JPH0477466B2 - - Google Patents

Description

[Detailed Description of the Invention] [Summary] It is a sealed structure of a metal hermetically sealed package, which is equipped with a gasket to prevent chips generated when opening the package from entering the box. Even if the package is opened, it can be resealed by removing the packing, making it possible to reuse the package.

[Industrial application field]

The present invention relates to hermetically sealed structures for electronic circuits and the like.

With the increasing density of electronic circuits, circuit boards equipped with microcircuit components and bare chip ICs have appeared.
In order to isolate the circuit board from dust and the like, it is necessary to enclose it in a hermetically sealed package. Once the package is sealed, it is impossible to repair it if a failure occurs in the internal parts, and the package has to be thrown away. Therefore, even in such cases, there is a need for a package that can be easily opened, resealed after repair, and reused.

[Conventional technology]

FIG. 4 is a sectional view illustrating a conventional hermetic sealing structure.

In FIG. 4, 1 is a metal base, 2 is a metal lid, 3 is a lead, 4 is a circuit base material, and 5 is a circuit component. A circuit base material 4 on which a circuit component 5 such as a micro circuit component or a bare chip IC is mounted is mounted on a metal base 1, and the metal base 1 and a metal lid 2 covering the circuit base material 4 are welded (welding surface 6). Seal hermetically. This hermetic sealing can only be done once.

[Problem that the invention seeks to solve]

In the conventional hermetic sealing structure, the seam between the metal base 1 and the metal lid 2 is only on one side, and that part is sealed by welding (6 is the welding surface), so there is a risk of defects in internal circuit components, etc. If this occurs, it cannot be opened, repaired, or resealed. Therefore, when a defect occurs, the product has to be discarded, resulting in a problem in which the cost of the product increases.

[Means for solving problems]

Figures 1A and 1B show the hermetic sealing structure of the present invention,
A is a plan view, and B is a sectional view taken along line A-A of A.

The problem is that the metal base 1 is provided with a gasket embedding groove 7 and the gasket 9 is embedded, and the metal lid 2 is provided with an opening and cutting groove 8, and the gasket 9 is embedded in the gasket 9.
This problem is solved by the hermetic sealing structure of the present invention, which has a step-like structure of the holding part and the welded sealing part 10.

[Effect]

That is, when opening the package, the package can be opened by simply making a cut in the groove 8 for opening and cutting, and the packing 9 can prevent the intrusion of chips.

On the other hand, when resealing is required, the packing 9 can be removed and welding performed.

〔Example〕

Fig. 1 is a diagram showing an embodiment of the present invention, A is a plan view, B is a sectional view taken along line A-A, Fig. 2 is a diagram illustrating the groove shape of the present invention, and A is an unsealing cut of a metal lid. ditch,
B shows a groove for embedding a metal-based packing.

In Figures 1A and 1B, the hermetic sealing structure is made of an iron-based metal base 1 with a groove 7 for embedding the seal (in the example, as shown in Figure 2B, groove depth c = 0.2 to 0.5 mm, groove width d). = 1 mm), and a gasket 9 made of rubber or the like is embedded in the groove 7. Further, the iron-based metal lid 2 is provided with an opening/cutting groove 8 (in the embodiment, for example, a dowel is made to reduce the thickness as shown in FIG. It has a 10 step-like structure.

As a result, when opening the package, the package can be opened by simply making a cut in the groove 8 for opening and cutting, and the seal 9 can prevent chips from entering.

On the other hand, when resealing is required, the packing 9 can be removed and welding performed.

FIG. 3 is a diagram illustrating the application of the present invention, in which A shows the states of sealing the electronic circuit package, B shows the state of unsealing, and C shows the states of resealing.

In the figure, 1 is a metal base, 2 is a metal lid, and 3
1 is a lead wire, 4 is a circuit base material, 5 is a circuit component, 7 is a groove for embedding a packing, 8 is a groove for opening and cutting, 9 is a packing, 10 is a welded sealing part, and the first sealing is shown in Fig. 3. This is done at the weld sealing part 10 as shown in FIG.
If there are no internal defects in this state, the product will be shipped as is, but at present, a large number of defects (about 30%) occur during accelerated tests such as temperature and humidity tests.

If there is such a defect, the interior can be repaired by making a slit in the opening/cutting groove 8 and cutting (cutting 11) as shown in FIG. The cuts may be made with a shear or file, and the chips generated at that time are removed by vacuum suction.

After repairing the defective part, the packing 9 is removed as shown in FIG. 3C, and the resealing part 12 is welded to complete the resealing. Note that burrs etc. after cutting can be flattened by pressing or the like.

According to this embodiment, since it is easy to open the seal for failures such as defects discovered after sealing (approximately 30%), it is possible to investigate the cause of defects and take measures that were previously impossible.
Repairs can be made. Moreover, since the repaired product can be resealed, it can be salvaged without impairing the functionality of the product, thereby improving the yield.

〔Effect of the invention〕

As explained above, according to the present invention, even if a failure such as a defect is discovered after the package is sealed, the package can be easily opened, the defect can be investigated, countermeasures taken, and repaired, and the product can be repaired after the repair has been completed. Since the product is resealed and does not impair product functionality, yield can be improved.

[Brief explanation of the drawing]

Figures 1A and 2B are diagrams explaining one embodiment of the present invention, Figures 2A and 2B are diagrams explaining the groove shape of the present invention, and Figures 3A to 3C are diagrams explaining an example of application of the present invention. FIG. 4 is a diagram illustrating a conventional hermetic sealing structure. In the figure, 1 is a metal base, 2 is a metal lid, 7
8 is a groove for embedding the packing, 8 is a groove for opening and cutting, 9 is a packing, 10 is a welded sealing part, 11 is cutting, 12
is the resealing part.

Claims (1)

[Scope of Claims] 1. An airtight sealing structure composed of a metal base 1 and a metal lid 2, the metal base 1 having a groove 7 for embedding a packing 9.
The metal lid 2 is provided with a groove 7 for opening and cutting, and when sealing, a gasket 9 is embedded in the groove 7 and sealed by welding, and when it is necessary to open the lid, it can be cut along the groove 8 for opening and cutting. . An airtight sealing structure characterized in that, when resealing, the gasket 9 is removed and the metal lid 2 is directly welded and sealed to the metal base 1.