JPH0468558U - - Google Patents
Info
- Publication number
- JPH0468558U JPH0468558U JP11170090U JP11170090U JPH0468558U JP H0468558 U JPH0468558 U JP H0468558U JP 11170090 U JP11170090 U JP 11170090U JP 11170090 U JP11170090 U JP 11170090U JP H0468558 U JPH0468558 U JP H0468558U
- Authority
- JP
- Japan
- Prior art keywords
- lead frame
- mold
- stepped
- lead
- leads
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 3
- 238000000465 moulding Methods 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Description
第１図はこの考案の一実施例であるリードフレ
ームの斜視図、第２図は第１図のリードフレーム
をモールド後の−線における断面図、第３図
は従来のリードフレームの斜視図、第４図は第３
図のリードフレームをモールドしてリードフオー
ミング後の−線における断面図である。
図において、１は半導体チツプ、５は金線、６
はモールド、８〜１０はリード、１１〜１３はリ
ード、８〜１０のモールド接触部（リード下段部
）、１４〜１６はリード８，９，１０のモールド
内収納部（リード上段部）を示す。なお、図中、
同一符号は同一、または相当部分を示す。
FIG. 1 is a perspective view of a lead frame that is an embodiment of this invention, FIG. 2 is a sectional view taken along the line - after molding the lead frame of FIG. 1, and FIG. 3 is a perspective view of a conventional lead frame. Figure 4 is the third
FIG. 3 is a sectional view taken along the - line after molding and lead forming the lead frame shown in the figure. In the figure, 1 is a semiconductor chip, 5 is a gold wire, and 6 is a semiconductor chip.
8 to 10 are the mold, 8 to 10 are the leads, 11 to 13 are the leads, 8 to 10 are the mold contact parts (lower parts of the leads), and 14 to 16 are the storage parts in the mold (the upper parts of the leads) for the leads 8, 9, and 10. . In addition, in the figure,
The same reference numerals indicate the same or equivalent parts.
Claims (1)
の半導体装置において、外部リードの取り出しを
前記モールド下面より水平方向に出す構造で、 このリードフレームの内、モールド内に収納さ
れる部分の形状を段付とし、この段付部分をモー
ルド外部に出されたリード幅より大きくしたこと
を特徴とするリードフレーム。[Claims for Utility Model Registration] A semiconductor device of the type that is resin-molded using a lead frame, with a structure in which external leads are taken out horizontally from the bottom surface of the mold, and a portion of the lead frame that is housed in the mold. A lead frame characterized in that the shape of the lead frame is stepped, and the stepped portion is larger than the width of the lead exposed outside the mold.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11170090U JPH0468558U (en) | 1990-10-24 | 1990-10-24 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11170090U JPH0468558U (en) | 1990-10-24 | 1990-10-24 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0468558U true JPH0468558U (en) | 1992-06-17 |
Family
ID=31859170
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11170090U Pending JPH0468558U (en) | 1990-10-24 | 1990-10-24 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0468558U (en) |
-
1990
- 1990-10-24 JP JP11170090U patent/JPH0468558U/ja active Pending