JPH0459948U - - Google Patents
Info
- Publication number
- JPH0459948U JPH0459948U JP1990103971U JP10397190U JPH0459948U JP H0459948 U JPH0459948 U JP H0459948U JP 1990103971 U JP1990103971 U JP 1990103971U JP 10397190 U JP10397190 U JP 10397190U JP H0459948 U JPH0459948 U JP H0459948U
- Authority
- JP
- Japan
- Prior art keywords
- pellet
- semiconductor
- package
- encapsulated
- molded
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Lead Frames For Integrated Circuits (AREA)
Description
第１図は本考案の一実施例のアイランドに半導
体ＩＣペレツトを搭載した要部平面図、第２図は
第１図の半導体ＩＣペレツトを他の種類の一例の
モールドＩＣ用パツケージのアイランドに搭載し
た要部平面図、第３図は従来のＺＩＰ型のモール
ドＩＣ用パツケージの一例のアイランドに半導体
ＩＣペレツトを搭載した要部平面図である。
１，１１……半導体ＩＣペレツト、２……パツ
ド、３……アイランド、４……リード、５……吊
りピン、６……ボンデイングワイヤ。
Figure 1 is a plan view of the main part of a semiconductor IC pellet mounted on an island according to an embodiment of the present invention, and Figure 2 is a diagram showing the semiconductor IC pellet shown in Figure 1 mounted on an island of another type of molded IC package. FIG. 3 is a plan view of a main part in which a semiconductor IC pellet is mounted on an island of an example of a conventional ZIP type molded IC package. 1, 11... Semiconductor IC pellet, 2... Pad, 3... Island, 4... Lead, 5... Hanging pin, 6... Bonding wire.
Claims (1)
ンラインパツケージ型のモールドＩＣ用パツケー
ジにおいて、前記半導体ＩＣペレツトを搭載する
アイランドを封入樹脂の側面に対して斜めに配置
し前記半導体ＩＣペレツトを封入したことを特徴
とするモールドＩＣ用パツケージ。 A zigzag in-line package type molded IC package in which a semiconductor IC pellet is encapsulated in resin, characterized in that an island on which the semiconductor IC pellet is mounted is arranged diagonally with respect to a side surface of the encapsulating resin, and the semiconductor IC pellet is encapsulated therein. Package cage for molded IC.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990103971U JPH0459948U (en) | 1990-10-01 | 1990-10-01 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990103971U JPH0459948U (en) | 1990-10-01 | 1990-10-01 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0459948U true JPH0459948U (en) | 1992-05-22 |
Family
ID=31849061
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1990103971U Pending JPH0459948U (en) | 1990-10-01 | 1990-10-01 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0459948U (en) |
-
1990
- 1990-10-01 JP JP1990103971U patent/JPH0459948U/ja active Pending