JPH0436246U - - Google Patents

Info

Publication number
JPH0436246U
JPH0436246U JP1990077541U JP7754190U JPH0436246U JP H0436246 U JPH0436246 U JP H0436246U JP 1990077541 U JP1990077541 U JP 1990077541U JP 7754190 U JP7754190 U JP 7754190U JP H0436246 U JPH0436246 U JP H0436246U
Authority
JP
Japan
Prior art keywords
shaped groove
semiconductor device
frame
groove deeper
frame width
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1990077541U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1990077541U priority Critical patent/JPH0436246U/ja
Publication of JPH0436246U publication Critical patent/JPH0436246U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/60—Seals
    • H10W76/63—Seals characterised by their shape or disposition, e.g. between cap and walls of a container

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Description

【図面の簡単な説明】
第１図はこの考案の一実施例による半導体装置
を示す断面側面図、第２図及び第３図はこの考案
の他の実施例を示す側面断面図、第４図及び第５
図は従来の半導体装置を示す断面側面図である。 図において、１は半導体チツプ、２はＢｅＯ基
板、３は放熱フイン、４はアルミナ基板、５は入
力リード、６は出力リード、７は側壁フレーム、
８はフタ、９は接着剤、１０はパツケージ、１１
はメタライズ、１２は半田、１３は金属フレーム
を示す。なお、図中、同一符号は同一、又は相当
部分を示す。

Claims (1)

    【実用新案登録請求の範囲】
  1. 側壁フレームにフレーム幅より深いＶ字型溝を
    設け、Ｖ字型溝にフレーム幅より深くはめ込まれ
    るフタを備えた半導体装置。
JP1990077541U 1990-07-20 1990-07-20 Pending JPH0436246U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1990077541U JPH0436246U (ja) 1990-07-20 1990-07-20

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1990077541U JPH0436246U (ja) 1990-07-20 1990-07-20

Publications (1)

Publication Number Publication Date
JPH0436246U true JPH0436246U (ja) 1992-03-26

Family

ID=31620026

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1990077541U Pending JPH0436246U (ja) 1990-07-20 1990-07-20

Country Status (1)

Country Link
JP (1) JPH0436246U (ja)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0573952U (ja) * 1992-03-13 1993-10-08 株式会社村田製作所 ケース型電子部品
JP2011187697A (ja) * 2010-03-09 2011-09-22 Fuji Electric Co Ltd 半導体パッケージの組立方法
WO2014010074A1 (ja) * 2012-07-13 2014-01-16 三菱電機株式会社 半導体装置

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0573952U (ja) * 1992-03-13 1993-10-08 株式会社村田製作所 ケース型電子部品
JP2011187697A (ja) * 2010-03-09 2011-09-22 Fuji Electric Co Ltd 半導体パッケージの組立方法
WO2014010074A1 (ja) * 2012-07-13 2014-01-16 三菱電機株式会社 半導体装置
US9363914B2 (en) 2012-07-13 2016-06-07 Mitubishi Electric Corporation Semiconductor device

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