JPH0451168U - - Google Patents
Info
- Publication number
- JPH0451168U JPH0451168U JP9324590U JP9324590U JPH0451168U JP H0451168 U JPH0451168 U JP H0451168U JP 9324590 U JP9324590 U JP 9324590U JP 9324590 U JP9324590 U JP 9324590U JP H0451168 U JPH0451168 U JP H0451168U
- Authority
- JP
- Japan
- Prior art keywords
- board
- cable
- boards
- spacer
- sides
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 125000006850 spacer group Chemical group 0.000 claims description 11
- 238000005476 soldering Methods 0.000 claims description 4
- 229910000679 solder Inorganic materials 0.000 claims 2
- 239000003990 capacitor Substances 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 8
- 238000000034 method Methods 0.000 description 2
- 239000000758 substrate Substances 0.000 description 1
Landscapes
- Multi-Conductor Connections (AREA)
- Combinations Of Printed Boards (AREA)
Description
第1図、第2図、第3図はこの考案の一実施例
を示す図であり、第1図はスペーサの形状図、第
2図は基板へのスペーサ取付図、第3図は複数基
板の総組立図、第4図、第5図、第6図は従来の
基板組立方法を示す図であり、第1図aは基板組
立の上面視図、第4図bは基板組立側面視図、第
5図aは基板収納方法を示す図、第5図bは基板
の収納形態を示す図、第6図はハンダ付けの例を
示す図である。
1a,1b,1c…は基板、2a,2b,2c
…はスルーホール、3a,3b,3c…はケーブ
ル、5a,5b…はスペーサ、6a,6b…はケ
ーブル通し穴である。なお、図中、同一符号は同
一、又は相当部分を示す。
Figures 1, 2, and 3 are diagrams showing an embodiment of this invention. Figure 1 is a diagram of the shape of a spacer, Figure 2 is a diagram of mounting a spacer on a board, and Figure 3 is a diagram of a plurality of boards. 4, 5, and 6 are diagrams showing the conventional board assembly method, and FIG. 1a is a top view of the board assembly, and FIG. 4b is a side view of the board assembly. , FIG. 5a is a diagram showing a board storage method, FIG. 5b is a diagram showing a board storage form, and FIG. 6 is a diagram showing an example of soldering. 1a, 1b, 1c... are substrates, 2a, 2b, 2c
... are through holes, 3a, 3b, 3c... are cables, 5a, 5b... are spacers, and 6a, 6b... are cable through holes. In addition, in the figures, the same reference numerals indicate the same or equivalent parts.
Claims (1)
の実装し、一つの辺を第一辺、これと直角に位置
する二つの辺を第二辺及び第四辺、第一辺と並行
に相対する方向に位置する辺を第三辺とし、第一
辺と第三辺の縁に配置される基板間のスペーサの
幅分の距離をあけた位置に各基板間接続ケーブル
をハンダ付けするスルーホールを配置した複数の
基板、基板の第一辺と第三辺の縁に配置され基板
間を接続するケーブルを基板面に並行に貫通させ
るケーブル通し穴を設けたスペーサ、基板間を接
続するケーブルから構成され、各基板の第一辺と
第三辺の各縁にケーブル通し穴が基板に並行にな
るようにスペーサを実装した後、基板の同一番号
の辺が同一方向を向くように複数の基板を積み重
ねて第一の基板、第二の基板として番号を付し、
第一の基板の第三辺のスペーサの内側に位置する
ハンダ付け用スルーホールにケーブルをハンダ付
けし、次いでこのケーブルを同基板の同スペーサ
のケーブル通し穴に貫通させ、さらにこのケーブ
ルを第二の基板の第三辺に配置されたスペーサの
ケーブル通し穴に同基板の縁側より貫通させ、最
後に同基板の同スペーサ内側のハンダ付け用スル
ーホールに同ケーブルをハンダ付けして固定し、
次に第二の基板の第一辺と第三の基板の第一辺を
、次に第三の基板の第三辺と第四の基板の第三辺
を、の順に交互に基板間をケーブル通し穴を設け
たスペーサを用いて直接に接続してあることを特
徴とする基板。 Mounting electrical components such as multiple ICs, resistors, capacitors, etc., one side is the first side, two sides perpendicular to this are the second and fourth sides, and the direction facing parallel to the first side. The side located at is the third side, and through-holes for soldering the connection cables between the boards are placed at positions separated by the width of the spacer between the boards placed on the edges of the first and third sides. It consists of multiple boards, a spacer that is placed on the edges of the first and third sides of the boards and has a cable passage hole that allows the cable that connects the boards to pass through in parallel to the board surface, and the cable that connects the boards. After mounting spacers on each edge of the first and third sides of each board so that the cable passage holes are parallel to the board, stack multiple boards so that the sides with the same number face the same direction. numbered as the first board and the second board,
Solder the cable to the soldering through hole located inside the spacer on the third side of the first board, then pass this cable through the cable passage hole of the same spacer on the same board, and then pass this cable to the second board. Pass the cable through the cable passage hole of the spacer placed on the third side of the board from the edge of the board, and finally solder and fix the cable to the soldering through hole inside the spacer of the board.
Next, connect the cables between the boards alternately, in this order: the first side of the second board and the first side of the third board, then the third side of the third board, and the third side of the fourth board. A board characterized in that it is directly connected using a spacer with a through hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9324590U JPH0451168U (en) | 1990-09-05 | 1990-09-05 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9324590U JPH0451168U (en) | 1990-09-05 | 1990-09-05 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0451168U true JPH0451168U (en) | 1992-04-30 |
Family
ID=31830296
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9324590U Pending JPH0451168U (en) | 1990-09-05 | 1990-09-05 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0451168U (en) |
-
1990
- 1990-09-05 JP JP9324590U patent/JPH0451168U/ja active Pending
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