JPH05347496A - Electronic component mounting device - Google Patents

Abstract

PURPOSE:To provide an electronic component mounting apparatus capable of mounting electronic components on a circuit board stably and highly accurately. CONSTITUTION:Upon mounting electronic components 5 on a circuit board 10, the electronic components 5 provided on the tip end of a nozzle 6 are temporarily pressed with a component press pin 7 during the time the nozzle 6 is lifted. Hereby, returning of the electronic components 5 to the nozzle 6 is eliminated, and hence a present apparatus mounts electronic components on the circuit board 10 at a high speed and improves the quality of the circuit board such as lack of components.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component mounting apparatus for stably mounting electronic components on a circuit board.

[0002]

2. Description of the Related Art An example of a conventional electronic component mounting apparatus will be described with reference to FIGS. The conventional electronic component mounting apparatus has an electronic component 5 supplied from an electronic component supply device 9 as shown in the figure.
When the electronic component 5 is mounted on the circuit board 10 by picking it up by the suction nozzle 6, the nozzle 6 is lowered onto the circuit board 10 positioned at a predetermined position, and the electronic component 5 contacts the circuit board 10. At this point, after the air adsorbing the electronic component 5 is turned off, the nozzle 6 is raised to bond the electronic component 5 onto the circuit board 10. In the figure, 1 is the body of the electronic component mounting apparatus, 2 is a suction head, and 3 is X.
A Y table, 4 is a drive motor for the Y table, 8 is a cylinder for vertically moving the nozzle, 11 is a vacuum tube, and 12 is a motor for driving the nozzle.

[0003]

However, in such a device, after the electronic component 5 is in contact with the circuit board 10, the electronic component 5 adsorbed by the nozzle 6 is mounted. Even if it is cut, if there is residual air pressure in the nozzle 6 when the nozzle 6 next rises, or if the tip of the nozzle 6 has a force to bond the electronic component 5 with glue or the like,
As the nozzle 6 rises, it picks up the electronic component 5 and causes instability in accuracy with respect to the mounting of the electronic component 5 on the circuit board 10. Further, the electronic component 5 is completely attached to the nozzle 6.
If it is returned while adsorbing, the electronic component 5 to be mounted is out of stock because it is not on the circuit board 10, and there is a problem that the quality of the circuit board 10 after mounting may deteriorate. .

Further, a nozzle 6 for preventing the above problem
In some cases, after the lowering, a series of operations such as turning off the suction air and raising the nozzle 6 is slowed down, but in this case, the wasteful time for sucking the electronic component 5 on the circuit board 10 is wasted. Since many are needed, it has been a major obstacle to productivity improvement.

The present invention has been made in consideration of the above conventional problems, and an object of the present invention is to provide an electronic component mounting apparatus in which an electronic component is not lifted when a nozzle is raised.

[0006]

In order to set the above-mentioned object, the present invention is to mount an electronic component on a circuit board and when the electronic component is lifted, the electronic component is attached to the circuit board by a nozzle holding the electronic component by suction. It is configured to have a component holding pin that is temporarily held.

[0007]

According to the present invention, in the above structure, when the electronic component is mounted on the circuit board by the nozzle which holds the electronic component by suction, and when the nozzle is subsequently raised, the component pressing pin provided on the nozzle is temporarily Hold down electronic components. For this reason,
Even if there is residual pressure in the nozzle, or even if the tip of the nozzle has adhesive force for electronic components such as glue, the phenomenon of returning the electronic components is eliminated.

[0008]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to the accompanying drawings. The configuration of the electronic component mounting apparatus main body is the same as that of the above-described conventional example except for the nozzle portion, and therefore the description of the configuration is omitted. The characteristic configuration of this embodiment is the nozzle 6.
Part, ie, as shown in FIGS. 1 and 2, the nozzle 6
A hollow component pressing pin 7 is provided inside, and it is biased by a spring 13 so as to project.

Next, the operation of the entire mounting apparatus will be described with reference to the flowchart of FIG. The suction head 2 is positioned by the motor of the XY table up to a predetermined electronic component of the electronic component supply device according to a preset mounting program (step 1). After the positioning is completed, the nozzle 6 is lowered to the position of the electronic component 5 (step 2). The inside of the nozzle 6 is evacuated through the vacuum tube 11 to adsorb the electronic component 5 (step 3). After the suction is completed, the nozzle 6 is raised by the drive motor (step 4). The XY table having the suction head 2 is driven by a motor to position the electronic circuit board 10 at a predetermined position to be mounted (step 5). After positioning is completed, the nozzle 6 drives the nozzle drive motor.
It is lowered by 12 (step 6). At the time when the electronic component 5 contacts the circuit board 10, the air that has evacuated the nozzle 6 is turned off to mount the electronic component 5 (step 7).

The nozzle 6 is raised by the nozzle drive motor 12. At this time, the component pressing pin 7 in the tip portion of the nozzle 6 holds down the electronic component 5 by the urging force of the spring 13, and the nozzle 6 is separated from the electronic component 5 (step 8). After the nozzle 6 is lifted from the electronic component, the component pressing pin 7 in the tip portion of the nozzle 6 that was holding the electronic component 5 is raised (step 9).

In this way, the electronic component 5 mounted when the nozzle 6 is lifted is prevented from rising along with the nozzle 6.

[0012]

As is apparent from the above description of the embodiments, according to the present invention, when the electronic component is mounted on the circuit board, the nozzle holding the electronic component by suction is lifted from the circuit board. Sometimes, to temporarily suppress electronic parts,
It is possible to mount electronic parts with high accuracy and at high speed while the electronic parts are not brought back by a nozzle and the pitch of electronic parts is becoming finer and narrower.

[Brief description of drawings]

FIG. 1 is a sectional view showing the vicinity of a suction head of an electronic component mounting apparatus according to an embodiment of the present invention.

FIG. 2 is a sectional view of a nozzle portion of the suction head.

FIG. 3 is a flowchart of a mounting operation of the same embodiment.

FIG. 4 is a side view of the electronic component mounting apparatus.

FIG. 5 is a sectional view showing the vicinity of a suction head of a conventional electronic component mounting apparatus.

[Explanation of symbols]

 2 Suction head 5 Electronic parts 6 Nozzle 7 Parts holding pin 10 Circuit board 13 Spring

Claims (1)

[Claims] 1. A nozzle for picking up an electronic component by picking it up and mounting it on a circuit board, and a drive unit for vertically driving this nozzle, wherein the nozzle temporarily holds the electronic component on the circuit board when the nozzle rises. Electronic component mounting device with component holding pins.