JPH0456340U - - Google Patents
Info
- Publication number
- JPH0456340U JPH0456340U JP1990098834U JP9883490U JPH0456340U JP H0456340 U JPH0456340 U JP H0456340U JP 1990098834 U JP1990098834 U JP 1990098834U JP 9883490 U JP9883490 U JP 9883490U JP H0456340 U JPH0456340 U JP H0456340U
- Authority
- JP
- Japan
- Prior art keywords
- main surface
- test pad
- circuit board
- circuit
- output terminal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/531—Shapes of wire connectors
- H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/531—Shapes of wire connectors
- H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL
Landscapes
- Testing Electric Properties And Detecting Electric Faults (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Description
図は本発明の実施例の構成を示す断面図である
。 主要部分の符号の説明、１……回路基板、２…
…ＩＣチツプ、３……半導体集積回路、４……ボ
ンデイングランド、５……ワイヤ、６……接続ラ
ンド、７……リード、８……スルーホール、９…
…試験用パツド。
。 主要部分の符号の説明、１……回路基板、２…
…ＩＣチツプ、３……半導体集積回路、４……ボ
ンデイングランド、５……ワイヤ、６……接続ラ
ンド、７……リード、８……スルーホール、９…
…試験用パツド。
Claims (1)
- 一主表面に回路部品が搭載された回路基板であ
つて、他主表面に設けられた試験用パツドと、前
記回路部品の入出力端子と前記試験用パツドとを
接続する接続手段とを含むことを特徴とする回路
基板。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990098834U JPH0456340U (ja) | 1990-09-20 | 1990-09-20 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990098834U JPH0456340U (ja) | 1990-09-20 | 1990-09-20 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0456340U true JPH0456340U (ja) | 1992-05-14 |
Family
ID=31840308
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1990098834U Pending JPH0456340U (ja) | 1990-09-20 | 1990-09-20 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0456340U (ja) |
-
1990
- 1990-09-20 JP JP1990098834U patent/JPH0456340U/ja active Pending