JPH0531821B2 - - Google Patents

Info

Publication number
JPH0531821B2
JPH0531821B2 JP60138825A JP13882585A JPH0531821B2 JP H0531821 B2 JPH0531821 B2 JP H0531821B2 JP 60138825 A JP60138825 A JP 60138825A JP 13882585 A JP13882585 A JP 13882585A JP H0531821 B2 JPH0531821 B2 JP H0531821B2
Authority
JP
Japan
Prior art keywords
chip
memory
memory chip
integrated circuit
circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP60138825A
Other languages
English (en)
Japanese (ja)
Other versions
JPS61296751A (ja
Inventor
Kazuo Terada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Electric Co Ltd filed Critical Nippon Electric Co Ltd
Priority to JP60138825A priority Critical patent/JPS61296751A/ja
Publication of JPS61296751A publication Critical patent/JPS61296751A/ja
Publication of JPH0531821B2 publication Critical patent/JPH0531821B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general

Landscapes

  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Wire Bonding (AREA)
JP60138825A 1985-06-25 1985-06-25 集積回路チツプ Granted JPS61296751A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60138825A JPS61296751A (ja) 1985-06-25 1985-06-25 集積回路チツプ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60138825A JPS61296751A (ja) 1985-06-25 1985-06-25 集積回路チツプ

Publications (2)

Publication Number Publication Date
JPS61296751A JPS61296751A (ja) 1986-12-27
JPH0531821B2 true JPH0531821B2 (de) 1993-05-13

Family

ID=15231101

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60138825A Granted JPS61296751A (ja) 1985-06-25 1985-06-25 集積回路チツプ

Country Status (1)

Country Link
JP (1) JPS61296751A (de)

Also Published As

Publication number Publication date
JPS61296751A (ja) 1986-12-27

Similar Documents

Publication Publication Date Title
US5165067A (en) Semiconductor chip packages
US5780925A (en) Lead frame package for electronic devices
US5943254A (en) Multichip semiconductor structures with consolidated circuitry and programmable ESD protection for input/output nodes
JP4534132B2 (ja) 積層型半導体メモリ装置
US5804874A (en) Stacked chip package device employing a plurality of lead on chip type semiconductor chips
US4660174A (en) Semiconductor memory device having divided regular circuits
JP2004221215A (ja) 半導体装置
JPS6033311B2 (ja) 垂直半導体集積回路チツプ・パツケ−ジ
US5490041A (en) Semiconductor integrated circuit module and a semiconductor integrated circuit device stacking the same
EP2766928A1 (de) Endstückminimierung mit abschlussgitterversatz vom zentrum der packung
US20250328278A1 (en) 3d memory circuit
US6121681A (en) Semiconductor device
JPH1187640A (ja) 半導体装置および電子装置
JP2000133777A (ja) 半導体集積回路
JP4754201B2 (ja) 半導体装置
JPH0531821B2 (de)
US7064443B2 (en) Semiconductor device having a plurality of stacked semiconductor chips with positions of chip-selecting terminals being different from each other
JPH0715794B2 (ja) 半導体メモリ装置
GB2170657A (en) Semiconductor memory device
EP0418802B1 (de) Leiterstruktur mit grösstintegrierter Schaltung auf einem Wafer
JPH0714002B2 (ja) チップへの信号供給方法
US20050280036A1 (en) Semiconductor product having a first and at least one further semiconductor circuit and method
JPS6034054A (ja) メモリｉｃモジユ−ル
JPH02224266A (ja) 半導体装置
JP2515755B2 (ja) 半導体装置