JPH0289849U - - Google Patents
Info
- Publication number
- JPH0289849U JPH0289849U JP16950788U JP16950788U JPH0289849U JP H0289849 U JPH0289849 U JP H0289849U JP 16950788 U JP16950788 U JP 16950788U JP 16950788 U JP16950788 U JP 16950788U JP H0289849 U JPH0289849 U JP H0289849U
- Authority
- JP
- Japan
- Prior art keywords
- chip
- lead frame
- leads
- tips
- supporting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000010586 diagram Methods 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
Landscapes
- Lead Frames For Integrated Circuits (AREA)
- Wire Bonding (AREA)
Description
第１図〜第３図は本考案に係るＩＣチツプ用リ
ードフレームの実施例を示す図で、第１図はリー
ドフレームの図、第２図はリードフレームにＩＣ
チツプを固定した図、第３図はレジンモールドを
した図、第４図、第５図は従来のＩＣチツプ用リ
ードフレームを示す図、第４図はリードフレーム
の図、第５図はレジンモールドをした図である。
１，１１……タブ、２，１２……タブリード、
３，１３……リード、４，１４……ＩＣチツプ、
５，１５……電極、６，１６……ワイヤ、７，１
７……レジン、１９……枠、２０……リードフレ
ーム。
1 to 3 are diagrams showing an embodiment of the lead frame for IC chips according to the present invention. FIG. 1 is a diagram of the lead frame, and FIG.
Figure 3 shows a fixed chip, Figure 3 shows a resin mold, Figures 4 and 5 show a conventional IC chip lead frame, Figure 4 shows a lead frame, and Figure 5 shows a resin mold. This is a diagram with 1,11...Tab, 2,12...Tab lead,
3,13...Lead, 4,14...IC chip,
5,15...electrode, 6,16...wire, 7,1
7...Resin, 19...Frame, 20...Lead frame.
Claims (1)
プに先端が近接して設けられたボンデイングワイ
ヤ接続用の複数のリードとを有し、該複数のリー
ドの各先端を結ぶ線が略台形状に形成されてなる
構成のＩＣチツプ用リードフレーム。 It has a rectangular tab for supporting an IC chip, and a plurality of leads for connecting bonding wires whose tips are provided close to the chip, and the lines connecting the tips of the plurality of leads are approximately trapezoidal. A lead frame for an IC chip having a structure formed by forming a lead frame.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16950788U JPH0289849U (en) | 1988-12-28 | 1988-12-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16950788U JPH0289849U (en) | 1988-12-28 | 1988-12-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0289849U true JPH0289849U (en) | 1990-07-17 |
Family
ID=31459631
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16950788U Pending JPH0289849U (en) | 1988-12-28 | 1988-12-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0289849U (en) |
-
1988
- 1988-12-28 JP JP16950788U patent/JPH0289849U/ja active Pending
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