JPH03120048U - - Google Patents
Info
- Publication number
- JPH03120048U JPH03120048U JP2831790U JP2831790U JPH03120048U JP H03120048 U JPH03120048 U JP H03120048U JP 2831790 U JP2831790 U JP 2831790U JP 2831790 U JP2831790 U JP 2831790U JP H03120048 U JPH03120048 U JP H03120048U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor element
- lead
- semiconductor device
- lead frame
- resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 10
- 239000011347 resin Substances 0.000 claims description 5
- 229920005989 resin Polymers 0.000 claims description 5
- 239000002184 metal Substances 0.000 claims description 2
- 238000007789 sealing Methods 0.000 claims description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Description
第１図は本考案の一実施例の樹脂封止体の一部
を破裁して示した斜視図、第２図は第１図の半導
体装置を実装基板に実装した状態を示す断面図、
第３図は従来の半導体装置の樹脂封止体の一部を
破裁して示した斜視図、第４図は第３図の半導体
装置を実装基板に実装した状態を示す断面図であ
る。
１……リードフレームのアイランド、２，３…
…リード、４……半導体素子、５……金属細線、
６……樹脂封止体、７……実装基板、５……接着
半田。
FIG. 1 is a perspective view showing a partially torn resin molded body according to an embodiment of the present invention, and FIG. 2 is a cross-sectional view showing the state in which the semiconductor device of FIG. 1 is mounted on a mounting board.
FIG. 3 is a perspective view showing a part of a resin molded body of a conventional semiconductor device cut away, and FIG. 4 is a sectional view showing a state in which the semiconductor device of FIG. 3 is mounted on a mounting board. 1... Lead frame island, 2, 3...
...Lead, 4...Semiconductor element, 5...Thin metal wire,
6... Resin sealing body, 7... Mounting board, 5... Adhesive solder.
Claims (1)
載し前記リードフレームのリードと前記半導体素
子の電極との間を金属細線により接続し樹脂封止
してなる半導体装置において、前記樹脂封止体か
ら外部に引出されている外部リードの先端部がほ
ぼ直角に下方に曲げられていることを特徴とする
半導体装置。 In a semiconductor device in which a semiconductor element is mounted on an island of a lead frame, the lead of the lead frame and the electrode of the semiconductor element are connected by thin metal wires, and the semiconductor element is sealed with resin, the semiconductor element is pulled out from the resin sealing body. A semiconductor device characterized in that a tip of an external lead is bent downward at a substantially right angle.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2831790U JPH03120048U (en) | 1990-03-19 | 1990-03-19 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2831790U JPH03120048U (en) | 1990-03-19 | 1990-03-19 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03120048U true JPH03120048U (en) | 1991-12-10 |
Family
ID=31531125
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2831790U Pending JPH03120048U (en) | 1990-03-19 | 1990-03-19 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03120048U (en) |
-
1990
- 1990-03-19 JP JP2831790U patent/JPH03120048U/ja active Pending