JPH0533828B2 - - Google Patents
Info
- Publication number
- JPH0533828B2 JPH0533828B2 JP14743887A JP14743887A JPH0533828B2 JP H0533828 B2 JPH0533828 B2 JP H0533828B2 JP 14743887 A JP14743887 A JP 14743887A JP 14743887 A JP14743887 A JP 14743887A JP H0533828 B2 JPH0533828 B2 JP H0533828B2
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- lead frame
- solder
- lead
- molten solder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 229910000679 solder Inorganic materials 0.000 claims description 30
- 239000004065 semiconductor Substances 0.000 claims description 27
- 238000000576 coating method Methods 0.000 claims description 6
- 238000004519 manufacturing process Methods 0.000 claims description 6
- 238000005452 bending Methods 0.000 claims description 4
- 239000011248 coating agent Substances 0.000 claims description 4
- 239000011347 resin Substances 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
- 238000000034 method Methods 0.000 description 6
- 239000000463 material Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14743887A JPS63310147A (ja) | 1987-06-12 | 1987-06-12 | 半導体装置の製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14743887A JPS63310147A (ja) | 1987-06-12 | 1987-06-12 | 半導体装置の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63310147A JPS63310147A (ja) | 1988-12-19 |
| JPH0533828B2 true JPH0533828B2 (de) | 1993-05-20 |
Family
ID=15430338
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14743887A Granted JPS63310147A (ja) | 1987-06-12 | 1987-06-12 | 半導体装置の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63310147A (de) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2728584B2 (ja) * | 1991-11-20 | 1998-03-18 | 京セラ株式会社 | 半導体装置の製造方法 |
-
1987
- 1987-06-12 JP JP14743887A patent/JPS63310147A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS63310147A (ja) | 1988-12-19 |
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