脂、タレゾールノホラ
ノク型エポキノ樹脂等のノホラソク型エポキノ樹脂、グ
リノジルエステル型エボキノ樹脂、グリンジルアミン型
エポキ権
ン樹脂、線状脂肪族型エポキシ樹脂、被素環型エポキシ
樹脂、ハロゲン化エポキシ樹脂等かあげられるか、これ
らに限定されるものではない。Examples of epoxy resins used in the present invention include diglynodyl ether type epoxy resins such as hisphenol A type epoxy resin and hisphenol F type epoxy resin, phenol nophoranok type epoxy resin, and talezol noholanok type epoxy resin. Nohorasoku type epoxy resin, glinodylester type epoxy resin, glycylamine type epoxy resin, linear aliphatic type epoxy resin, acyclic epoxy resin, halogenated epoxy resin, etc. It is not limited.
本発明に用いられる硬化剤および硬化促進剤としては、
酸無水物、ポリアミン、ノボラック型フェノール樹脂、
第３級アミン、イミダゾール化合物等があるか、いずれ
を用いてもよい。又必要により公知の無機充填剤、たと
えばジルコン粉末、タルク粉末、結晶シリカ粉末、溶融
シリカ粉末、炭酸カルシウム粉末、マグネシア粉末、ケ
イ酸カルシウム粉末、水和アルミナ粉末、アルミナ粉末
等を配合してもよい。The curing agent and curing accelerator used in the present invention include:
Acid anhydride, polyamine, novolac type phenolic resin,
There are tertiary amines, imidazole compounds, etc., or any of them may be used. Further, if necessary, known inorganic fillers such as zircon powder, talc powder, crystalline silica powder, fused silica powder, calcium carbonate powder, magnesia powder, calcium silicate powder, hydrated alumina powder, alumina powder, etc. may be blended. .
本発明により得られる樹脂組成物はグルコン酸銅（ＩＩ
）の色調により通常淡青色を呈するが、赤、青、緑、黒
、白色等の顔料を併用してもよい。The resin composition obtained by the present invention has copper (II) gluconate.
), but pigments of red, blue, green, black, white, etc. may be used in combination.
本発明の樹脂組成物は注型材料等の液状、粉体塗料等の
粉状、成型材料等の顆粒状、塊状等いずれの状態でもよ
い。The resin composition of the present invention may be in any form, such as liquid as a casting material, powder as in a powder coating, granule or block as in a molding material.
本発明の樹脂組成物を製造する方法として、例えば粉体
塗料の場合をあげると、所定の割合で秤量した原料成分
をミキサーによって充分混合したのち、エキストルーダ
−、コニーダーあるいはロール等で溶融混練し、次いて
粉砕機にて粉砕する方法等かある。上記方法により得ら
れた粉体塗料により電子電気部品の絶縁被覆を行う方法
としては、流動浸漬法、静電流動浸漬法、ころかし法、
ふりかけ法、ホットスプレー法、静電スプレー法等一般
の粉体塗装方法か用いられる。As a method for manufacturing the resin composition of the present invention, for example, in the case of powder coating, raw ingredients weighed at a predetermined ratio are thoroughly mixed using a mixer, and then melt-kneaded using an extruder, co-kneader, roll, etc. Next, there is a method of pulverizing it with a pulverizer. Examples of methods for insulating coating electronic and electrical parts with the powder coating obtained by the above method include fluid dipping method, electrostatic dynamic dipping method, rolling method,
General powder coating methods such as sprinkle method, hot spray method, and electrostatic spray method are used.
又、注型材料、成型材料の場合についても公知の技術で
製造でき、絶縁材料として使用できる。In addition, casting materials and molding materials can also be manufactured using known techniques, and can be used as insulating materials.
次に本発明を実施例により更に詳しく説明する。 Next, the present invention will be explained in more detail with reference to Examples.
実施例１
ビスフェノールＡ型エポキシ樹脂
（エポキシ当量９５０） ５０重量部グ
ルコン酸銅（■）（平均粒径１５μｍ）５重量部結晶シ
リカ粉末 ５０重量部２メチルイミ
ダゾール １重量部上記組成物を配合し
、ヘンシェルミキサーでブレンドし、コニーダーにて溶
融混練した後、粉砕機で粉砕することにより平均粒径６
０〜７０μｍのエポキシ樹脂組成物の粉体塗料を得た。Example 1 Bisphenol A type epoxy resin (epoxy equivalent: 950) 50 parts by weight Copper gluconate (■) (average particle size 15 μm) 5 parts by weight Crystalline silica powder 50 parts by weight 2 Methylimidazole 1 part by weight The above composition was blended, After blending with a Henschel mixer, melt-kneading with a co-kneader, and then pulverizing with a pulverizer, the average particle size is 6.
A powder coating of an epoxy resin composition having a diameter of 0 to 70 μm was obtained.
実施例２
実施例１において、グルコン酸銅（ｆｆ）の添加量を２
０重量部に替え、他は同様にして平均粒径６０〜７０μ
ｍのエポキシ樹脂組成物の粉体塗料を得た。Example 2 In Example 1, the amount of copper gluconate (ff) added was changed to 2
0 part by weight, and the other things were the same, with an average particle size of 60 to 70μ.
A powder coating of the epoxy resin composition of m was obtained.
比較例１
実施例１において、グルコン酸銅（Ｉ［）の添加量をＯ
，１重量部に替え、他は同様にして平均粒径６０〜７０
μｍのエポキシ樹脂組成物の粉体塗料を得た。Comparative Example 1 In Example 1, the amount of copper gluconate (I[) added was
, 1 part by weight, and the other things were the same, with an average particle size of 60 to 70.
A powder coating of an epoxy resin composition of μm was obtained.
比較例２
実施例１において、グルコン酸銅（ＩＩ）の添加量を５
０重量部に替え、他は同様にして平均粒径６０〜７０μ
ｍのエポキシ樹脂組成物の粉体塗料を得た。Comparative Example 2 In Example 1, the amount of copper(II) gluconate added was 5
0 part by weight, and the other things were the same, with an average particle size of 60 to 70μ.
A powder coating of the epoxy resin composition of m was obtained.
実施例１．２及び比較例１．２の樹脂組成物について硬
化物を作製した。Cured products were produced from the resin compositions of Example 1.2 and Comparative Example 1.2.
この試料に炭酸ガスレーザー（ウシオ電機■製４００型
レーザーマーク、エネルギー密度６ Ｊｏｕｌｅ／ｃｄ
）を用いて、１００万分の１秒間所定のマスクを通して
レーザーを照射して、硬化物の表面にマーキングを施し
た。A carbon dioxide laser (400 type laser mark manufactured by Ushio Inc., energy density 6 Joule/cd) was applied to this sample.
) was used to irradiate a laser through a predetermined mask for 1/1 million seconds to mark the surface of the cured product.
また、上記硬化物の絶縁被覆電圧をＪＩＳＫ６９１１に
より測定した。結果を表−１に示す。Further, the insulation coating voltage of the cured product was measured according to JIS K6911. The results are shown in Table-1.
表
〔発明の効果〕
本発明のレーサー印字に適したエポキシ樹脂組成物を絶
縁被覆材として用いた場合、電気的特性および他の特性
を低下させることなく、レーサーの照射により樹脂表面
に鮮明な印字を施すことのできる被覆を与えることかで
きる。従って、従来より非常に短時間で印字できるため
、電気電子部品の生産工程の合理化をはかることかでき
る。Table [Effects of the Invention] When the epoxy resin composition suitable for racer printing of the present invention is used as an insulating coating material, clear printing can be made on the resin surface by laser irradiation without deteriorating electrical properties or other properties. It is possible to provide a coating that can be applied. Therefore, since printing can be performed in a much shorter time than conventionally, it is possible to rationalize the production process of electrical and electronic parts.
特許出願人 住友ベークライト株式会社住友デュレス株
式会社Patent applicant: Sumitomo Bakelite Co., Ltd. Sumitomo Dures Co., Ltd.
Claims (3)
キシ樹脂組成物において、グルコン酸銅（II）を含有す
ることを特徴とするエポキシ樹脂組成物。(1) An epoxy resin composition comprising an epoxy resin, a curing agent, a filler, etc., which is characterized by containing copper (II) gluconate.
であることを特徴とする請求項１記載のエポキシ樹脂組
成物。(2) The epoxy resin composition according to claim 1, wherein the average particle size of copper (II) gluconate is 100 μm or less.
０重量部含有することを特徴とする請求項１又は２記載
のエポキシ樹脂組成物。(3) Copper (II) gluconate to 0.5-2% of the composition
The epoxy resin composition according to claim 1 or 2, characterized in that the epoxy resin composition contains 0 parts by weight.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2132647A JP2834540B2 (en) | 1990-05-24 | 1990-05-24 | Epoxy resin composition suitable for laser printing |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2132647A JP2834540B2 (en) | 1990-05-24 | 1990-05-24 | Epoxy resin composition suitable for laser printing |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0428754A true JPH0428754A (en) | 1992-01-31 |
| JP2834540B2 JP2834540B2 (en) | 1998-12-09 |
Family
ID=15086217
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2132647A Expired - Lifetime JP2834540B2 (en) | 1990-05-24 | 1990-05-24 | Epoxy resin composition suitable for laser printing |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2834540B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008545560A (en) * | 2005-05-31 | 2008-12-18 | データレース リミテッド | Laser imaging method using malonate or aldonate |
-
1990
- 1990-05-24 JP JP2132647A patent/JP2834540B2/en not_active Expired - Lifetime
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008545560A (en) * | 2005-05-31 | 2008-12-18 | データレース リミテッド | Laser imaging method using malonate or aldonate |
| JP4827920B2 (en) * | 2005-05-31 | 2011-11-30 | データレース リミテッド | Laser imaging method using malonate or aldonate |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2834540B2 (en) | 1998-12-09 |
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