JPH0447959Y2 - - Google Patents
Info
- Publication number
- JPH0447959Y2 JPH0447959Y2 JP1985199406U JP19940685U JPH0447959Y2 JP H0447959 Y2 JPH0447959 Y2 JP H0447959Y2 JP 1985199406 U JP1985199406 U JP 1985199406U JP 19940685 U JP19940685 U JP 19940685U JP H0447959 Y2 JPH0447959 Y2 JP H0447959Y2
- Authority
- JP
- Japan
- Prior art keywords
- ring
- vacuum
- high frequency
- elastic body
- microwave
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Drying Of Semiconductors (AREA)
Description
【考案の詳細な説明】
〔考案の利用分野〕
本考案は半導体製造装置に関するもので、マイ
クロ波あるいは高周波による電場を与える真空容
器に好適なものである。[Detailed Description of the Invention] [Field of Application of the Invention] The present invention relates to a semiconductor manufacturing device, and is suitable for a vacuum container that applies an electric field using microwaves or high frequency waves.
従来のエツチング装置における真空容器は真空
保持用Ｏリングが使用されているが、マイクロ波
あるいは高周波が印加される場合は容器外へこれ
らがリークする恐れがあり、人体への害が心配さ
れている。なお、この種の装置として関連するも
のには、例えば、特開昭59−125628号、特公昭58
−12340号等が挙げられる。
The vacuum container in conventional etching equipment uses an O-ring to maintain the vacuum, but when microwaves or high frequencies are applied, there is a risk that these may leak out of the container, and there are concerns about harm to the human body. . In addition, related devices of this type include, for example, Japanese Patent Application Laid-Open No. 125628/1982, Japanese Patent Publication No. 58
-12340 etc.
本考案の目的は、真空容器内の真空を保持しか
つマイクロ波あるいは高周波のリークを防止する
ことのできる半導体製造装置を提供することにあ
る。
An object of the present invention is to provide a semiconductor manufacturing apparatus that can maintain a vacuum in a vacuum container and prevent leakage of microwaves or high frequency waves.
本考案は、真空容器のシール部の同一シール面
部に、真空保持用Ｏリングおよび該Ｏリングとは
別の導電性を有するリング状の弾性体でなるマイ
クロ波あるいは高周波のリーク防止手段を設け、
真空保持およびマイクロ波あるいは高周波のリー
ク防止を可能にしたものである。
The present invention provides microwave or high frequency leak prevention means, which is made of a vacuum holding O-ring and a conductive ring-shaped elastic body different from the O-ring, on the same sealing surface of the sealing part of the vacuum container,
This makes it possible to maintain vacuum and prevent microwave or high frequency leaks.
以下、本考案の実施例を第１図ないし第３図に
より説明する。第１図は高周波を印加する真空容
器を示し、第２，３図は本考案のそれぞれ異なる
実施例を示す。これらの図において、真空容器２
及びふた３で囲まれる内部には高周波が印加され
る電極１を有し、真空容器２とふた３の間に、真
空保持用Ｏリング４及び導電性の充填材を含有す
る弾性体５を設けている。この場合、真空保持用
Ｏリング４と弾性体５は第２，３図に示すよう
に、離しても又は接触させて設置してもよい。
Embodiments of the present invention will be described below with reference to FIGS. 1 to 3. FIG. 1 shows a vacuum vessel for applying high frequency waves, and FIGS. 2 and 3 show different embodiments of the present invention. In these figures, vacuum vessel 2
The inside surrounded by the lid 3 has an electrode 1 to which a high frequency is applied, and an O-ring 4 for vacuum retention and an elastic body 5 containing a conductive filler are provided between the vacuum container 2 and the lid 3. ing. In this case, the vacuum holding O-ring 4 and the elastic body 5 may be placed apart or in contact with each other, as shown in FIGS. 2 and 3.
本実施例によれば、真空保持用Ｏリング４によ
り真空を保持することができるとともに、導電性
の弾性体５により高周波の外部へのリークを防ぐ
ことができる。なお、マイクロ波を使用した装置
についても同様の効果が得られる。また、これら
真空保持用Ｏリング４および弾性体５は、内、外
どちらに配置してもその効果に変わりないことは
いうまでもない。 According to this embodiment, the vacuum can be maintained by the vacuum holding O-ring 4, and the conductive elastic body 5 can prevent leakage of high frequency waves to the outside. Note that similar effects can be obtained with devices using microwaves. Furthermore, it goes without saying that the effect of the vacuum holding O-ring 4 and the elastic body 5 remains the same whether they are placed inside or outside.
本考案によれば、真空容器のシール部の同一シ
ール面部に、真空保持用Ｏリングおよび該Ｏリン
グとは別の導電性を有するリング状の弾性体でな
るマイクロ波あるいは高周波のリーク防止手段を
設けることにより、確実な真空容器の真空保持及
び高周波あるいはマイクロ波の外部へのリーク防
止ができ、それにより装置の安全性及び周辺にあ
る機器へのノイズを低減できる効果がある。
According to the present invention, a microwave or high frequency leak prevention means consisting of a vacuum holding O-ring and a ring-shaped elastic body having conductivity different from the O-ring is provided on the same sealing surface of the sealing portion of the vacuum container. By providing this, it is possible to reliably maintain the vacuum in the vacuum container and prevent leakage of high frequency waves or microwaves to the outside, which has the effect of increasing the safety of the apparatus and reducing noise to surrounding equipment.
第１図は本考案を使用した装置の断面図、第
２，３図は本考案のそれぞれ異なる実施例を示す
詳細断面図である。
１……電極、２……真空容器、３……ふた、４
……真空保持用Ｏリング、５……弾性体。
FIG. 1 is a cross-sectional view of an apparatus using the present invention, and FIGS. 2 and 3 are detailed cross-sectional views showing different embodiments of the present invention. 1... Electrode, 2... Vacuum container, 3... Lid, 4
... O-ring for vacuum retention, 5 ... Elastic body.
Claims (1)
真空容器のシール部の同一シール面部に、真空保
持用Ｏリングおよび該Ｏリングとは別の導電性を
有するリング状の弾性体でなるマイクロ波あるい
は高周波のリーク防止手段を設けたことを特徴と
する半導体製造装置。 Microwave or high frequency leakage is made of an O-ring for vacuum retention and a ring-shaped elastic body with conductivity different from the O-ring on the same sealing surface of the seal part of the vacuum container to which a microwave or high-frequency electric field is applied. A semiconductor manufacturing device characterized by being provided with a prevention means.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985199406U JPH0447959Y2 (en) | 1985-12-27 | 1985-12-27 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985199406U JPH0447959Y2 (en) | 1985-12-27 | 1985-12-27 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62109449U JPS62109449U (en) | 1987-07-13 |
| JPH0447959Y2 true JPH0447959Y2 (en) | 1992-11-12 |
Family
ID=31161000
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1985199406U Expired JPH0447959Y2 (en) | 1985-12-27 | 1985-12-27 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0447959Y2 (en) |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58199529A (en) * | 1982-05-17 | 1983-11-19 | Hitachi Ltd | Plasma etching device |
| US4547247A (en) * | 1984-03-09 | 1985-10-15 | Tegal Corporation | Plasma reactor chuck assembly |
-
1985
- 1985-12-27 JP JP1985199406U patent/JPH0447959Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS62109449U (en) | 1987-07-13 |
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