JPH0543478Y2 - - Google Patents

Info

Publication number
JPH0543478Y2
JPH0543478Y2 JP1987008401U JP840187U JPH0543478Y2 JP H0543478 Y2 JPH0543478 Y2 JP H0543478Y2 JP 1987008401 U JP1987008401 U JP 1987008401U JP 840187 U JP840187 U JP 840187U JP H0543478 Y2 JPH0543478 Y2 JP H0543478Y2
Authority
JP
Japan
Prior art keywords
bonding
semiconductor device
pellet
pad
lead terminal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1987008401U
Other languages
English (en)
Japanese (ja)
Other versions
JPS63118234U (2
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1987008401U priority Critical patent/JPH0543478Y2/ja
Publication of JPS63118234U publication Critical patent/JPS63118234U/ja
Application granted granted Critical
Publication of JPH0543478Y2 publication Critical patent/JPH0543478Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/547—Dispositions of multiple bond wires
    • H10W72/5473—Dispositions of multiple bond wires multiple bond wires connected to a common bond pad
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/931—Shapes of bond pads
    • H10W72/932—Plan-view shape, i.e. in top view

Landscapes

  • Wire Bonding (AREA)
JP1987008401U 1987-01-22 1987-01-22 Expired - Lifetime JPH0543478Y2 (2)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1987008401U JPH0543478Y2 (2) 1987-01-22 1987-01-22

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987008401U JPH0543478Y2 (2) 1987-01-22 1987-01-22

Publications (2)

Publication Number Publication Date
JPS63118234U JPS63118234U (2) 1988-07-30
JPH0543478Y2 true JPH0543478Y2 (2) 1993-11-02

Family

ID=30792742

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987008401U Expired - Lifetime JPH0543478Y2 (2) 1987-01-22 1987-01-22

Country Status (1)

Country Link
JP (1) JPH0543478Y2 (2)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8791767B2 (en) * 2010-10-29 2014-07-29 Qualcomm Incorporated Package inductance compensating tunable capacitor circuit

Also Published As

Publication number Publication date
JPS63118234U (2) 1988-07-30

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