JPH0443459U - - Google Patents

Info

Publication number
JPH0443459U
JPH0443459U JP8345890U JP8345890U JPH0443459U JP H0443459 U JPH0443459 U JP H0443459U JP 8345890 U JP8345890 U JP 8345890U JP 8345890 U JP8345890 U JP 8345890U JP H0443459 U JPH0443459 U JP H0443459U
Authority
JP
Japan
Prior art keywords
circuit board
printed circuit
molten solder
channels
nozzle
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP8345890U
Other languages
Japanese (ja)
Other versions
JPH0811077Y2 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1990083458U priority Critical patent/JPH0811077Y2/en
Publication of JPH0443459U publication Critical patent/JPH0443459U/ja
Application granted granted Critical
Publication of JPH0811077Y2 publication Critical patent/JPH0811077Y2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Molten Solder (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図および第２図は本考案の一実施例を示す
もので共にはんだ槽を示す部分側断面図である。 ３……プリント基板、４……１次ノズル、４ａ
……第１の噴出し口、４ｂ……第２の噴出し口、
５……２次ノズル、７……第１の流路、８……第
２の流路、１０……ダンパー、２０……電子部品
。 FIGS. 1 and 2 show an embodiment of the present invention, and both are partial side sectional views showing a solder bath. 3...Printed circuit board, 4...Primary nozzle, 4a
...first spout, 4b...second spout,
5... Secondary nozzle, 7... First channel, 8... Second channel, 10... Damper, 20... Electronic component.

Claims (1)

【実用新案登録請求の範囲】 溶融はんだを噴流する１次ノズルおよび２次ノ
ズルがはんだ付けすべきプリント基板の搬送方向
に沿つて順次配設され、前記プリント基板を前記
１次ノズルおよび前記２次ノズルより噴流された
溶融はんだ上を順次接触通過させることによつて
前記プリント基板に付設された電子部品を該プリ
ント基板にはんだ付けするよう構成された噴流式
はんだ付け装置において、 前記１次ノズルの内部を少なくとも先端部にお
いて前記プリント基板の搬送方向に対して２つの
流路に分け、これら双方の流路の先端にそれぞれ
噴出し口を形成すると共に、前記各流路の少なく
とも一方に該流路を流れる溶融はんだの流量を調
整するためのダンパーを設けたことを特徴とする
噴流式はんだ付け装置。[Claims for Utility Model Registration] A primary nozzle and a secondary nozzle that jet molten solder are arranged in sequence along the conveying direction of a printed circuit board to be soldered, and the printed circuit board is In a jet soldering apparatus configured to solder electronic components attached to the printed circuit board to the printed circuit board by successively contacting and passing over molten solder jetted from a nozzle, the primary nozzle comprises: The interior is divided into two channels in the conveying direction of the printed circuit board at least at the tip, and a jetting port is formed at the tip of each of these channels, and at least one of the channels is provided with a flow channel. A jet soldering device characterized by being provided with a damper for adjusting the flow rate of molten solder flowing through the molten solder.
JP1990083458U 1990-08-07 1990-08-07 Jet soldering equipment Expired - Lifetime JPH0811077Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1990083458U JPH0811077Y2 (en) 1990-08-07 1990-08-07 Jet soldering equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1990083458U JPH0811077Y2 (en) 1990-08-07 1990-08-07 Jet soldering equipment

Publications (2)

Publication Number Publication Date
JPH0443459U true JPH0443459U (en) 1992-04-13
JPH0811077Y2 JPH0811077Y2 (en) 1996-03-29

Family

ID=31631148

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1990083458U Expired - Lifetime JPH0811077Y2 (en) 1990-08-07 1990-08-07 Jet soldering equipment

Country Status (1)

Country Link
JP (1) JPH0811077Y2 (en)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61289965A (en) * 1985-06-17 1986-12-19 Meisho Kk Jet type solder tank
JPS63199065A (en) * 1987-02-12 1988-08-17 Kenji Kondo Jet solder tank

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61289965A (en) * 1985-06-17 1986-12-19 Meisho Kk Jet type solder tank
JPS63199065A (en) * 1987-02-12 1988-08-17 Kenji Kondo Jet solder tank

Also Published As

Publication number Publication date
JPH0811077Y2 (en) 1996-03-29

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