JPH0460053B2 - - Google Patents
Info
- Publication number
- JPH0460053B2 JPH0460053B2 JP62117612A JP11761287A JPH0460053B2 JP H0460053 B2 JPH0460053 B2 JP H0460053B2 JP 62117612 A JP62117612 A JP 62117612A JP 11761287 A JP11761287 A JP 11761287A JP H0460053 B2 JPH0460053 B2 JP H0460053B2
- Authority
- JP
- Japan
- Prior art keywords
- silica
- particles
- fine powder
- powder particles
- particle size
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
- C01B33/00—Silicon; Compounds thereof
- C01B33/113—Silicon oxides; Hydrates thereof
- C01B33/12—Silica; Hydrates thereof, e.g. lepidoic silicic acid
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Silicon Compounds (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Pigments, Carbon Blacks, Or Wood Stains (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62117612A JPS63282109A (ja) | 1987-05-13 | 1987-05-13 | シリカ微粉末粒子の製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62117612A JPS63282109A (ja) | 1987-05-13 | 1987-05-13 | シリカ微粉末粒子の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63282109A JPS63282109A (ja) | 1988-11-18 |
| JPH0460053B2 true JPH0460053B2 (da) | 1992-09-25 |
Family
ID=14716069
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP62117612A Granted JPS63282109A (ja) | 1987-05-13 | 1987-05-13 | シリカ微粉末粒子の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63282109A (da) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0750760B2 (ja) * | 1988-12-21 | 1995-05-31 | 松下電工株式会社 | 半導体封止用樹脂成形材料 |
| JPH02187055A (ja) * | 1989-01-13 | 1990-07-23 | Nitto Denko Corp | 半導体装置 |
| JPH08124956A (ja) * | 1995-10-06 | 1996-05-17 | Nitto Denko Corp | 半導体装置 |
-
1987
- 1987-05-13 JP JP62117612A patent/JPS63282109A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS63282109A (ja) | 1988-11-18 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| EXPY | Cancellation because of completion of term | ||
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20070925 Year of fee payment: 15 |