JPH0452017U - - Google Patents
Info
- Publication number
- JPH0452017U JPH0452017U JP9539690U JP9539690U JPH0452017U JP H0452017 U JPH0452017 U JP H0452017U JP 9539690 U JP9539690 U JP 9539690U JP 9539690 U JP9539690 U JP 9539690U JP H0452017 U JPH0452017 U JP H0452017U
- Authority
- JP
- Japan
- Prior art keywords
- molded product
- film
- injection molding
- printed circuit
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000001746 injection moulding Methods 0.000 claims description 6
- 238000000465 moulding Methods 0.000 claims 2
- 239000004020 conductor Substances 0.000 claims 1
Landscapes
- Injection Moulding Of Plastics Or The Like (AREA)
Description
第１図はこの考案の装置によつて製造された箱
型プリント回路基板の斜視図、第２図はこの考案
の一実施例を示す射出成形装置の概略側面図、第
３図はフイルム剥取装置の要部の斜視図、第４図
はそのフイルム剥取り時の断面図、第５図はこの
考案の他の実施例を示す概略側面図である。
１２……回路パターン、２０……射出成形装置
、２１……固定盤、２２……キヤビテイ型、２５
……コア型、２６……可動盤、４０……転写フイ
ルム供給装置、５０……成形品取出装置、７０…
…フイルム剥取装置。
Fig. 1 is a perspective view of a box-shaped printed circuit board manufactured by the apparatus of this invention, Fig. 2 is a schematic side view of an injection molding apparatus showing an embodiment of this invention, and Fig. 3 is a film peeling. FIG. 4 is a perspective view of the main parts of the device, FIG. 4 is a sectional view of the device when the film is peeled off, and FIG. 5 is a schematic side view showing another embodiment of the invention. 12... Circuit pattern, 20... Injection molding device, 21... Fixed plate, 22... Cavity mold, 25
... core mold, 26 ... movable platen, 40 ... transfer film supply device, 50 ... molded product take-out device, 70 ...
...Film stripping device.
Claims (1)
る導電体よりなる回路パターンをその表面に有す
る転写フイルムを配して成形品の成形と同時に回
路パターンを一体に形成するようにした装置にお
いて、 前記成形品の射出成形後の成形品取出し時に、
前記成形品と前記転写フイルムの間に機外より前
進し前記転写フイルムのフイルム部分を成形品表
面より剥離するフイルム剥取部材を備えたフイル
ム剥取装置を設置したことを特徴とするプリント
回路基板用射出成形装置。 ２ 請求項第１項において、フイルム剥取装置が
成形機の可動盤に設けられた成形品取出装置に付
設されたことを特徴とするプリント回路基板用射
出成形装置。 ３ 請求項第１項において、フイルム剥取装置が
成形機の可動盤に設けられた転写フイルム供給装
置に付設されたことを特徴とするプリント回路基
板用射出成形装置。[Claims for Utility Model Registration] 1. A transfer film having a circuit pattern made of a conductor constituting a printed circuit on its surface is disposed in the molded product cavity so that the circuit pattern is integrally formed at the same time as the molded product is molded. In the apparatus, when taking out the molded product after injection molding of the molded product,
A printed circuit board characterized in that a film stripping device is installed between the molded product and the transfer film, the film stripping device having a film stripping member that advances from outside the machine and peels off the film portion of the transfer film from the surface of the molded product. injection molding equipment. 2. The injection molding apparatus for a printed circuit board according to claim 1, wherein the film stripping device is attached to a molded product take-out device provided on a movable platen of the molding machine. 3. The injection molding apparatus for a printed circuit board according to claim 1, wherein the film stripping device is attached to a transfer film supply device provided on a movable platen of the molding machine.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9539690U JPH0727138Y2 (en) | 1990-09-10 | 1990-09-10 | Injection molding equipment for printed circuit boards |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9539690U JPH0727138Y2 (en) | 1990-09-10 | 1990-09-10 | Injection molding equipment for printed circuit boards |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0452017U true JPH0452017U (en) | 1992-05-01 |
| JPH0727138Y2 JPH0727138Y2 (en) | 1995-06-21 |
Family
ID=31834086
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9539690U Expired - Lifetime JPH0727138Y2 (en) | 1990-09-10 | 1990-09-10 | Injection molding equipment for printed circuit boards |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0727138Y2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2014000744A (en) * | 2012-06-20 | 2014-01-09 | Panasonic Corp | In-mold molding method and in-mold device |
-
1990
- 1990-09-10 JP JP9539690U patent/JPH0727138Y2/en not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2014000744A (en) * | 2012-06-20 | 2014-01-09 | Panasonic Corp | In-mold molding method and in-mold device |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0727138Y2 (en) | 1995-06-21 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |