JPH0465447U - - Google Patents
Info
- Publication number
- JPH0465447U JPH0465447U JP10851690U JP10851690U JPH0465447U JP H0465447 U JPH0465447 U JP H0465447U JP 10851690 U JP10851690 U JP 10851690U JP 10851690 U JP10851690 U JP 10851690U JP H0465447 U JPH0465447 U JP H0465447U
- Authority
- JP
- Japan
- Prior art keywords
- element mounting
- mounting part
- ceramic base
- melting point
- low melting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000919 ceramic Substances 0.000 claims description 6
- 239000011521 glass Substances 0.000 claims description 3
- 230000008018 melting Effects 0.000 claims description 3
- 238000002844 melting Methods 0.000 claims description 3
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Description
第１図ａ，ｂは、本考案の一実施例を示す平面
図及びＡ−Ａ′線断面図、第２図ａ，ｂは従来の
セラミツクパツケージの一例を示す平面図及びＢ
−Ｂ′線断面図である。
１……リード、２……低融点ガラス層、３……
セラミツクベース、４……素子載置部。
Figures 1a and b are a plan view and a sectional view taken along the line A-A' showing an embodiment of the present invention, and Figures 2a and b are a plan view and B showing an example of a conventional ceramic package.
-B' line sectional view. 1... Lead, 2... Low melting point glass layer, 3...
Ceramic base, 4...Element mounting section.
Claims (1)
と、前記セラミツクベースの素子載置部の周囲に
低融点ガラス層を介して接合され且つ前記素子載
置部に隣接する先端のボンデイング領域以外の表
面を前記低融点ガラス層により被覆されたリード
とを有することを特徴とするセラミツクパツケー
ジ。 A ceramic base having an element mounting part in the center, and a surface of the ceramic base other than the bonding area at the tip that is bonded to the periphery of the element mounting part of the ceramic base via a low melting point glass layer and adjacent to the element mounting part. A ceramic package comprising a lead covered with the low melting point glass layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10851690U JPH0465447U (en) | 1990-10-17 | 1990-10-17 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10851690U JPH0465447U (en) | 1990-10-17 | 1990-10-17 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0465447U true JPH0465447U (en) | 1992-06-08 |
Family
ID=31855551
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10851690U Pending JPH0465447U (en) | 1990-10-17 | 1990-10-17 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0465447U (en) |
-
1990
- 1990-10-17 JP JP10851690U patent/JPH0465447U/ja active Pending