JPS63197380U - - Google Patents
Info
- Publication number
- JPS63197380U JPS63197380U JP8846187U JP8846187U JPS63197380U JP S63197380 U JPS63197380 U JP S63197380U JP 8846187 U JP8846187 U JP 8846187U JP 8846187 U JP8846187 U JP 8846187U JP S63197380 U JPS63197380 U JP S63197380U
- Authority
- JP
- Japan
- Prior art keywords
- printed wiring
- wiring board
- solder
- substrate
- heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims description 4
- 238000005476 soldering Methods 0.000 claims 2
- 239000000758 substrate Substances 0.000 claims 2
- 230000001678 irradiating effect Effects 0.000 claims 1
- 230000001681 protective effect Effects 0.000 claims 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Welding Or Cutting Using Electron Beams (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
図面は本考案の実施例のプリント配線基板の一
部分を示す平面図である。
図中、１１は基板、１３は多足性部品、１５は
多足性部品の足、１７は半田部、１８，１９は保
護部材、２０は始点、２１は終点である。
The drawing is a plan view showing a portion of a printed wiring board according to an embodiment of the present invention. In the figure, 11 is a board, 13 is a multipod component, 15 is a leg of the multipod component, 17 is a solder part, 18 and 19 are protection members, 20 is a starting point, and 21 is an end point.
Claims (1)
数個の半田部１７に、多足性部品１３の各足１５
を載置して、前記複数個の半田部１７の一端近傍
の始点２０から他端近傍の終点２１まで光、熱等
を照射して連続的に半田付が行なわれるプリント
配線基板において、 前記基板１１上の前記始点２０及び終点２１に
おいて前記光、熱等の基板１１への直接照射を防
ぐための保護部材１８，１９をそれぞれ設けたこ
とを特徴とするプリント配線基板。[Claims for Utility Model Registration] Each leg 15 of the multipod component 13 is attached to a plurality of solder portions 17 arranged in parallel on the board 11 and on which solder is applied in advance.
A printed wiring board is placed on the printed wiring board, and soldering is performed continuously by irradiating light, heat, etc. from a starting point 20 near one end of the plurality of solder parts 17 to an ending point 21 near the other end of the plurality of soldering parts 17, 1. A printed wiring board characterized in that protective members 18 and 19 are provided at the starting point 20 and ending point 21 on the substrate 11, respectively, to prevent the direct irradiation of the light, heat, etc. to the substrate 11.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8846187U JPS63197380U (en) | 1987-06-08 | 1987-06-08 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8846187U JPS63197380U (en) | 1987-06-08 | 1987-06-08 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63197380U true JPS63197380U (en) | 1988-12-19 |
Family
ID=30946584
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8846187U Pending JPS63197380U (en) | 1987-06-08 | 1987-06-08 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63197380U (en) |
-
1987
- 1987-06-08 JP JP8846187U patent/JPS63197380U/ja active Pending