JPH0447989Y2 - - Google Patents

Description

[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a high-frequency grounding circuit having a high-frequency grounding portion of a microwave stripline, which is a signal pattern through which a high-frequency signal passes.

[Conventional technology]

Conventionally, high-frequency circuits and bias circuits in communication devices, etc. have been configured on independent boards (or on the same board as the high-frequency circuit section, using a very simple DC circuit).
The board configuration had only circuits mounted on it.
Conventional high-frequency grounding circuits are constructed using methods such as making the entire back side of a Teflon (registered trademark) board with a high-frequency circuit on its surface a conductive surface and adhering it to a grounded metal plate. A high-frequency ground plane has been constructed.

[Problem that the invention attempts to solve]

In the conventional high-frequency grounding circuit described above, the back side of the board is a full conductor (or completely peeled off), so it is not possible to configure a circuit pattern on the back side, and it is difficult to form a complex circuit on the front side of the board. Can not.

In addition, if a high frequency circuit and a simple DC circuit are formed on the same board, components can only be attached to the surface, and the volume of the high frequency section becomes large. There are drawbacks such as signal overload. If the high frequency circuit and bias circuit are separated and configured on separate boards to solve problems such as resonance, components such as feedthrough capacitors will be required to connect the high frequency circuit and bias circuit.
Another disadvantage is that it takes time to assemble and has a complicated structure.

[Means for solving problems]

The high frequency grounding circuit of the present invention includes a conductor pattern provided on the surface of a substrate for passing a high frequency signal, a plurality of through holes arranged in the substrate in a manner surrounding the conductor pattern, and a plurality of through holes connected to the through holes. A conductor portion that covers a portion of the back surface of the substrate surrounded by the plurality of through holes, and a grounded metal case that is attached to the front surface of the substrate so as to surround the conductor pattern and is in contact with the plurality of through holes. Consists of.

〔Example〕

Next, the present invention will be explained with reference to the drawings.

FIG. 1 is a perspective view of an embodiment of the present invention seen from the back side, and FIG. 2 is an exploded perspective view of the embodiment shown in FIG. 1 seen from the front side. On the back side of the board 15 there is one hybrid IC 4 and a high frequency coaxial connector 1.
9 (one of the two is not shown) is attached. A conductor pattern 10 is provided on the surface of the substrate 15 to pass a high frequency signal of a microwave stripline connecting the high frequency coaxial connector 19 and the hybrid IC 4. High frequency connector 1
The center conductor 14 of No. 3 passes through the high frequency extraction section 6 provided on the substrate 15 and is connected to the high frequency extraction section 18 of the conductor pattern 10 by soldering or the like. Similarly, the high frequency signal terminal of the hybrid IC 4 also passes through a hole provided in the substrate 15 and is connected to the high frequency signal passage section 17 of the conductor pattern 10 by soldering or the like.
Further, a bias supply line terminal of the hybrid IC 4 is connected to a bias supply line provided on the surface of the substrate 15.

A large number of through holes 7 are arranged in a row on the substrate 15 so as to surround the conductor pattern 10.
The side where the through hole 7 is provided on the back side of the IC is completely covered except for the notch part provided to avoid the bias supply line 9 and the area around the hole through which the high frequency signal extraction section 6 and the high frequency signal terminal of the hybrid IC 4 pass. is covered with the conductor portion 2. The through holes 7 are connected to each other by the conductor portion 2 on the back surface, and are also connected to each other by the conductor pattern 3 on the front surface. Further, the surface of the substrate 15 is provided with a high frequency circuit section 12 corresponding to the conductor pattern 10 and a notch 20 for avoiding the bias supply line, a grounded metal case 16 is attached, and all the through holes 7 are connected to the metal case 12. 16 and is grounded.

Therefore, the conductor section 2 is secured as a ground plane for the high frequency circuit section. Furthermore, in order to ensure that the outer peripheries of the hybrid IC 4 and the high frequency coaxial connector 13 are grounded, the hybrid IC and the high frequency coaxial connector 13 are soldered or screwed to the conductor portion 2.

Note that the side of the substrate 15 on which the conductor section 2 is not provided is used as a bias supply circuit 11 (the specific circuit is not shown), and in this embodiment, a high frequency circuit section and a bias supply circuit section are provided on one substrate. It is divided and set up.

[Effect of idea]

As explained above, the present invention provides a conductor portion that serves as a high-frequency ground plane only on a portion of the back surface of the board by forming a through hole that contacts a grounded metal case around a conductor pattern that passes high-frequency signals. It is possible to form patterns on both sides of the other parts of the substrate, and it is possible to form a high frequency circuit, a bias supply, and a complex bias supply circuit on a single substrate.

Furthermore, even if the high frequency circuit and bias supply circuit are integrated, the volume of the high frequency circuit can be reduced, so there are no problems such as case resonance, and since the high frequency circuit and bias supply circuit are integrated, There is no need for parts such as feedthrough capacitors, resulting in a simple structure and the advantage that it can be assembled very easily.

[Brief explanation of drawings]

FIGS. 1 and 2 are perspective views of an embodiment of the present invention, showing a rear perspective view and an exploded front perspective view, respectively. 2...Conductor part, 4...Hybrid IC, 6...
...High frequency signal extraction section, 7...Through hole,
9... Bias supply line, 10... Microwave strip line, 11... Bias supply circuit section, 12... High frequency circuit section, 13... High frequency coaxial connector, 14... Center conductor of connector, 15
... Board, 16 ... Metal case, 17 ... High frequency signal passing section, 18 ... High frequency signal extraction section, 1
9...High frequency coaxial connector.

Claims (1)

[Scope of utility model registration request] a conductor pattern provided on the surface of a substrate for passing a high-frequency signal; a plurality of through holes provided in the substrate in rows surrounding the conductor pattern;
A conductor portion connected to the through hole and covering a portion of the back surface of the substrate surrounded by the plurality of through holes, and a grounding portion attached to the front surface of the substrate so as to surround the conductor pattern and in contact with the plurality of through holes. A high frequency grounding circuit comprising: a metal case;