JPH04503378A - メッキ組成物およびメッキ方法 - Google Patents

メッキ組成物およびメッキ方法

Info

Publication number
JPH04503378A
JPH04503378A JP2503206A JP50320690A JPH04503378A JP H04503378 A JPH04503378 A JP H04503378A JP 2503206 A JP2503206 A JP 2503206A JP 50320690 A JP50320690 A JP 50320690A JP H04503378 A JPH04503378 A JP H04503378A
Authority
JP
Japan
Prior art keywords
cobalt
composition
plating
electroless
lead
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2503206A
Other languages
English (en)
Japanese (ja)
Inventor
マクドナルド，イアン，ジェラルド
アーチャー，フィリップ，ジョン
Original Assignee
ポリメタルズ　テクノロジィ　リミテッド
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from GB898903646A external-priority patent/GB8903646D0/en
Priority claimed from GB898903645A external-priority patent/GB8903645D0/en
Application filed by ポリメタルズ　テクノロジィ　リミテッド filed Critical ポリメタルズ　テクノロジィ　リミテッド
Publication of JPH04503378A publication Critical patent/JPH04503378A/ja
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
    • C23C18/34—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
JP2503206A 1989-02-17 1990-02-16 メッキ組成物およびメッキ方法 Pending JPH04503378A (ja)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
GB8903646.1 1989-02-17
GB898903646A GB8903646D0 (en) 1989-02-17 1989-02-17 Plating composition and process
GB898903645A GB8903645D0 (en) 1989-02-17 1989-02-17 Plating composition and process
GB8903645.3 1989-02-17

Publications (1)

Publication Number Publication Date
JPH04503378A true JPH04503378A (ja) 1992-06-18

Family

ID=26294974

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2503206A Pending JPH04503378A (ja) 1989-02-17 1990-02-16 メッキ組成物およびメッキ方法
JP2503207A Pending JPH04503379A (ja) 1989-02-17 1990-02-16 メッキ組成物およびメッキ方法

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2503207A Pending JPH04503379A (ja) 1989-02-17 1990-02-16 メッキ組成物およびメッキ方法

Country Status (3)

Country Link
EP (2) EP0458828A1 (de)
JP (2) JPH04503378A (de)
WO (2) WO1990009467A1 (de)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003049280A (ja) * 2001-06-01 2003-02-21 Ebara Corp 無電解めっき液及び半導体装置

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3142018B2 (ja) * 1992-03-12 2001-03-07 日本テキサス・インスツルメンツ株式会社 負荷駆動回路

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR1209408A (fr) * 1957-11-04 1960-03-01 Du Pont Dépôt par voie chimique d'alliages de nickel-bore et de cobalt-bore
GB842826A (en) * 1957-11-15 1960-07-27 Du Pont Improvements in or relating to chemical plating
DE1621206B2 (de) * 1967-01-18 1971-12-16 Friedr. Blasberg Gmbh & Co, Kg, 5650 Solingen Verfahren zur beschichtung gleitend reibend auf verschleiss beanspruchter werkstuecke
US3562000A (en) * 1968-10-25 1971-02-09 Gen Am Transport Process of electrolessly depositing metal coatings having metallic particles dispersed therethrough
DE1950983A1 (de) * 1969-10-09 1971-04-22 Bayer Ag Waessriges,alkalisches Bad zur chemischen Metallisierung von Nichtleitermaterialien

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003049280A (ja) * 2001-06-01 2003-02-21 Ebara Corp 無電解めっき液及び半導体装置

Also Published As

Publication number Publication date
EP0458827A1 (de) 1991-12-04
WO1990009468A1 (en) 1990-08-23
JPH04503379A (ja) 1992-06-18
WO1990009467A1 (en) 1990-08-23
EP0458828A1 (de) 1991-12-04

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