JPH0451171U - - Google Patents
Info
- Publication number
- JPH0451171U JPH0451171U JP9324790U JP9324790U JPH0451171U JP H0451171 U JPH0451171 U JP H0451171U JP 9324790 U JP9324790 U JP 9324790U JP 9324790 U JP9324790 U JP 9324790U JP H0451171 U JPH0451171 U JP H0451171U
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- insulated spacer
- sides
- conductive
- insulated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 125000006850 spacer group Chemical group 0.000 claims description 14
- 239000002184 metal Substances 0.000 claims description 5
- 230000008878 coupling Effects 0.000 claims description 2
- 238000010168 coupling process Methods 0.000 claims description 2
- 238000005859 coupling reaction Methods 0.000 claims description 2
- 239000000758 substrate Substances 0.000 claims 11
- 239000003990 capacitor Substances 0.000 claims 1
- 238000000034 method Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
Landscapes
- Combinations Of Printed Boards (AREA)
Description
第1図、第2図及び第3図はこの考案の一実施
例であり、第1図は蝶番の形状を示す図、第2図
は基板の組立方法を示す図、第3図は複数の基板
1の組立方法を示す図、第4図及び第5図は従来
の基板組立例であり第4図はスペーサの取付方法
を示す図、第5図は複数基板の組立方法を示す図
である。
1は基板、2は絶縁型スペーサ、3は貫通ボル
ト、6はベース、10は蝶番、11は電源パター
ン、12はグランドパターン、13はL型金具、
14は絶縁型スペーサ、15は結合ボルト、16
はナツト、17は貫通穴である。なお、図中、同
一符号は同一、又は相当部分を示す。
Figures 1, 2, and 3 show one embodiment of this invention, with Figure 1 showing the shape of the hinge, Figure 2 showing the method of assembling the board, and Figure 3 showing the shape of the hinge. Figures 4 and 5 are diagrams showing a method for assembling the board 1, and Figures 4 and 5 are examples of conventional board assembly, Figure 4 is a diagram showing a method for attaching spacers, and Figure 5 is a diagram showing a method for assembling multiple boards. . 1 is a board, 2 is an insulated spacer, 3 is a through bolt, 6 is a base, 10 is a hinge, 11 is a power supply pattern, 12 is a ground pattern, 13 is an L-shaped metal fitting,
14 is an insulated spacer, 15 is a coupling bolt, 16
is a nut, and 17 is a through hole. In addition, in the figures, the same reference numerals indicate the same or equivalent parts.
Claims (1)
を実装し、一つの辺を第一辺、これと直角に位置
する二つの辺を第二辺及び第四辺、第一辺と並行
に相対する方向に位置する辺を第三辺とし、第一
辺と第三辺の各縁の基板面に各々電源及びグラン
ド用のパターン領域を配置した基板、各基板を同
一番号の辺が同一方向になるようにスタツク的に
重ねて、第一、第二、第三、第四として基板番号
を付し、全基板の第一辺と第三辺に配置した絶縁
型スペーサ、基板の第一辺と第三辺の絶縁型スペ
ーサの内側基板上に配置された電源及びグランド
パターンとこれに直角に位置する絶縁型スペーサ
の基板内側の側面に接するように配置した導電性
のL型金具、第一基板第三辺の絶縁型スペーサの
基板外側の側面と第二基板第三辺の絶縁型スペー
サの基板外側の側面、第二基板第一辺の絶縁型ス
ペーサの基板外側の側面と第三基板第一辺の絶縁
型スペーサの基板外側の側面、第三基板と第四基
板の絶縁型スペーサの第三辺基板外側の側面、の
順に基板の第三辺と第一辺を交互に接続する導電
性の蝶番、絶縁型スペーサの両サイドに配置した
電源及びグランドパターンに接続された導電性の
L型金具と導電性の蝶番を基板面に平行な絶縁型
スペーサの貫通穴を通して結合する導電性の結合
ボルト、結合ボルトをL型金具側でネジ止めする
導電性のナツトから構成され、複数の基板の電源
及びグランドパターンを第一辺と第三辺に各々配
置した導電性のL型金具と蝶番と結合ボルトとナ
ツトを用いて結合し、基板間を電気的に接続して
屏風型に開閉できるようにしてあることを特徴と
する基板。 Electrical components such as multiple ICs, resistors, capacitors, etc. are mounted, one side is the first side, the two sides located at right angles to this are the second and fourth sides, and the direction facing parallel to the first side. The side located at is the third side, and pattern areas for power and ground are arranged on the board surface of each edge of the first and third sides, respectively, and each board is arranged so that the sides with the same number are in the same direction. Insulated spacers are stacked on top of each other and numbered as first, second, third, and fourth, and placed on the first and third sides of all boards. A conductive L-shaped metal fitting arranged so as to be in contact with the power supply and ground pattern arranged on the inner side substrate of the insulated spacer on the side and the inner side surface of the insulated spacer substrate located perpendicular to this, the first substrate third The outer side of the insulated spacer on the side of the substrate, the outer side of the insulated spacer on the third side of the second substrate, the outer side of the insulated spacer on the first side of the second substrate, and the outer side of the insulated spacer on the first side of the third substrate. a conductive hinge that alternately connects the third side and the first side of the substrate in the order of the outer side of the substrate of the insulated spacer, the outer side of the third side substrate of the insulated spacer of the third and fourth substrates; A conductive coupling bolt that connects a conductive L-shaped metal fitting connected to the power supply and ground patterns placed on both sides of an insulated spacer and a conductive hinge through a through hole in an insulated spacer parallel to the board surface. It consists of a conductive nut that screws a bolt on the L-shaped metal fitting side, and a conductive L-shaped metal fitting with power and ground patterns of multiple boards arranged on the first and third sides, a hinge, and a connecting bolt. A board characterized in that the boards are joined together using nuts and electrically connected between the boards so that they can be opened and closed like a folding screen.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9324790U JPH0451171U (en) | 1990-09-05 | 1990-09-05 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9324790U JPH0451171U (en) | 1990-09-05 | 1990-09-05 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0451171U true JPH0451171U (en) | 1992-04-30 |
Family
ID=31830300
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9324790U Pending JPH0451171U (en) | 1990-09-05 | 1990-09-05 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0451171U (en) |
-
1990
- 1990-09-05 JP JP9324790U patent/JPH0451171U/ja active Pending
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