JPH0474446U - - Google Patents
Info
- Publication number
- JPH0474446U JPH0474446U JP11810590U JP11810590U JPH0474446U JP H0474446 U JPH0474446 U JP H0474446U JP 11810590 U JP11810590 U JP 11810590U JP 11810590 U JP11810590 U JP 11810590U JP H0474446 U JPH0474446 U JP H0474446U
- Authority
- JP
- Japan
- Prior art keywords
- package
- metal cap
- utility
- semiconductor device
- scope
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002184 metal Substances 0.000 claims description 3
- 239000004065 semiconductor Substances 0.000 claims description 2
- 238000010586 diagram Methods 0.000 description 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Description
第１図は本考案の半導体装置用パツケージの実
施例１の側面図、第２図はリフロー時の様子を示
す図、さらに第３図、第４図はリフロー時に従来
のパツケージと本発明のパツケージを用いた時の
温度プロフアイルである。第５図は他の実施例の
側面図である。第６図は従来の樹脂封止型のパツ
ケージの側面図である。
１……金属キヤツプ、２……モールドパツケー
ジ、３……金属キヤツプの足、４……リードフレ
ーム、５……プリント基板、６……コンベア。
FIG. 1 is a side view of Embodiment 1 of the package for semiconductor devices of the present invention, FIG. 2 is a diagram showing the state during reflow, and FIGS. 3 and 4 show the conventional package and the package of the present invention during reflow. This is the temperature profile when using FIG. 5 is a side view of another embodiment. FIG. 6 is a side view of a conventional resin-sealed package. 1...Metal cap, 2...Mold package, 3...Metal cap legs, 4...Lead frame, 5...Printed circuit board, 6...Conveyor.
Claims (1)
りはずし可能である金属キヤツプを持つことを特
徴とする半導体装置用パツケージ。 A molded semiconductor device package characterized by having a removable metal cap.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11810590U JPH0474446U (en) | 1990-11-09 | 1990-11-09 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11810590U JPH0474446U (en) | 1990-11-09 | 1990-11-09 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0474446U true JPH0474446U (en) | 1992-06-30 |
Family
ID=31866010
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11810590U Pending JPH0474446U (en) | 1990-11-09 | 1990-11-09 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0474446U (en) |
-
1990
- 1990-11-09 JP JP11810590U patent/JPH0474446U/ja active Pending