JPH0197559U - - Google Patents
Info
- Publication number
- JPH0197559U JPH0197559U JP19429887U JP19429887U JPH0197559U JP H0197559 U JPH0197559 U JP H0197559U JP 19429887 U JP19429887 U JP 19429887U JP 19429887 U JP19429887 U JP 19429887U JP H0197559 U JPH0197559 U JP H0197559U
- Authority
- JP
- Japan
- Prior art keywords
- resin
- sealed semiconductor
- sectional
- view
- white
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 4
- 239000011248 coating agent Substances 0.000 claims 1
- 238000000576 coating method Methods 0.000 claims 1
- 239000011347 resin Substances 0.000 claims 1
- 229920005989 resin Polymers 0.000 claims 1
- 238000007789 sealing Methods 0.000 claims 1
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Description
第１図は本考案の一実施例の樹脂封止半導体集
積回路の縦断面図、第２図は本考案の他の実施例
のミニモールド型トランジスタの縦断面図、第３
図は従来の樹脂封止半導体集積回路の縦断面図、
第４図は赤外線リフローによる面実装時の温度プ
ロフアイルを反射板を使用する場合と使用しない
場合とで示したグラフである。
１……表面カバー、２……パツケージ、３……
外部リード、４……半田、５……基板。
FIG. 1 is a vertical cross-sectional view of a resin-sealed semiconductor integrated circuit according to an embodiment of the present invention, FIG. 2 is a vertical cross-sectional view of a mini-mold type transistor according to another embodiment of the present invention, and FIG.
The figure is a longitudinal cross-sectional view of a conventional resin-sealed semiconductor integrated circuit.
FIG. 4 is a graph showing the temperature profile during surface mounting by infrared reflow with and without a reflector. 1... Surface cover, 2... Package cage, 3...
External lead, 4...solder, 5...board.
Claims (1)
白色系又は光沢色の被膜で覆われていることを特
徴とする樹脂封止半導体装置。 A resin-sealed semiconductor device characterized in that the surface of a resin package for sealing a semiconductor element is covered with a white or glossy coating.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19429887U JPH0197559U (en) | 1987-12-21 | 1987-12-21 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19429887U JPH0197559U (en) | 1987-12-21 | 1987-12-21 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0197559U true JPH0197559U (en) | 1989-06-29 |
Family
ID=31485032
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19429887U Pending JPH0197559U (en) | 1987-12-21 | 1987-12-21 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0197559U (en) |
-
1987
- 1987-12-21 JP JP19429887U patent/JPH0197559U/ja active Pending