JPH06224596A - Electronic component mounting device - Google Patents

Abstract

PURPOSE:To provide a mounting apparatus for electronic devices which can suck an electronic device stably. CONSTITUTION:When a nozzle 6 is lowered in order to suck an electronic device 5 supplied from an electronic device supply apparatus 9, the electronic device 5 placed at the front end of the nozzle 6 is held by a device holding pin 7 temporarily, whereby it is prevented to lift up the electronic device 5 toward the nozzle 6 which has not been downed completely. Accordingly, needless operation such as abandonment, re-suck and re-attachment of devices can be reduced and highly efficient electronic device mounting apparatus can be offered.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component mounting apparatus for stably attracting electronic components.

[0002]

2. Description of the Related Art An example of a conventional electronic component mounting apparatus will be described with reference to FIGS. 4 is a side view of the electronic component mounting apparatus, 1 is an electronic component mounting apparatus main body, 2 is a suction head, 3 is an XY table, 5 is a cross-sectional view showing the periphery of the suction head 2, and 9 is a nozzle vertical drive , 10 is an electronic component, and 11 is a vacuum tube.

A conventional electronic component mounting apparatus is as shown in FIG.
When the electronic component 10 supplied from the electronic component supply device 6 is picked up by the suction nozzle 5 and mounted on the circuit board 10, the suction nozzle 5 is lowered with respect to the electronic component 10 supplied from the electronic component supply device 6. While letting the nozzle 5
The air inside is blown out, brought close to a vacuum state, the nozzle 5 is brought into contact with the electronic component 10, and the electronic component 10 is adsorbed by the vacuum force in the nozzle.

[0004]

However, in such a device, in order to suck the electronic component 11 by the nozzle 5, the inside of the nozzle is made closer to a vacuum than before the nozzle contacts the electronic component 11, so that the vacuum is performed. However, because of this vacuum force, the electronic component 10 is picked up,
Regular electronic components such as vertical suction or diagonal suction 1
A state occurs in which the nozzle 5 is not adsorbed at the 0 position. In this state, when the electronic component 10 is mounted on the circuit board 7, instability in accuracy occurs and the quality of the circuit board 7 deteriorates.

If the electronic component 10 that has been abnormally sucked is not mounted, the electronic component 10 needs to be removed, and the electronic component 10 is wasted.
There is a problem that the productivity of the circuit board 7 is lowered because the time for setting 0 or re-adsorption and re-mounting must be executed.

The present invention has been made in view of the above conventional problems, and an object of the present invention is to provide an electronic component mounting apparatus which does not lift an electronic component to a nozzle when picking up the electronic component.

[0007]

In order to achieve the above object, according to the present invention, when a nozzle is lowered and a vacuum force in the nozzle is increased to adsorb an electronic component, the electronic component is temporarily held before contacting the electronic component and the nozzle. So as to press it, the component presser pin is provided so as to be movable up and down in the nozzle, and is biased so as to project from the nozzle. The component presser pin capable of pressing the surface point of the electronic component is provided. .

[0008]

In the present invention, since the electronic component is sucked by the nozzle 8 in the above-described structure, when the nozzle is lowered, the component pressing pin provided on the nozzle temporarily holds the electronic component before the electronic component and the nozzle contact each other. . Therefore, even if there is a vacuum force in the nozzle, the phenomenon of lifting the electronic component before the electronic component is sucked is eliminated.

[0009]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to FIGS. It should be noted that, except for the nozzle portion, since it has the same configuration as the above-mentioned conventional example from the configuration of the electronic component mounting apparatus main body,
The description of the configuration is omitted. The characteristic configuration of this embodiment is in the nozzle 5, that is, as shown in FIGS. 1 and 2, a hollow component pressing pin 12 is provided in the nozzle 5 and is biased by a spring 13 so as to project. Especially.

Next, the operation of the entire mounting apparatus will be described with reference to the flowchart of FIG. In accordance with a preset mounting program, the suction head 2 is positioned by the motor 4 of the XY table 3 to a predetermined electronic component of the electronic component supply device 6 (step 1). After the positioning is completed, the nozzle 5 and the spring 13 at the tip of the nozzle 5 which is the point of the present invention
The component pressing pin 12 urged so as to project by is lowered to the position of the electronic component 10 (step 2).

At this time, the component pressing pin 12 of the nozzle 5 front terminal portion holds the electronic component by the urging force of the spring 13, and the nozzle 5 comes into contact with the electronic component (step 3). Before this, the inside of the nozzle 5 was lowered while keeping it in a vacuum state through the vacuum tube 11, but since the electronic component 10 was held by the component holding pin 12, the nozzle 5
Due to the vacuum force, the electronic component 10 can be stably adsorbed without being pulled (step 4).

After the suction is completed, the nozzle 5 is raised by the drive motor 8 (step 5). The XY table 3 having the suction head 2 mounted thereon is driven by the motor 4 to be positioned at a predetermined position on the electronic circuit board 7 to be mounted (step 6).

After the positioning is completed, the nozzle 5 is lowered by the nozzle drive motor 8 (step 7).

When the electronic component 10 comes into contact with the circuit board 7, the air that has evacuated the nozzle 5 is turned off to mount the electronic component 10 (step 8).

The nozzle 5 is raised by the nozzle drive motor 12 (step 9). In this way, since the electronic component 10 is sucked by the nozzle 5, the electronic component 10 is prevented from being lifted while the nozzle 5 is descending.

[0016]

As is apparent from the above description of the embodiments, according to the present invention, the electronic parts are sucked from the parts supply device, and when the nozzle is lowered, the electronic parts are temporarily held down. It is possible to provide an electronic component mounting apparatus that does not attract components in an abnormal state, prevents waste of electronic components from being wasted, and realizes highly efficient production.

[Brief description of drawings]

FIG. 1 is a sectional view of an essential part of a suction head of an electronic component mounting apparatus according to an embodiment of the present invention.

FIG. 2 is a cross-sectional view of a main part of a nozzle section of the suction head.

FIG. 3 is a flowchart of a suction operation of an electronic component mounting method according to an embodiment of the present invention.

FIG. 4 is a schematic side view of an electronic component mounting apparatus.

FIG. 5 is a sectional view of an essential part of a suction head of a conventional electronic component mounting apparatus.

[Explanation of symbols]

 2 suction head 5 suction nozzle 7 circuit board 10 electronic component 12 component retainer pin 13 spring

Claims (1)

[Claims] 1. A cylindrical nozzle that adsorbs an electronic component and is mounted on a circuit board, and a drive unit that drives the nozzle up and down, is provided in the nozzle so as to be vertically movable, and An electronic component mounting apparatus provided with a component pressing pin which is formed so as to be urged to project and which can press a surface point of the electronic component.