JPH0438034U - - Google Patents
Info
- Publication number
- JPH0438034U JPH0438034U JP7966390U JP7966390U JPH0438034U JP H0438034 U JPH0438034 U JP H0438034U JP 7966390 U JP7966390 U JP 7966390U JP 7966390 U JP7966390 U JP 7966390U JP H0438034 U JPH0438034 U JP H0438034U
- Authority
- JP
- Japan
- Prior art keywords
- processing
- fan
- heat treatment
- gas
- treatment apparatus
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 6
- 238000010438 heat treatment Methods 0.000 claims description 5
- 238000003756 stirring Methods 0.000 claims 4
- 235000012431 wafers Nutrition 0.000 claims 4
- 238000010586 diagram Methods 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
Description
第１図は本考案に係る半導体ウエーハの熱処理
装置を略示的に示した断面図、第２図は同装置の
要部のみを示す平面図、第３図は同要部における
軸受部の拡大断面図、第４図はフアンに対するノ
ズルからのガス噴射状態を示す説明図、第５図は
第３図と同様の軸受部の他の実施例を示す拡大断
面図、第６図は同実施例の支持軸端部の平面図で
ある。
１……熱処理装置、２……炉体、３……ヒータ
ー、４……処理チユーブ、５……ガス供給手段、
６……チヤンネル部材、７……排気手段、８……
蓋体、９……半導体ウエーハ、１０……ウエーハ
ボート、１１……軸、１２……支持手段、１３…
…フアン、１３ａ……軸受部、１３ｂ……凹部、
１４……支持軸、１４ａ……凸部、１４ｂ……噴
出孔。
Fig. 1 is a cross-sectional view schematically showing a semiconductor wafer heat treatment apparatus according to the present invention, Fig. 2 is a plan view showing only the main parts of the apparatus, and Fig. 3 is an enlarged view of the bearing part in the main part. 4 is an explanatory diagram showing the state of gas injection from the nozzle to the fan, FIG. 5 is an enlarged sectional view showing another embodiment of the bearing section similar to that in FIG. 3, and FIG. 6 is the same embodiment. FIG. 3 is a plan view of the end of the support shaft. 1... Heat treatment device, 2... Furnace body, 3... Heater, 4... Processing tube, 5... Gas supply means,
6...Channel member, 7...Exhaust means, 8...
Lid body, 9... semiconductor wafer, 10... wafer boat, 11... shaft, 12... support means, 13...
...Fan, 13a... Bearing part, 13b... Recessed part,
14...Support shaft, 14a...Protrusion, 14b...Ejection hole.
Claims (1)
と、該処理チユーブ内に所定の処理ガスを供給す
るガス供給手段とを具備する熱処理装置であつて
、前記処理チユーブの内部に処理ガスを撹拌する
撹拌手段を設けたことを特徴とする半導体ウエー
ハの熱処理装置。 (2) 撹拌手段がフアンである請求項(1)記載の半
導体ウエーハの熱処理装置。 (3) フアンを支持する支持軸と、該フアンを回
転させるガス噴出ノズルとをガス供給手段に形成
して撹拌手段を構成する請求項(1)記載の半導体
ウエーハの熱処理装置。[Claims for Utility Model Registration] (1) A heat treatment apparatus comprising a processing tube for heat-treating semiconductor wafers and a gas supply means for supplying a predetermined processing gas into the processing tube, wherein the interior of the processing tube is 1. A heat processing apparatus for semiconductor wafers, characterized in that a stirring means for stirring a processing gas is provided. (2) The semiconductor wafer heat treatment apparatus according to claim (1), wherein the stirring means is a fan. (3) The semiconductor wafer heat treatment apparatus according to claim (1), wherein the stirring means is configured by forming the gas supply means with a support shaft that supports the fan and a gas jet nozzle that rotates the fan.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7966390U JPH0438034U (en) | 1990-07-26 | 1990-07-26 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7966390U JPH0438034U (en) | 1990-07-26 | 1990-07-26 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0438034U true JPH0438034U (en) | 1992-03-31 |
Family
ID=31624023
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7966390U Pending JPH0438034U (en) | 1990-07-26 | 1990-07-26 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0438034U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010093069A (en) * | 2008-10-08 | 2010-04-22 | Koyo Thermo System Kk | Heat treatment apparatus of substrate |
| JP2010093067A (en) * | 2008-10-08 | 2010-04-22 | Koyo Thermo System Kk | Heat treatment apparatus of substrate |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5138870A (en) * | 1974-09-27 | 1976-03-31 | Sharp Kk | HANDOTAISEIZOSOCHI |
| JPH01164024A (en) * | 1987-12-21 | 1989-06-28 | Fujitsu Ltd | Vapor phase epitaxy device |
-
1990
- 1990-07-26 JP JP7966390U patent/JPH0438034U/ja active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5138870A (en) * | 1974-09-27 | 1976-03-31 | Sharp Kk | HANDOTAISEIZOSOCHI |
| JPH01164024A (en) * | 1987-12-21 | 1989-06-28 | Fujitsu Ltd | Vapor phase epitaxy device |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010093069A (en) * | 2008-10-08 | 2010-04-22 | Koyo Thermo System Kk | Heat treatment apparatus of substrate |
| JP2010093067A (en) * | 2008-10-08 | 2010-04-22 | Koyo Thermo System Kk | Heat treatment apparatus of substrate |