JPH046224Y2 - - Google Patents

Description

[Detailed description of the invention] [Field of application of the invention] The present invention relates to a multilayer pattern applied to touch panels, etc., and more specifically, to a wiring structure of a multilayer pattern in which conductor patterns are arranged above and below an insulating resist. .

[Background of the idea]

FIGS. 2A and 2B show a conventional example of this type of multilayer pattern, and are partial plan views of each step in manufacturing a touch panel.

First, as shown in FIG. 2A, after disposing a large number of transparent electrodes 2 substantially in parallel on a transparent insulating sheet 1, some of these transparent electrodes 2 are connected to external lead-out electrodes extending parallel to each other. A silver pattern 3 is formed by printing. Next, an insulating resist 4 is printed and formed on the plurality of silver patterns 3 to cover the silver patterns 3. Furthermore, as shown in FIG. 2B, silver patterns 5 for external extraction extending parallel to each other are also printed on the other transparent electrodes 2.
At this time, the silver pattern 5 is disposed on the insulating resist 4 from above the insulating sheet 1 almost perpendicularly across the end 4a of the insulating resist 4, thus forming the silver pattern above and below the insulating resist 4. A disposed multilayer pattern is formed.

Such a multilayer pattern is extremely effective when a large number of silver patterns are required in a narrow area.
In other words, the minimum width of each silver pattern is about 0.65mm.
Although a pitch of about 1.3 mm is required, the width d of the area where the silver pattern can be formed on the insulating sheet 1 in FIG. and 5 cannot be formed all at once. Therefore, by adopting a multilayer pattern structure in which the silver pattern 3 is formed on the lower surface of the insulating resist 4 and the silver pattern 5 is formed on the upper surface, a large number of wiring lines can be formed in a limited narrow area.

By the way, since the insulating resist 4 requires a film thickness of several tens of μm to maintain its insulating properties, when forming the silver pattern 5 by printing, as shown in FIG. In this case, the silver pattern 5 tends to bleed. However, in the conventional wiring structure described above, the end 4a of the insulating resist 4 and the silver pattern 5 intersect at almost a right angle, so the silver pattern 5 is densely packed at the end 4a, and the adverse effects of the bleeding are It was easy to accept.
That is, since the end portion 4a defined in a direction substantially perpendicular to the extending direction of the silver pattern 5 has a narrow end surface, the interval between adjacent silver patterns 5 at the end portion 4a is inevitably narrow. Ori,
Since this was further minimized by the bleeding, there was a high risk of shooting.

[Purpose of invention]

The present invention has been made in view of the above-mentioned problems of the prior art, and its purpose is to allow a plurality of conductor patterns arranged on the insulation resist to cross the edge of the insulation resist and shoot at the edge. The purpose is to provide a reliable multilayer pattern wiring structure.

[Summary of the idea]

To achieve this objective, the present invention is characterized in that the conductor pattern printed on the insulation resist and the end of the insulation resist obliquely intersect.

[Example of idea]

Hereinafter, an embodiment of the present invention will be described based on FIG.

FIGS. 1A and 1B show a multilayer pattern according to an embodiment of the present invention, and are partial plan views of each step in manufacturing a touch panel. In these figures, reference numeral 6 indicates an insulating resist, 6a indicates an end thereof, and parts corresponding to those in FIG. 2 described above are given the same reference numerals.

First, as shown in FIG. 1A, after disposing a large number of transparent electrodes 2 substantially in parallel on a transparent insulating sheet 1, some of these transparent electrodes 2 are connected to external lead-out electrodes extending parallel to each other. A silver pattern 3 is formed by printing. Next, an insulating resist 6 of a predetermined shape is printed and formed on the plurality of silver patterns 3 and on a part of the insulating sheet 1 on the right side of the drawing where no silver pattern has been formed yet, and the silver pattern 3 is formed. Cover. That is, this insulation resist 6
The planar shape near a is tapered and protrudes above the insulating sheet 1 on which the silver pattern is not formed, so that the end surface of the end portion 6a is defined relatively widely.

Next, as shown in FIG. 1B, another transparent electrode 2
Also, silver patterns 5 for external extraction extending parallel to each other are formed by printing. At this time, since the insulating resist 6 has a tapered shape, the silver pattern 5 is disposed on the insulating resist 6 diagonally across the end 6a of the insulating resist 6 from above the insulating sheet 1, A multilayer pattern is thus formed. If the end portion 6a is defined such that the end portion 6a of the insulating resist 6 and the silver pattern 5 disposed on the insulating resist 6 diagonally intersect in this way, the end portion 6a may be Since the distance between adjacent silver patterns 5 is sufficiently wide, even if the silver patterns 5 bleed at the end portions 6a during printing, there is no risk that the silver patterns 5 will shoot each other.

[Effect of idea]

As explained above, according to the present invention, the conductive pattern printed on the insulating resist and the end of the insulating resist are diagonally crossed, and the distance between adjacent conductive patterns is wide at the end. Therefore, even if the conductor patterns bleed at the ends, there is no risk of short-circuiting between the conductor patterns.

[Brief explanation of the drawing]

FIGS. 1A and 1B are partial plan views showing each step of a multilayer pattern according to an embodiment of the present invention, and FIGS. 2A and 2B are
FIG. 3 is a partial plan view showing a multilayer pattern according to a conventional example in each step, and FIG. 3 is a perspective view of a main part showing bleeding of a silver pattern. 3, 5... Silver pattern, 6... Insulating resist,
6a... end.

Claims (1)

[Scope of utility model registration request] A plurality of conductor patterns are provided on an insulating substrate, an insulating resist is provided on the conductor pattern, and a plurality of other conductor patterns are provided on the insulating resist and across the ends of the insulating substrate. 1. A wiring structure of a multilayer pattern, which is printed across the top of the multilayer pattern, wherein each of the conductor patterns on the insulating resist and the end of the insulating resist diagonally intersect with each other.