JPH0448738A - Die bonding device - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Detailed description of the invention] [Industrial application field] This invention relates to a die bonding device.

[Conventional technology]

Figure 2 shows a part of the conventional die bonding equipment, in which (1) is the atmosphere cover, (2) is the bonding point opening, and (3) is the atmosphere cover (1). Atmospheric gas path, 14) d lead frame, (5)
is the brazing material applied on the lead frame (4) & (6)
17) is a rail that conveys the lead frame (4), and 17) is a heat block that heats the lead frame (4).

Next, the operation will be explained. Atmospheric gas is blown into the atmosphere gas path (3) of the atmosphere cover (1) in the direction of the arrow shown, reaches the bonding point opening (2), and oxidizes the brazing material (5) on the lead frame (4). I try to prevent this.

At this time, the lead frame (4) is transported to the bonding opening O part +2 by the rail (6) and heated by the heat block (7), but when it reaches the bonding point opening (2), it is blown with atmospheric gas. The temperature of the brazing material (5) decreases as it is heated.

Quaternary % M 7 Since the atmosphere at the flying point is also cooled, the temperature on the back surface of the chip does not rise just before bonding.

[Problem that the invention seeks to solve]

Since the conventional die bonding apparatus is configured as described above, raising the temperature of the atmosphere and the frame temperature is impaired, so it is necessary to raise the temperature of the back surface of the chip.

It is necessary to allow a long time to heat the material, and even if the temperature of the heat block is set high, the brazing material will be cooled down, making the melting of the brazing material unstable and causing variations in quality. This invention was made to solve the above-mentioned problems, and aims to provide a die bonding device that can obtain a high ambient temperature at the bonding point and improve quality. shall be.

[Ninth means to solve the problem]

The die bonding device according to the present invention is equipped with an atmosphere cover that uses hot gas as the atmosphere gas to obtain a high ambient temperature at the bonding point.

[Function] Since the die bonding device according to the present invention is configured to supply atmospheric gas at a predetermined temperature to the bonding point opening, the bonding point atmospheric temperature is increased and quality is improved.

〔Example〕

An embodiment of the present invention will be described below with reference to the drawings.

In FIGS. 1(a) to 1(C), (4) to (7) are the same as the conventional ones, and therefore their explanations will be omitted.

(l&) is atmosphere cover (2a) and atmosphere cover (I
T bonding point opening provided in m), r3a)
A hole atmosphere gas path provided in the atmosphere cover (LA),
(8) is the real torch, (9) and (9a) are the mounting block of the real torch (8), and the bonding point opening is provided in the Q (Iri atmosphere cover (1a) and the mounting block (9a) with the gas path) A path c (hereinafter referred to as a real gas path) for supplying gas to the section (2a) is constituted.

Next, the operation will be explained. Atmosphere gas flows through the gas path (3a) of the atmosphere cover (1a) other than the bonding point.
The bonding point opening (2a) is heated once and a cold atmosphere gas is supplied to the hot gas path α through the real torch (8).

1. Even when the lead frame (4) reaches the bonding point, hot gas is blown onto the brazing material (5), so the brazing material (5) will not be cooled down. Since the atmosphere is not cooled, the backside of the chip can be sufficiently heated just before bonding.

In this invention, a real torch is used as a means for heating the atmospheric gas, but the heating means may also be constructed in another mechanism, for example, the atmosphere cover itself may be used as a heat block.

In this embodiment, we will explain the operation of heating the atmospheric gas to melt the brazing material.9 However, it is also possible to use it as a cure for thermosetting the brazing material, for example.0 [Effects of the Invention] ] As described above, according to the present invention, atmospheric gas at a predetermined temperature is supplied to the bonding point opening.
The atmospheric temperature at the bonding point can be raised, the temperature of the brazing material on the frame will not drop, and
Since the temperature on the back side of the chip is sufficiently raised, it has the effect of producing high quality products.

[Brief explanation of drawings]

FIG. 1 is a diagram showing a part of a diepond device according to an embodiment of the present invention, in which FIG. 1(a) is a front view, FIG. 1(b) is a top view, and FIG. 1(c) is a try cross-sectional view. , FIG. 2 is a diagram showing a part of a conventional die pound device, and FIG. 82(a) td
The front view, FIG. 2 fb) is a top view, and FIG. 2 fc) is a sectional view. In the figure, (la) is the atmosphere cover, (2a) is the bonding opening i, (r3a) is the gas path, (4
) is lead frame, (5) is brazing material, (6) is rail, (7) is heat block, (8) is hot torch =
(9), (9a) is the mounting block, C1(DI;t
It's really a gas route. In addition, in the figure, the same reference numerals indicate the same parts or parts corresponding to 7tri.

Claims (1)

[Claims] In a die bonding device that fixes a semiconductor element onto a lead frame, a rail that transports the lead frame to a bonding point where the semiconductor element is attached to the lead frame;
and a die bonding apparatus, characterized in that a gas having a temperature higher than the temperature of the atmospheric gas is supplied to a predetermined position of a cover attached to the rail so as to guide the atmospheric gas to the bonding point.