JPH043724Y2 - - Google Patents

Description

[Detailed explanation of the invention] (a) Industrial application field This invention relates to the tip of a soldering iron, and in particular,
This invention relates to a soldering iron tip structure suitable for soldering flat package ICs and the like.

(b) Prior Art The structure of the tip of a conventional soldering iron is, for example, as shown in the side view of the main part of FIG. 4.

The soldering iron tip 1 shown in FIG. 4 is constructed by attaching a cylindrical rod with a thinly shaved tip portion 1a attached to a heater portion 2. As shown in FIG.

(c) Problems that the invention aims to solve However, the structure of the conventional example described above does not hold the solder on the tip of the soldering iron, or sucks up excess solder from the soldered surface. The disadvantage was that it was difficult to

The purpose of this invention is to solve the above-mentioned drawbacks of the conventional soldering iron, to make it possible to hold and suck up solder at the iron tip, and to make it possible to easily solder flat package ICs and repair solder bridges. The aim is to provide structure.

(d) Means for solving the problem The soldering iron tip structure according to this invention has a tapered part formed by tilting the tip of the soldering iron tip inward, and a gap is formed between this tapered part. It is provided with a plate-shaped spring member attached to.

(e) Action A certain amount of solder melted with the soldering iron tip is poured into the gap formed between the tapered part formed at the tip of the soldering iron tip and the spring member and held there.

Next, when the tip of the iron is pressed against the part to be soldered, the spring member is pressed against the tapered part, narrowing the gap, and at the same time, the held solder is pushed out and soldering can be performed. .

When the tip of the iron is slightly removed from the soldering surface,
The pressure on the spring member is released, the spring member returns to its old position, the previously narrow gap widens, and the excess solder on the soldering surface can be absorbed into this widened gap using capillary action.

(F) Embodiment An embodiment of the soldering iron tip structure according to this invention will be described based on FIGS. 1 to 3. FIG. 1 is a perspective view of essential parts of the first embodiment, FIG. 2 is a side view of the first embodiment, and FIG. 3 is a perspective view of the second embodiment.

First, a first embodiment of this invention, shown in FIGS. 1 and 2, will be described.

In the figure, 11 is a soldering iron tip, and 11a is a tapered portion, which is formed by cutting the tip of one side surface 11a of the soldering iron tip 11 by slanting it inward. 1
Reference numeral 1c denotes a soldering surface, which is formed by cutting an inwardly inclined end portion of a side surface 11d opposite to the side surface on which the tapered portion 11a is formed.

Reference numeral 12 denotes a plate-shaped spring member which is bent into a dogleg shape, and one end 12a of which is attached to one side 11b of the soldering iron tip 11 with a screw 13.

The free end portion 12b of this spring member 12 is arranged so as to cover the tapered portion 11a while forming a slight gap with the tapered portion 11a.
The gap formed by the free end portion 12b of the spring member 12 and the tapered portion 11a is formed in a V-shape. That is, it is narrower as it approaches the attached end 12a, and wider as it approaches the tip 12c of the free end 12b. Furthermore, the tip 1 of the free end portion 12b of this spring member 12
2c is arranged to slightly protrude from the tip 11e of the soldering iron tip 11. Note that the spring member 1
2 uses a metal plate with solder and a spring effect. 2 is a heater section.

With the above configuration, when performing a soldering operation, for example, thread solder is brought into contact with the side wall surface next to the soldering iron tip 11 and melted, and a certain amount is poured into the gap. By pouring the melted solder into the gap in this way, the soldering iron tip 11 can hold a certain amount of solder. In this state, when the iron tip 11 is pressed against a predetermined soldering part, the spring member 12 is pressed in the direction of the tapered part 11a, and the gap narrows.
The solder held in the gap is removed by the spring member 1.
It is pushed out from the tip 12c of the soldering iron tip 11, wraps around from the tip 11e of the soldering iron tip 11 toward the soldering surface 11c, and adheres thereto. This pushed out leading edge part 11e
By using the solder adhered to the solder drawing surface 11c, soldering can be performed at a predetermined position.

After the above soldering, when the iron tip 11 is slightly removed from the soldering surface, the pressure of the spring member 12 that has been pressed until now is released, and it returns to its previous position due to its own restoring force, reducing the gap to the previous width. During the restoration process, excess capillary action on the solder surface can be used to suck it up into the gaps.

Further, in this embodiment, the tip 12c of the spring member 12 is arranged to slightly protrude from the tip 11e of the soldering iron tip 11.

Therefore, the extrusion operation of the solder held in the gap can be ensured, and the extruded solder can also be reliably passed around from the tip end 11e of the soldering iron tip 11 to the solder drawing surface 11c. .

FIG. 3 shows a second embodiment of this invention, in which the soldering iron tip 11A is formed into a U-shape so that two soldering surfaces can be simultaneously soldered.

The soldering iron tip structures provided on both sides of the U-shaped soldering iron tip 11A are exactly the same as those in the first embodiment shown in FIGS. 1 and 2 described above. The same parts as in the example are given the same reference numerals, and the explanation thereof will be omitted.

(g) Effects of the invention According to the soldering iron tip structure of this invention, a large amount of solder can be held in the soldering iron tip.

There is no need to supply solder every time you solder.

Excess solder on the soldering surface can be absorbed by capillary action due to the gap formed between the tapered part and the spring member.

You can easily solder even in places where the terminal pin spacing is narrow, such as on flat package ICs.

There are other effects.

[Brief explanation of the drawing]

1 to 3 show embodiments of the structure of the tip of the soldering iron according to this invention.
The figure is a perspective view of the main part, the second figure is a side view of the main part, and the third figure is a side view of the main part.
The figure is a perspective view of main parts showing another embodiment. Fourth
The figure is a side view of main parts showing a conventional example. Explanation of main drawing numbers, 11... Solder tip, 11a...
Tapered part, 11c...Soldering surface, 12...
Spring member... gap.

Claims (1)

[Claims for Utility Model Registration] (1) A tapered part formed by tilting the tip of the iron tip inward, and a plate-shaped spring member attached to form a gap between the tapered part. 1. A soldering iron tip structure, characterized in that the soldering iron tip structure is configured such that solder can be held and solder can be sucked from the soldering iron tip using a gap between the tapered part and the spring member. (2) The tip structure of a soldering iron according to claim 1, wherein the spring member is provided with its free edge slightly protruding from the tip of the soldering iron. (3) The gap between the tapered part and the spring member is
The tip structure of a soldering iron according to claim 1, which is characterized in that it is formed in a substantially V-shape that is open toward the tip of the tip.