JPH0543313B2 - - Google Patents

Info

Publication number
JPH0543313B2
JPH0543313B2 JP8617187A JP8617187A JPH0543313B2 JP H0543313 B2 JPH0543313 B2 JP H0543313B2 JP 8617187 A JP8617187 A JP 8617187A JP 8617187 A JP8617187 A JP 8617187A JP H0543313 B2 JPH0543313 B2 JP H0543313B2
Authority
JP
Japan
Prior art keywords
etching
metal resist
film
printed wiring
copper plating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP8617187A
Other languages
English (en)
Japanese (ja)
Other versions
JPS63250891A (ja
Inventor
Hideo Nishioka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP8617187A priority Critical patent/JPS63250891A/ja
Publication of JPS63250891A publication Critical patent/JPS63250891A/ja
Publication of JPH0543313B2 publication Critical patent/JPH0543313B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Manufacturing Of Printed Circuit Boards (AREA)
JP8617187A 1987-04-08 1987-04-08 金属レジストを用いた印刷配線板の製造方法 Granted JPS63250891A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8617187A JPS63250891A (ja) 1987-04-08 1987-04-08 金属レジストを用いた印刷配線板の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8617187A JPS63250891A (ja) 1987-04-08 1987-04-08 金属レジストを用いた印刷配線板の製造方法

Publications (2)

Publication Number Publication Date
JPS63250891A JPS63250891A (ja) 1988-10-18
JPH0543313B2 true JPH0543313B2 (2) 1993-07-01

Family

ID=13879309

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8617187A Granted JPS63250891A (ja) 1987-04-08 1987-04-08 金属レジストを用いた印刷配線板の製造方法

Country Status (1)

Country Link
JP (1) JPS63250891A (2)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8110752B2 (en) * 2008-04-08 2012-02-07 Ibiden Co., Ltd. Wiring substrate and method for manufacturing the same

Also Published As

Publication number Publication date
JPS63250891A (ja) 1988-10-18

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