JPH0460345B2 - - Google Patents

Info

Publication number
JPH0460345B2
JPH0460345B2 JP59064484A JP6448484A JPH0460345B2 JP H0460345 B2 JPH0460345 B2 JP H0460345B2 JP 59064484 A JP59064484 A JP 59064484A JP 6448484 A JP6448484 A JP 6448484A JP H0460345 B2 JPH0460345 B2 JP H0460345B2
Authority
JP
Japan
Prior art keywords
alloy
wire
bonding
core
thickness
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP59064484A
Other languages
English (en)
Japanese (ja)
Other versions
JPS60207357A (ja
Inventor
Shoji Shiga
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Furukawa Electric Co Ltd
Original Assignee
Furukawa Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Furukawa Electric Co Ltd filed Critical Furukawa Electric Co Ltd
Priority to JP59064484A priority Critical patent/JPS60207357A/ja
Publication of JPS60207357A publication Critical patent/JPS60207357A/ja
Publication of JPH0460345B2 publication Critical patent/JPH0460345B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/521—Structures or relative sizes of bond wires
    • H10W72/522—Multilayered bond wires, e.g. having a coating concentric around a core
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/521—Structures or relative sizes of bond wires
    • H10W72/522—Multilayered bond wires, e.g. having a coating concentric around a core
    • H10W72/523—Multilayered bond wires, e.g. having a coating concentric around a core characterised by the structures of the outermost layers, e.g. multilayered coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5525—Materials of bond wires comprising metals or metalloids, e.g. silver comprising copper [Cu]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/555—Materials of bond wires of outermost layers of multilayered bond wires, e.g. material of a coating

Landscapes

  • Wire Bonding (AREA)
JP59064484A 1984-03-31 1984-03-31 半導体用ボンディング細線 Granted JPS60207357A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59064484A JPS60207357A (ja) 1984-03-31 1984-03-31 半導体用ボンディング細線

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59064484A JPS60207357A (ja) 1984-03-31 1984-03-31 半導体用ボンディング細線

Publications (2)

Publication Number Publication Date
JPS60207357A JPS60207357A (ja) 1985-10-18
JPH0460345B2 true JPH0460345B2 (2) 1992-09-25

Family

ID=13259535

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59064484A Granted JPS60207357A (ja) 1984-03-31 1984-03-31 半導体用ボンディング細線

Country Status (1)

Country Link
JP (1) JPS60207357A (2)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103943584A (zh) * 2013-01-18 2014-07-23 日月光半导体制造股份有限公司 用于半导体装置的焊线

Also Published As

Publication number Publication date
JPS60207357A (ja) 1985-10-18

Similar Documents

Publication Publication Date Title
US5343073A (en) Lead frames having a chromium and zinc alloy coating
JP2543619B2 (ja) 半導体装置用リ―ドフレ―ム
JP2576830B2 (ja) リードフレーム
US3999955A (en) Strip for lead frames
JPH09503102A (ja) 電子部品パッケージを組立てる方法
JPH034030Y2 (2)
US4055062A (en) Process for manufacturing strip lead frames
GB2157607A (en) Semiconductor device
JPS6349382B2 (2)
JPH07326701A (ja) 電気電子部品用導電材、リードフレ−ム及びそれを使用した半導体集積回路
JP3402228B2 (ja) 鉛を含まない錫ベース半田皮膜を有する半導体装置
JP2002064173A (ja) 半導体の外形の小さなノーリード・リードフレームの予備めっき
JPH0460345B2 (2)
JP2797846B2 (ja) 樹脂封止型半導体装置のＣｕ合金製リードフレーム材
JP3444981B2 (ja) リードフレーム及びリードフレーム用素材
JPH043041B2 (2)
US20250309065A1 (en) Die attach structure, semiconductor package, method of forming a die attach structure, method of forming a semiconductor package, metal layer stack and method of forming a metal layer stack
JPS62120057A (ja) ボンデイング用細線
JP3481448B2 (ja) リードフレーム
JPH0674463B2 (ja) リ−ドフレ−ム用銅合金
JPS60236252A (ja) 半導体用ボンデイング細線
JPH0480103B2 (2)
JPS6240753A (ja) 半導体リ−ドフレ−ム
JP3454667B2 (ja) Ｌｏｃ型リ−ドフレ−ム
JP3411171B2 (ja) 電子部品用銅合金、リードフレーム、半導体装置およびコネクタ