JPH04348830A - Mounting order deciding device - Google Patents

Abstract

PURPOSE:To prevent the occurrence of unevenness in a working hour of a rotary head and to decide a mounting order by causing parts to be assorted classified by a group and minimizing a distance between the parts, in a part mounting device to mount a plurality of parts to a printed board. CONSTITUTION:Chip parts 3 are assorted into small groups classified by a kind of parts by means of a first group means 17, the small groups are combined with each other to manufacture a middle group. A distance between the chip parts in the middle group is determined, and a distance exceeding a reference distance forms a loss, which is integrated by means of a loss integrating means 18. Based on a loss integrating value, each middle group is decided by a second grouping means 19 so that a loss integrating value is decreased to a minimum value. The chip parts 3 in the group are intercoupled in order of a distance therebetween from a low distance, and an optimum mounting order in which the chip parts 3 are mounted to a printed board 9 in a short time is decided.

Description

[Detailed description of the invention]

0001

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a mounting order determining device for mounting chip components and the like on a printed circuit board.

0002

[Background Art] When mounting chip components etc. on a printed circuit board, a plurality of chip components are placed on a cassette by a transport mechanism and transported one by one, and in this state, the chip components are sucked one by one by a suction nozzle and printed. It is mounted on the board. In this case, a plurality of suction nozzles are provided on the rotary head, and each chip component is mounted on the printed circuit board while being sequentially rotated and positioned.

By the way, during chip component mounting work, the transport mechanism is operated, the rotary head is rotated and positioned, and the printed circuit board is moved by the XY table. and the operating time of the XY table. Therefore, if the operating times of these transport mechanisms, rotary heads, and XY tables vary with respect to each component, the waiting time of the rotary heads and XY tables during mounting becomes longer.

0004

As described above, if the operating times of the rotary head and the XY table vary, the waiting time of the rotary head and the XY table becomes long. SUMMARY OF THE INVENTION Therefore, it is an object of the present invention to provide a mounting order determining device that can determine the optimum mounting order without causing variations in operating time of rotary heads and the like.

[0005]

[Means for Solving the Problems] The present invention provides a component mounting device for mounting a plurality of components onto a board, including a first grouping means for creating a first group for each component by type, and a first grouping means for creating a first group for each component by type. a loss calculation means for combining each of the first groups created by the means to create a second group, determining the distance between each part in these second groups, and integrating the distance exceeding a reference distance as a loss; a second grouping means for determining each second group in which the loss cumulative value is the minimum value based on the loss cumulative value obtained by the loss calculating means; This is a mounting order determining device that attempts to achieve the above object by connecting each component in the order of distance, and also includes a component connecting means that connects each second group.

[0006]

[Operation] By having such a means, each part is divided into first groups by part type by the first grouping means, and the loss calculation means combines these first groups to create a second group. The distance between each component in the first group is determined, and the distance exceeding the reference distance is accumulated as a loss. Then, the second grouping means determines each second group in which the loss cumulative value is the minimum value based on the loss cumulative value, and the component connecting means connects the components in these second groups in the order of distance, and connects these second groups.

[0007]

DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to the drawings.

FIG. 1 is a block diagram of a component mounting device to which a mounting order determining device is applied. The transport mechanism 1 includes a plurality of cassettes 2
These cassettes 2 each have a chip component 3 placed thereon. A rotary head 4 is provided adjacent to this transport mechanism 1. This rotary head 4 rotates in the direction of arrow (b) and performs position determination, and is equipped with, for example, four suction nozzles 5 to 8. These suction nozzles 5 to 8 are designed to suction and hold the component 3 and mount it at a predetermined position on the printed circuit board 9. Note that this printed circuit board 9 is placed on an XY table (not shown).

On the other hand, a mounting control circuit 10 is provided. The mounting control circuit 10 has a function of controlling the mounting of the chip components 3 by operating the transport mechanism 1, rotary head 4, and XY table according to the main flowchart shown in FIG. 2 and the mounting order determination flowchart shown in FIG. . Specifically, a main control section 11 is provided, and this main control section 11 has an output section 12.
, CAD data memory 13, parts list memory 14, ordered program memory, and work order memory 14 are connected, as well as a first grouping section 17, a loss calculation section 18,
The second grouping section 19 and the component connecting section 20 are the main control section 1
It operates in response to command 1.

Among these, the first grouping section 17 has a function of dividing each chip component 3 into small groups according to type, and the loss calculating section 18 combines each small group created by the first grouping section 17. It has a function of creating a medium group, finding the distance between each chip component within this medium group, and integrating the distance exceeding the reference distance as a loss. Further, the second grouping section 19 has a function of determining each medium group in which each loss accumulation value is the minimum value based on the loss accumulation value obtained by the loss calculation section 18, and the component connection section 20 has a function of determining each medium group in which each loss accumulation value is the minimum value. It has a function of connecting each chip component 3 in each medium group determined by the grouping unit 19 in order of distance, and also connecting each medium group. Next, the operation of the apparatus configured as described above will be explained with reference to the mounting sequence flowchart shown in FIG.

[0011] In step s1, the main control unit 11
In step D, the component coordinate data of the assembled chip component 3 is read from the data memory 13, in the next step s2, the component attribute data is read from the component list memory 14, and in step s3, the component coordinate data and the component attribute data are corresponded by the component code. Put on.

Next, in step s4, the main control section 11 issues a large grouping command to the first grouping section 17. Upon receiving this command, the first grouping unit 17 divides each chip component 3 into large groups based on the attribute data of the chip component 3, such as the weight and shape of the chip component.

Next, in step s5, the ordered program is read from the ordered program memory 15, and in the next step s6, the mounting order of each chip component 3 in each large group is determined. Next, a description will be given according to the mounting order determination flowchart shown in FIG.

First, in step f1, the first grouping unit 17 divides each chip component 3 in the large group into each small group of chip components 3 of the same type, and in the next step f2, counts the number of these small groups. do.

Next, in step s3, the loss calculation section 18
determines whether the number of small groups is an even number or an odd number, and if it is an even number, each small group is combined in step f4 to create a medium group. Note that if the number of small groups is odd, the small groups are reorganized again in step f5. Next, in step f6, the loss calculation unit 18 determines the minimum connection line connecting each chip component 3 in each medium group by a branch and bound method. At this time, the loss calculation unit 18 compares the distance of each connection line between each chip component 3 with a reference distance, and in step f7, integrates the distance exceeding the reference distance as a loss, and in step f8, calculates the loss integration. Find the values for each medium group and create a loss matrix. 4 and 5 respectively show loss matrices, that is, loss integrated values when each of the small groups a, b, c, . . . is combined. For example, in FIG. 4, the accumulated loss value for the medium group ac is "22" and the loss cumulative value for the medium group ad is "9".

Next, in step f9, the second grouping section 19 determines the middle group exhibiting the minimum accumulated loss value from the loss matrix. For example, in FIG. 4, the medium group is determined by the combination of each small group ad, and in FIG. 5, the medium group is determined by the combination of each small group ab. Next, the second grouping unit 19 removes each small group of the middle group showing the minimum accumulated loss value, combines each of the remaining small groups, calculates each accumulated loss value again, and calculates the smallest accumulated loss value among these accumulated loss values. Find the medium group of the combination of small groups. Thereafter, in the same manner, the remaining small groups are combined to obtain the accumulated loss value, and the medium group of the combination of small groups that has the minimum value among these accumulated loss values is obtained.

Next, in step f10, the component connecting portion 2
0 connects each medium group. The connections between these medium groups are the coordinates of the start and end points of each medium group and the origin (0
, 0), and connect the end point of the medium group closest to the origin and the start point of the medium group next closest to the origin. Next, the component connecting unit 16 connects the end point of the second closest medium group to the start point of the third medium group closest to the origin, and similarly connects each medium group within one large group in the order closest to the origin. Link.

Returning again to the main flowchart shown in FIG. 2, in step s7, the component connecting section 20 connects each large group. The connections between these large groups are made by comparing the coordinates of the start and end points of each large group with the origin, and connecting the end point of the medium group closest to the origin and the medium group second closest to the origin. Next, the end point of the second closest medium group and the start point of the third medium group closest to the origin are connected, and the large groups are similarly connected in the order closest to the origin. When the connection between each large group is completed, the main control section 11 stores the work order program in the work order program memory 16 in step s8.

In this way, the main control section 11 issues an operation command to the transport device 1, for mounting each chip component 3 on the printed circuit board 9 in accordance with the connection order of each chip component 3 determined as described above.
The signal is sent to the rotary head 4 and the XY table.

In this way, in the above embodiment, each chip component 3 is divided into small groups according to component type, and these small groups are combined to create medium groups,
The distance between each chip component 3 in these medium groups is calculated, and the distance exceeding the standard distance is accumulated as a loss. Based on this accumulated loss value, each medium group with the minimum accumulated loss value is determined. Since each chip component 3 in a group is connected in the order of distance, it is possible to determine the mounting order in which each chip component 3 can be mounted on the printed circuit board 9 in a short time, even when the number of chip components 3 is large. The rotary head 4 and the XY table can be installed with less waiting time.

Furthermore, since the attribute data of each chip component 3 is taken into account, the simulation can also be applied to the actual mounting work time. Furthermore, the algorithm for determining the mounting order is simple and maintenance is easy, and since the mounting order and the arrangement order of the cassettes 2 can be obtained at the same time, a more appropriate mounting order can be obtained.

It should be noted that the present invention is not limited to the above-mentioned embodiment, and may be modified without changing the gist thereof. For example, each large group may be connected using a one-point search method, and if this one-point search method is used, the connection accuracy will be further improved. Furthermore, each grouping may be performed in any manner according to the attribute data of the parts 3, or a cluster method may be applied. Furthermore, it may be operated as a support system up to the creation of NC data by linking with CAD for creating NC data of the NC control device.

[0023]

As described in detail above, according to the present invention, it is possible to provide a mounting order determining device that can determine the optimum mounting order without causing variations in operating time of rotary heads and the like.

[Brief explanation of drawings]

FIG. 1 is a configuration diagram showing an embodiment of a mounting order determining device according to the present invention.

FIG. 2 is a main flowchart of the device.

FIG. 3 is a flowchart for determining the mounting order in the same device.

FIG. 4 is a schematic diagram of medium group creation in the same device.

FIG. 5 is a schematic diagram of creating a medium group in the same device.

[Explanation of symbols]

1...Transportation mechanism, 3...Parts, 4...Rotary head, 5~
8... Suction head, 9... Printed circuit board, 10... Mounting control circuit, 11... Main control section, 12... Output section, 13... CAD data memory, 14... Parts list memory, 15... Sequenced program memory, 16... Work order program memory, 17
...first grouping section, 18...loss calculation section, 19...first grouping section, 20...component connection section.

Claims (1)

[Claims] 1. A component mounting device for mounting a plurality of components onto a board, comprising: a first grouping means for creating a first group for each type of each component; A loss calculation means that combines one group to create a second group, calculates the distance between each part in these second groups, and integrates the distance exceeding the reference distance as a loss; a second grouping means for determining each of the second groups in which the loss cumulative value is a minimum value based on the loss cumulative value; A mounting order determining device comprising a component connecting means that connects the second groups in order of distance and connects each of the second groups.