JPH0436277U - - Google Patents
Info
- Publication number
- JPH0436277U JPH0436277U JP7850790U JP7850790U JPH0436277U JP H0436277 U JPH0436277 U JP H0436277U JP 7850790 U JP7850790 U JP 7850790U JP 7850790 U JP7850790 U JP 7850790U JP H0436277 U JPH0436277 U JP H0436277U
- Authority
- JP
- Japan
- Prior art keywords
- covering sheet
- prevention jig
- burnout
- laser soldering
- soldering
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims description 2
- 238000005476 soldering Methods 0.000 claims 5
- 230000002265 prevention Effects 0.000 claims 4
- 238000000034 method Methods 0.000 claims 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
第１図は本考案の一実施例を示す平面図、第２
図は第１図のＡ−Ａ′線断面図である。
１……被覆シート、２……リード、３……レー
ザ光、４……プリント基板、５……表面実装部品
、６……プリント基板上のパツド、７……はんだ
。
Fig. 1 is a plan view showing one embodiment of the present invention;
The figure is a sectional view taken along the line AA' in FIG. 1. DESCRIPTION OF SYMBOLS 1... Covering sheet, 2... Lead, 3... Laser light, 4... Printed circuit board, 5... Surface mounted component, 6... Pad on printed circuit board, 7... Solder.
Claims (1)
損防止治具であつて、 被覆シートは、はんだ付け領域以外のプリント
基板上を覆い、プリント基板に照射されるレーザ
光をしや断するものであることを特徴とするレー
ザはんだ付け用焼損防止治具。 (2) 前記被覆シートは、はんだと融合しない素
材からなるものであることを特徴とする請求項第
(1)項記載のレーザはんだ付け用焼損防止治具。 (3) 前記被覆シートは、その一部により表面実
装部品の隣接リード間を隔離するものであること
を特徴とする請求項第(1)項、第(2)項記載のレー
ザはんだ付け用焼損防止治具。[Scope of Claim for Utility Model Registration] (1) A burnout prevention jig for laser soldering having a covering sheet, the covering sheet covering the printed circuit board other than the soldering area, and preventing the laser beam irradiated onto the printed circuit board. A burnout prevention jig for laser soldering, characterized in that it is a tool for cutting. (2) The covering sheet is made of a material that does not fuse with solder.
Burnout prevention jig for laser soldering as described in (1). (3) The burnout method for laser soldering according to claim 1 or 2, wherein the covering sheet partially isolates adjacent leads of a surface mount component. Prevention jig.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7850790U JPH0436277U (en) | 1990-07-24 | 1990-07-24 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7850790U JPH0436277U (en) | 1990-07-24 | 1990-07-24 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0436277U true JPH0436277U (en) | 1992-03-26 |
Family
ID=31621842
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7850790U Pending JPH0436277U (en) | 1990-07-24 | 1990-07-24 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0436277U (en) |
-
1990
- 1990-07-24 JP JP7850790U patent/JPH0436277U/ja active Pending