JPH034030Y2 - - Google Patents

Info

Publication number
JPH034030Y2
JPH034030Y2 JP1984047473U JP4747384U JPH034030Y2 JP H034030 Y2 JPH034030 Y2 JP H034030Y2 JP 1984047473 U JP1984047473 U JP 1984047473U JP 4747384 U JP4747384 U JP 4747384U JP H034030 Y2 JPH034030 Y2 JP H034030Y2
Authority
JP
Japan
Prior art keywords
wire
alloy
bonding
present
thin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1984047473U
Other languages
English (en)
Japanese (ja)
Other versions
JPS60160554U (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1984047473U priority Critical patent/JPS60160554U/ja
Publication of JPS60160554U publication Critical patent/JPS60160554U/ja
Application granted granted Critical
Publication of JPH034030Y2 publication Critical patent/JPH034030Y2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/521—Structures or relative sizes of bond wires
    • H10W72/522—Multilayered bond wires, e.g. having a coating concentric around a core
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/521—Structures or relative sizes of bond wires
    • H10W72/522—Multilayered bond wires, e.g. having a coating concentric around a core
    • H10W72/523—Multilayered bond wires, e.g. having a coating concentric around a core characterised by the structures of the outermost layers, e.g. multilayered coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5525—Materials of bond wires comprising metals or metalloids, e.g. silver comprising copper [Cu]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/555—Materials of bond wires of outermost layers of multilayered bond wires, e.g. material of a coating

Landscapes

  • Wire Bonding (AREA)
JP1984047473U 1984-03-31 1984-03-31 半導体用ボンディング細線 Granted JPS60160554U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1984047473U JPS60160554U (ja) 1984-03-31 1984-03-31 半導体用ボンディング細線

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1984047473U JPS60160554U (ja) 1984-03-31 1984-03-31 半導体用ボンディング細線

Publications (2)

Publication Number Publication Date
JPS60160554U JPS60160554U (ja) 1985-10-25
JPH034030Y2 true JPH034030Y2 (2) 1991-02-01

Family

ID=30562833

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1984047473U Granted JPS60160554U (ja) 1984-03-31 1984-03-31 半導体用ボンディング細線

Country Status (1)

Country Link
JP (1) JPS60160554U (2)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2002023618A1 (ja) * 2000-09-18 2004-01-22 新日本製鐵株式会社 半導体用ボンディングワイヤおよびその製造方法
JP2006216929A (ja) * 2005-01-05 2006-08-17 Nippon Steel Corp 半導体装置用ボンディングワイヤ

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200414453A (en) * 2002-03-26 2004-08-01 Sumitomo Electric Wintec Inc Bonding wire and IC device using the bonding wire
WO2006073206A1 (ja) * 2005-01-05 2006-07-13 Nippon Steel Materials Co., Ltd. 半導体装置用ボンディングワイヤ
JP4672373B2 (ja) * 2005-01-05 2011-04-20 新日鉄マテリアルズ株式会社 半導体装置用ボンディングワイヤ
JP4349641B1 (ja) * 2009-03-23 2009-10-21 田中電子工業株式会社 ボールボンディング用被覆銅ワイヤ
JP5393614B2 (ja) * 2010-08-03 2014-01-22 新日鉄住金マテリアルズ株式会社 半導体装置用ボンディングワイヤ
CN106233447A (zh) * 2014-04-21 2016-12-14 新日铁住金高新材料株式会社 半导体装置用接合线
WO2016189752A1 (ja) 2015-05-26 2016-12-01 日鉄住金マイクロメタル株式会社 半導体装置用ボンディングワイヤ
JP6002300B1 (ja) 2015-09-02 2016-10-05 田中電子工業株式会社 ボールボンディング用パラジウム（Ｐｄ）被覆銅ワイヤ

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2002023618A1 (ja) * 2000-09-18 2004-01-22 新日本製鐵株式会社 半導体用ボンディングワイヤおよびその製造方法
JP2010166080A (ja) * 2000-09-18 2010-07-29 Nippon Steel Materials Co Ltd 半導体用ボンディングワイヤおよびその製造方法
JP2010166079A (ja) * 2000-09-18 2010-07-29 Nippon Steel Materials Co Ltd 半導体用ボンディングワイヤおよびその製造方法
JP2011124611A (ja) * 2000-09-18 2011-06-23 Nippon Steel Materials Co Ltd 半導体用ボンディングワイヤ
JP4868694B2 (ja) * 2000-09-18 2012-02-01 新日鉄マテリアルズ株式会社 半導体用ボンディングワイヤ
JP2006216929A (ja) * 2005-01-05 2006-08-17 Nippon Steel Corp 半導体装置用ボンディングワイヤ

Also Published As

Publication number Publication date
JPS60160554U (ja) 1985-10-25

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