JPH05259345A - 付属サポートと組み合わせる集積回路用保護デバイス - Google Patents

付属サポートと組み合わせる集積回路用保護デバイス

Info

Publication number
JPH05259345A
JPH05259345A JP4353362A JP35336292A JPH05259345A JP H05259345 A JPH05259345 A JP H05259345A JP 4353362 A JP4353362 A JP 4353362A JP 35336292 A JP35336292 A JP 35336292A JP H05259345 A JPH05259345 A JP H05259345A
Authority
JP
Japan
Prior art keywords
integrated circuit
support
protection mechanism
protection
boundary
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP4353362A
Other languages
English (en)
Japanese (ja)
Inventor
Claudio Cazzaniga
クラウディオ カッツアニィガ
Angelo Massironi
アンジェロ マッシローニ
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
STMicroelectronics SRL
Original Assignee
SGS Thomson Microelectronics SRL
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by SGS Thomson Microelectronics SRL filed Critical SGS Thomson Microelectronics SRL
Publication of JPH05259345A publication Critical patent/JPH05259345A/ja
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/411—Chip-supporting parts, e.g. die pads
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/421—Shapes or dispositions
    • H10W70/424—Cross-sectional shapes
    • H10W70/427—Bent parts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
  • Die Bonding (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP4353362A 1991-12-12 1992-12-11 付属サポートと組み合わせる集積回路用保護デバイス Withdrawn JPH05259345A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
IT91A003334 1991-12-12
ITMI913334A IT1252197B (it) 1991-12-12 1991-12-12 Dispositivo di protezione di circuiti integrati associati a relativi supporti.

Publications (1)

Publication Number Publication Date
JPH05259345A true JPH05259345A (ja) 1993-10-08

Family

ID=11361320

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4353362A Withdrawn JPH05259345A (ja) 1991-12-12 1992-12-11 付属サポートと組み合わせる集積回路用保護デバイス

Country Status (3)

Country Link
EP (1) EP0546435A2 (2)
JP (1) JPH05259345A (2)
IT (1) IT1252197B (2)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006503427A (ja) * 2002-10-09 2006-01-26 ミクロナス ゲーエムベーハー モノリシック集積回路用の支持装置

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0895287A3 (en) * 1997-07-31 2006-04-05 Matsushita Electric Industrial Co., Ltd. Semiconductor device and lead frame for the same
AU2003265206A1 (en) * 2003-08-29 2005-03-16 Infineon Technologies Ag Chip support of a lead frame for an integrated circuit package
ITMI20072099A1 (it) 2007-10-30 2009-04-30 St Microelectronics Srl Metodo di fabbricazione di un dispositivo elettronico comprendente dispositivi mems incapsulati per stampaggio

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5655065A (en) * 1979-10-12 1981-05-15 Toshiba Corp Semiconductor lead frame
JPS61137352A (ja) * 1984-12-10 1986-06-25 Hitachi Ltd 半導体装置
JPS62130548A (ja) * 1985-10-09 1987-06-12 Mitsubishi Electric Corp 半導体装置用リ−ドフレ−ム
JPS63202948A (ja) * 1987-02-18 1988-08-22 Mitsubishi Electric Corp リ−ドフレ−ム
JPH01108731A (ja) * 1987-10-21 1989-04-26 Mitsubishi Electric Corp リードフレーム
JPH02213156A (ja) * 1989-02-14 1990-08-24 Mitsubishi Electric Corp 半導体フレーム
JPH02285665A (ja) * 1989-04-26 1990-11-22 Nec Corp リードフレーム
JPH02303055A (ja) * 1989-05-17 1990-12-17 Mitsubishi Electric Corp リードフレーム

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006503427A (ja) * 2002-10-09 2006-01-26 ミクロナス ゲーエムベーハー モノリシック集積回路用の支持装置

Also Published As

Publication number Publication date
IT1252197B (it) 1995-06-05
ITMI913334A0 (it) 1991-12-12
EP0546435A3 (2) 1994-03-16
EP0546435A2 (en) 1993-06-16
ITMI913334A1 (it) 1993-06-12

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Legal Events

Date Code Title Description
A300 Application deemed to be withdrawn because no request for examination was validly filed

Free format text: JAPANESE INTERMEDIATE CODE: A300

Effective date: 20000307