JPH0441931B2 - - Google Patents
Info
- Publication number
- JPH0441931B2 JPH0441931B2 JP60175652A JP17565285A JPH0441931B2 JP H0441931 B2 JPH0441931 B2 JP H0441931B2 JP 60175652 A JP60175652 A JP 60175652A JP 17565285 A JP17565285 A JP 17565285A JP H0441931 B2 JPH0441931 B2 JP H0441931B2
- Authority
- JP
- Japan
- Prior art keywords
- resistor
- temperature
- heat insulating
- air flow
- heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000012528 membrane Substances 0.000 claims description 19
- 238000010438 heat treatment Methods 0.000 claims description 18
- 239000000758 substrate Substances 0.000 claims description 12
- 230000017525 heat dissipation Effects 0.000 claims description 2
- 230000000694 effects Effects 0.000 description 17
- 230000001419 dependent effect Effects 0.000 description 16
- 230000007423 decrease Effects 0.000 description 7
- 238000011144 upstream manufacturing Methods 0.000 description 7
- 238000002485 combustion reaction Methods 0.000 description 5
- 229910015365 Au—Si Inorganic materials 0.000 description 3
- 239000007767 bonding agent Substances 0.000 description 3
- 230000005496 eutectics Effects 0.000 description 3
- 230000020169 heat generation Effects 0.000 description 3
- 238000009413 insulation Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 230000004044 response Effects 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- KZHJGOXRZJKJNY-UHFFFAOYSA-N dioxosilane;oxo(oxoalumanyloxy)alumane Chemical compound O=[Si]=O.O=[Si]=O.O=[Al]O[Al]=O.O=[Al]O[Al]=O.O=[Al]O[Al]=O KZHJGOXRZJKJNY-UHFFFAOYSA-N 0.000 description 2
- 238000007772 electroless plating Methods 0.000 description 2
- 239000000446 fuel Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 229910052863 mullite Inorganic materials 0.000 description 2
- 230000004043 responsiveness Effects 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910020220 Pb—Sn Inorganic materials 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
Landscapes
- Measuring Volume Flow (AREA)
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は膜式抵抗を有する直熱型流量センサ、
たとえば内燃機関の吸入空気量を検出するための
空気流量センサに関する。[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a direct heating type flow sensor having a membrane resistor,
For example, the present invention relates to an air flow sensor for detecting the intake air amount of an internal combustion engine.
一般に、電子制御式内燃機関においては、基本
燃料噴射量、基本点火時期等の制御のために機関
の吸入空気量は重要な運転状態パラメータの１つ
である。従来、このような吸入空気量を検出する
ための空気流量センサ（エアフローメータとも言
う）はベーン式のものが主流であつたが、最近、
小型、応答性が良い等の利点を有する温度依存抵
抗を用いた熱式のものが実用化されている。
Generally, in an electronically controlled internal combustion engine, the intake air amount of the engine is one of the important operating state parameters for controlling the basic fuel injection amount, basic ignition timing, and the like. Conventionally, vane-type air flow sensors (also called air flow meters) have been the mainstream for detecting the amount of intake air, but recently,
A thermal type using a temperature-dependent resistor has been put into practical use, and has advantages such as small size and good response.
さらに、温度依存抵抗を有する空気流量センサ
としては、傍熱型と直熱型とがある。たとえば、
傍熱型の空気流量センサは、機関の吸気通路に設
けられた発熱抵抗、およびその上流、下流側に設
けられた２つの温度依存抵抗を備えている。この
場合、上流側の温度依存抵抗は発熱抵抗による加
熱前の空気流の温度を検出するものであり、つま
り、外気温度補償用であり、また、下流側の温度
依存抵抗は加熱抵抗によつて加熱された空気流の
温度を検出する。これにより、下流側の温度依存
抵抗と上流側の温度依存抵抗との温度差が一定に
なるように発熱抵抗の電流値をフイードバツク制
御し、発熱抵抗に印加される電圧により空気流量
（質量）を検出するものである。なお、上流側の
外気温度補償用温度依存抵抗を削除し、下流側の
温度依存抵抗の温度が一定になるように発熱抵抗
を制御すると、体積容量としての空気流量が検出
できる（参照：特公昭54−9662号広報）。他方、
傍熱型に比べて応答速度が早い直熱型の空気流量
センサは、機関の吸気通路に設けられた温度検出
兼用の発熱抵抗、およびその上流側に設けられた
温度依存抵抗を備えている。この場合、傍熱型と
同様に、上流側の温度依存抵抗は発熱抵抗による
加熱前の空気流の温度を検出するものであり、つ
まり、外気温度補償用である。これにより、発熱
抵抗とその上流側の温度依存抵抗との温度差が一
定になるように発熱抵抗の電流値をフイードバツ
ク制御し、発熱抵抗に印加される電圧により空気
流量（質量）を検出するものである。なお、この
場合にも、外気温度補償用温度依存抵抗を削除
し、発熱抵抗の温度が一定になるように発熱抵抗
を制御すると、体積容量としての空気流量が検出
できる。 Furthermore, there are two types of air flow rate sensors having temperature-dependent resistance: indirect heating type and direct heating type. for example,
The indirectly heated air flow sensor includes a heat generating resistor provided in the intake passage of the engine, and two temperature dependent resistors provided upstream and downstream thereof. In this case, the temperature-dependent resistance on the upstream side detects the temperature of the air flow before heating by the heating resistor, that is, it is for outdoor temperature compensation, and the temperature-dependent resistance on the downstream side detects the temperature of the air flow before heating by the heating resistor. Detects the temperature of the heated air stream. As a result, the current value of the heating resistor is feedback-controlled so that the temperature difference between the temperature-dependent resistance on the downstream side and the temperature-dependent resistance on the upstream side is constant, and the air flow rate (mass) is controlled by the voltage applied to the heating resistor. It is something to detect. Note that if you delete the temperature-dependent resistance for outdoor temperature compensation on the upstream side and control the heating resistor so that the temperature of the temperature-dependent resistance on the downstream side remains constant, the air flow rate as a volumetric capacity can be detected (reference: 54-9662 Public Relations). On the other hand,
A directly heated air flow sensor, which has a faster response speed than an indirectly heated type, includes a heat generating resistor that is provided in the intake passage of the engine and also serves as temperature detection, and a temperature dependent resistor that is provided upstream of the heat generating resistor. In this case, similarly to the indirect heating type, the upstream temperature-dependent resistance detects the temperature of the air flow before being heated by the heating resistor, that is, it is used to compensate for the outside air temperature. This allows feedback control of the current value of the heating resistor so that the temperature difference between the heating resistor and the temperature-dependent resistor upstream thereof remains constant, and detects the air flow rate (mass) based on the voltage applied to the heating resistor. It is. In this case as well, if the temperature-dependent resistance for compensating the outside air temperature is deleted and the heating resistor is controlled so that the temperature of the heating resistor is constant, the air flow rate as a volumetric capacity can be detected.
通常、発熱抵抗（膜式抵抗）の発熱温度と吸入
空気温度との差を一定値にするあるいは膜式抵抗
の発熱温度を一定にする空気流量センサの応答
性、ダイナミツクレンジは膜式抵抗を含む発熱部
兼温度検知部の熱容量（ヒートマス）と断熱効果
の程度で決定される。すなわち、最も応答性がよ
く、且つダイナミツクレンジを最も大きくするた
めには、膜式抵抗を含む発熱部兼温度検知部の質
量をできる限り小さくし、また、その部分を理想
的には完全に空気流中に浮かんだ状態にすること
である。このため、通常、膜式抵抗が形成された
基板を断熱部材を介して放熱特性の優れた保持部
材に支持し、このとき、基板と断熱部材との間、
および断熱部材と保持部材との間も断熱効果を有
する接合剤によつて接合せしめている。たとえ
ば、断熱効果を有する接合剤として、樹脂系の接
着剤、熱伝導率の小さいフリツトガラス等を用い
ている。これにより、基板の断熱効果をさらに増
進させていた。 Normally, the responsiveness of an air flow sensor that keeps the difference between the heat generation temperature of a heat generation resistor (film type resistor) and the intake air temperature constant, or the heat generation temperature of a membrane type resistor, and the dynamic range uses a membrane type resistor. It is determined by the heat capacity (heat mass) of the heat generating part/temperature sensing part and the degree of insulation effect. In other words, in order to achieve the best response and the largest dynamic range, the mass of the heat generating part and temperature sensing part including the film resistor should be made as small as possible, and ideally that part should be completely removed. The idea is to make it float in the airflow. For this reason, the substrate on which the film resistor is formed is usually supported on a holding member with excellent heat dissipation properties via a heat insulating member, and at this time, between the board and the heat insulating member,
The heat insulating member and the holding member are also bonded together using a bonding agent having a heat insulating effect. For example, resin-based adhesives, fritted glass with low thermal conductivity, and the like are used as bonding agents that have a heat-insulating effect. This further enhances the heat insulation effect of the board.
しかしながら、上述の従来形においては、接合
剤が断熱効果を有するために、その厚み、状態等
の製造ばらつきにより断熱効果がばらつき、この
効果、センサの応答性、ダイナミツクレンジ等の
特性が変化するという問題点がある。
However, in the conventional type described above, since the bonding agent has a heat insulating effect, the heat insulating effect varies due to manufacturing variations in its thickness, condition, etc., and this effect, sensor responsiveness, dynamic range, etc. characteristics change. There is a problem.
本発明の目的は、接合部材の製造ばらつきによ
つてセンサの出力特性が変化しない直熱式流量セ
ンサを提供することにあり、その手段は、接合部
材として熱伝導率の優れた部材を用いたことであ
る。
An object of the present invention is to provide a directly heated flow rate sensor in which the output characteristics of the sensor do not change due to manufacturing variations in the joining members. That's true.
上述の手段によれば接合部材は断熱効果を有し
ないので、断熱部材のみにより断熱効果が決定さ
れ、従つて、基板に対する断熱効果が一様とな
る。
According to the above-mentioned means, since the bonding member does not have a heat insulating effect, the heat insulating effect is determined only by the heat insulating member, and therefore, the heat insulating effect on the substrate becomes uniform.
以下、図面により本発明の実施例を説明する。 Embodiments of the present invention will be described below with reference to the drawings.
第２図は本発明に係る膜式抵抗を有する直熱型
空気流量センサが適用された内燃機関を示す全体
概要図である。第２図において、内燃機関１の吸
気通路２にはエアクリーナ３および整流格子４を
介して空気が吸入される。この空気通路２内に保
持部材（たとえばアルミニウム）５が設けられ、
そこに空気流量を計測するための発熱ヒータ兼用
温度依存抵抗（膜式抵抗）６が設けられている。
膜式抵抗６はフレキシブル配線７によつて、外気
温度補償を行う温度依存抵抗８と共に、ハイブリ
ツド基板に形成されたセンサ回路９に接続されて
いる。 FIG. 2 is an overall schematic diagram showing an internal combustion engine to which a directly heated air flow sensor having a membrane resistor according to the present invention is applied. In FIG. 2, air is taken into an intake passage 2 of an internal combustion engine 1 via an air cleaner 3 and a rectifying grid 4. As shown in FIG. A holding member (for example, aluminum) 5 is provided in this air passage 2,
A temperature dependent resistor (film type resistor) 6 which also functions as a heat generating heater is provided therein for measuring the air flow rate.
The film resistor 6 is connected by a flexible wiring 7 to a sensor circuit 9 formed on a hybrid substrate, together with a temperature-dependent resistor 8 for compensating for outside temperature.
センサ回路９は外気温度に対して膜式抵抗６の
温度が一定になるように該抵抗６の発熱量をフイ
ードバツク制御し、そのセンサ出力Vpを制御回
路１０に供給する。制御回路１０はたとえばマイ
クロコンピユータによつて構成され、燃料噴射弁
１１の制御等を行うものである。 The sensor circuit 9 performs feedback control on the amount of heat generated by the film resistor 6 so that the temperature of the film resistor 6 is constant with respect to the outside air temperature, and supplies the sensor output V p to the control circuit 10 . The control circuit 10 is composed of, for example, a microcomputer, and controls the fuel injection valve 11 and the like.
センサ回路９は、第３図に示すごとく、膜式抵
抗６、温度依存抵抗８とブリツジ回路を構成する
抵抗９１，９２、比較器９３、比較器９３の出力
によつて制御されるトランジスタ９４、電圧バツ
フア９５により構成される、つまり、空気流量が
増加して膜式抵抗６（この場合、サーミスタ）の
温度が低下し、この結果、膜式抵抗６の抵抗値が
下降してV1≦VRとなると、比較器９３の出力に
よつてトランジスタ９４の導電率が増加する。従
つて、膜式抵抗６の発熱量が増加し、同時に、ト
ランジスタ９４のコレクタ電位すなわち電圧バツ
フア９５の出力電圧Vpは上昇する。逆に空気流
量が減少して膜式抵抗６の温度が上昇すると、膜
式抵抗６の抵抗値が増加してV1＞VRとなり、比
較器９３の出力によつてトランジスタ９４の導電
率が減少する。従つて、膜式抵抗６の発熱量が減
少し、同時に、電圧バツフア９５の出力電圧Vp
は低下する。このようにして膜式抵抗６の温度は
外気温度によつて定まる値になるようにフイード
バツク制御され、出力電圧Voは空気流量を示す
ことになる。 As shown in FIG. 3, the sensor circuit 9 includes a film resistor 6, a temperature-dependent resistor 8, resistors 91 and 92 forming a bridge circuit, a comparator 93, a transistor 94 controlled by the output of the comparator 93, In other words, the air flow rate increases and the temperature of the membrane resistor 6 (thermistor in this case) decreases, and as a result, the resistance value of the membrane resistor 6 decreases so that V 1 ≦V. When R , the output of comparator 93 increases the conductivity of transistor 94. Therefore, the amount of heat generated by the film resistor 6 increases, and at the same time, the collector potential of the transistor 94, that is, the output voltage Vp of the voltage buffer 95 increases. Conversely, when the air flow rate decreases and the temperature of the membrane resistor 6 rises, the resistance value of the membrane resistor 6 increases and becomes V 1 >V R , and the conductivity of the transistor 94 increases according to the output of the comparator 93. Decrease. Therefore, the amount of heat generated by the membrane resistor 6 decreases, and at the same time, the output voltage V p of the voltage buffer 95 decreases.
decreases. In this way, the temperature of the membrane resistor 6 is feedback-controlled to a value determined by the outside air temperature, and the output voltage Vo indicates the air flow rate.
第４図は第２図の膜式抵抗６の近傍の拡大図、
第５図は第４図の−線断面図である。第４
図、第５図に示すように、膜式抵抗６において
は、その一端のみが断熱部材１２を介して保持部
材５に支持されている。なお、膜式抵抗６を両持
保持により保持部材６に固定すると、膜式抵抗６
が歪ゲージの作用し、従つて、膜式抵抗６の歪み
によりその出力変化を招くという欠点が生ずる。
上述の膜式抵抗６の片持保持はこのような歪ゲー
ジ作用を防止するものである。 Figure 4 is an enlarged view of the vicinity of the membrane resistor 6 in Figure 2;
FIG. 5 is a sectional view taken along the line -- in FIG. 4. Fourth
As shown in FIG. 5, only one end of the membrane resistor 6 is supported by the holding member 5 via the heat insulating member 12. As shown in FIG. Note that when the membrane resistor 6 is fixed to the holding member 6 by holding both sides, the membrane resistor 6
This has the disadvantage that the film resistor 6 acts as a strain gauge, and therefore the distortion of the membrane resistor 6 causes a change in its output.
The above-mentioned cantilever holding of the membrane resistor 6 prevents such a strain gauge effect.
また、フレキシブル配線７はフレキシブルな絶
縁樹脂フイルムに挟まれ、パターン形成された導
体（たとえばCu）により構成されており、ボン
デイングワイヤに比較して、腐食、断線等に強い
構造をなしている。 Further, the flexible wiring 7 is sandwiched between flexible insulating resin films and is made of a patterned conductor (for example, Cu), and has a structure that is more resistant to corrosion and disconnection than bonding wires.
第１図は第５図の断熱部材１２の近傍の構造を
示す断面図である。第１図に示すように、断熱部
材１２（たとえばムライト）と基板６（たとえば
シリコン基板）との間には、接合部材１３として
のAu焼付層１３−１およびAu−Si共晶層１３−
２が形成されている。つまり、断熱部材１２の一
面に予めAu焼付層１３−１を形成しておき、こ
れを基板６に適度な加圧により押圧し、約400℃
にて加熱すると、これらの界面にAu−Si共晶層
１３−２が生成され、基板６と断熱部材１２とが
接合される。 FIG. 1 is a sectional view showing the structure near the heat insulating member 12 of FIG. 5. FIG. As shown in FIG. 1, between the heat insulating member 12 (for example, mullite) and the substrate 6 (for example, silicon substrate), there is an Au baked layer 13-1 as a bonding member 13 and an Au-Si eutectic layer 13-1.
2 is formed. In other words, the Au baked layer 13-1 is formed on one surface of the heat insulating member 12 in advance, and this is pressed onto the substrate 6 with moderate pressure, and heated to approximately 400°C.
When heated, an Au-Si eutectic layer 13-2 is generated at these interfaces, and the substrate 6 and the heat insulating member 12 are joined.
他方、断熱部材１２と保持部材５（たとえばア
ルミニウムあるいは銅）との間には、接合部材１
４としての無電解メツキ層１４−１およびPb−
Snハンダ層１４−２が形成されている。つまり、
断熱部材１３の他の面に予め無電解メツキ層１４
−１を形成しておき、これをPb−Snハンダ層１
４−２により保持部材５と接合させる。 On the other hand, there is a bonding member 1 between the heat insulating member 12 and the holding member 5 (for example, aluminum or copper).
Electroless plating layer 14-1 and Pb-
A Sn solder layer 14-2 is formed. In other words,
An electroless plating layer 14 is previously applied to the other surface of the heat insulating member 13.
-1 is formed, and this is connected to the Pb-Sn solder layer 1.
It is joined to the holding member 5 by 4-2.
このように構成すると、接合部材１３，１４は
共に熱伝導性に優れており、他方、断熱部材１２
は熱伝導性が悪いので、基板６に対する断熱効果
は断熱部材１２に依存することになる。従つて、
たとえ接合部材１３，１４の厚み、状態が変化し
ても、基板６に対する断熱効果は何ら影響はな
い。 With this configuration, both the joining members 13 and 14 have excellent thermal conductivity, and on the other hand, the heat insulating member 12
has poor thermal conductivity, so the heat insulating effect on the substrate 6 depends on the heat insulating member 12. Therefore,
Even if the thickness and condition of the bonding members 13 and 14 change, the heat insulating effect on the substrate 6 will not be affected at all.
なお、断熱部材としては、ムライトの外に、セ
ラミツク系、ガラス系の材料、ポリイミド等の樹
脂系材料を用いることもできる。 In addition to mullite, ceramic-based materials, glass-based materials, and resin-based materials such as polyimide can also be used as the heat insulating member.
以上説明したように本発明によれば、接合部材
は断熱効果を有しないので、基板に対する断熱効
果は断熱部材のみに依存するようになり、従つ
て、接合部材の製造ばらつきによるセンサの応答
性、ダイナミツクレンジ等の特性変化を防止でき
る。
As explained above, according to the present invention, since the bonding member does not have a heat insulating effect, the heat insulating effect on the substrate depends only on the heat insulating member. It can prevent characteristic changes such as dynamic cleansing.
第１図は本発明に係る直熱型流量センサの断熱
部材の近傍を示す断面図、第２図は本発明に係る
膜式抵抗を有する直熱型空気流量センサが適用さ
れた内燃機関を示す全体概要図、第３図は第２図
のセンサ回路の回路図、第４図は第２図の膜式抵
抗の近傍の拡大図、第５図は第４図の−線断
面図である。
５……保持部材、６……膜式抵抗、７……フレ
キシブル配線、１２……断熱部材、１３……接合
部材、１３−１……Auペースト焼付層、１３−
１……Au−Si共晶層、１４……接合部材、１４
−１……無電解Niメツキ層、１４−２……Pb−
Snハンダ層。
FIG. 1 is a sectional view showing the vicinity of a heat insulating member of a directly heated flow rate sensor according to the present invention, and FIG. 2 shows an internal combustion engine to which the directly heated air flow rate sensor having a membrane resistor according to the present invention is applied. 3 is a circuit diagram of the sensor circuit shown in FIG. 2, FIG. 4 is an enlarged view of the vicinity of the membrane resistor shown in FIG. 2, and FIG. 5 is a sectional view taken along the line -- in FIG. 4. 5... Holding member, 6... Film resistor, 7... Flexible wiring, 12... Heat insulation member, 13... Joining member, 13-1... Au paste baked layer, 13-
1...Au-Si eutectic layer, 14...Joining member, 14
-1... Electroless Ni plating layer, 14-2... Pb-
Sn solder layer.
Claims (1)
て放熱特性の優れた保持部材に支持するようにし
た直熱型流量センサにおいて、前記基板と前記断
熱部材との間、および該断熱部材と前記保持部材
との間を熱伝導率の優れた結合部材により接合せ
しめたことを特徴とする直熱型流量センサ。1. In a direct heating type flow sensor in which a substrate on which a membrane resistor is formed is supported on a holding member with excellent heat dissipation properties via a heat insulating member, there is no space between the substrate and the heat insulating member, and between the heat insulating member and A directly heated flow rate sensor, characterized in that the holding member is connected to the holding member by a connecting member having excellent thermal conductivity.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60175652A JPS6236521A (en) | 1985-08-12 | 1985-08-12 | Direct-heating type flow-rate sensor |
| US06/894,895 US4756190A (en) | 1985-08-09 | 1986-08-08 | Direct-heated flow measuring apparatus having uniform characteristics |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60175652A JPS6236521A (en) | 1985-08-12 | 1985-08-12 | Direct-heating type flow-rate sensor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6236521A JPS6236521A (en) | 1987-02-17 |
| JPH0441931B2 true JPH0441931B2 (en) | 1992-07-09 |
Family
ID=15999839
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP60175652A Granted JPS6236521A (en) | 1985-08-09 | 1985-08-12 | Direct-heating type flow-rate sensor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6236521A (en) |
-
1985
- 1985-08-12 JP JP60175652A patent/JPS6236521A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6236521A (en) | 1987-02-17 |
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