JPH032642U - - Google Patents
Info
- Publication number
- JPH032642U JPH032642U JP1989063397U JP6339789U JPH032642U JP H032642 U JPH032642 U JP H032642U JP 1989063397 U JP1989063397 U JP 1989063397U JP 6339789 U JP6339789 U JP 6339789U JP H032642 U JPH032642 U JP H032642U
- Authority
- JP
- Japan
- Prior art keywords
- copper foil
- holes
- tab
- tape
- film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/701—Tape-automated bond [TAB] connectors
Landscapes
- Wire Bonding (AREA)
Description
第１図は本考案の一実施例に係るＴＡＢ用テー
プの斜視図、第２図イ，ロは何れもインナーリー
ド先端に膨大部を形成する状態を示す要部拡大側
面図、第３図は同実施例のＴＡＢ用テープを用い
た半導体ペレツトとの接合状態を示す側面図、第
４図は従来のＴＡＢ用テープの斜視図、第５図は
従来のＴＡＢ用テープを用いた半導体ペレツトと
の接合状態を示す側面図である。
２……フイルム、２ｂ……透孔、３……銅箔、
４……インナーリード、４ａ……膨大部、５……
半導体ペレツト、５ａ……電極。
FIG. 1 is a perspective view of a TAB tape according to an embodiment of the present invention, FIG. FIG. 4 is a perspective view of the conventional TAB tape, and FIG. FIG. 3 is a side view showing a joined state. 2...Film, 2b...Through hole, 3...Copper foil,
4... Inner lead, 4a... Ampulla, 5...
Semiconductor pellet, 5a...electrode.
Claims (1)
積層し、この銅箔をエツチングして透孔内に延び
るインナーリードを形成してなるＴＡＢ用テープ
において、 上記インナーリードの先端に膨大部を形成した
ことを特徴とするＴＡＢ用テープ。[Scope of Claim for Utility Model Registration] A TAB tape in which copper foil is laminated on a film in which through holes are formed at predetermined intervals, and the copper foil is etched to form inner leads extending into the through holes, A tape for TAB, characterized in that an enlarged portion is formed at the tip of the inner lead.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989063397U JPH032642U (en) | 1989-05-30 | 1989-05-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989063397U JPH032642U (en) | 1989-05-30 | 1989-05-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH032642U true JPH032642U (en) | 1991-01-11 |
Family
ID=31593407
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989063397U Pending JPH032642U (en) | 1989-05-30 | 1989-05-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH032642U (en) |
-
1989
- 1989-05-30 JP JP1989063397U patent/JPH032642U/ja active Pending