JPH0558667B2 - - Google Patents

Info

Publication number
JPH0558667B2
JPH0558667B2 JP62087660A JP8766087A JPH0558667B2 JP H0558667 B2 JPH0558667 B2 JP H0558667B2 JP 62087660 A JP62087660 A JP 62087660A JP 8766087 A JP8766087 A JP 8766087A JP H0558667 B2 JPH0558667 B2 JP H0558667B2
Authority
JP
Japan
Prior art keywords
hole
multilayer ceramic
substrates
substrate laminate
ceramic substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP62087660A
Other languages
English (en)
Japanese (ja)
Other versions
JPS63252456A (ja
Inventor
Juzo Shimada
Yoshiatsu Yamashita
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Electric Co Ltd filed Critical Nippon Electric Co Ltd
Priority to JP62087660A priority Critical patent/JPS63252456A/ja
Publication of JPS63252456A publication Critical patent/JPS63252456A/ja
Publication of JPH0558667B2 publication Critical patent/JPH0558667B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Production Of Multi-Layered Print Wiring Board (AREA)
JP62087660A 1987-04-08 1987-04-08 多層セラミツク基板構造体とその製造方法 Granted JPS63252456A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62087660A JPS63252456A (ja) 1987-04-08 1987-04-08 多層セラミツク基板構造体とその製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62087660A JPS63252456A (ja) 1987-04-08 1987-04-08 多層セラミツク基板構造体とその製造方法

Publications (2)

Publication Number Publication Date
JPS63252456A JPS63252456A (ja) 1988-10-19
JPH0558667B2 true JPH0558667B2 (2) 1993-08-27

Family

ID=13921106

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62087660A Granted JPS63252456A (ja) 1987-04-08 1987-04-08 多層セラミツク基板構造体とその製造方法

Country Status (1)

Country Link
JP (1) JPS63252456A (2)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007299870A (ja) * 2006-04-28 2007-11-15 Matsushita Electric Ind Co Ltd 中継用基板およびそれを用いた立体的電子回路構造体

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5089880A (en) * 1989-06-07 1992-02-18 Amdahl Corporation Pressurized interconnection system for semiconductor chips
EP0516866A1 (en) * 1991-05-03 1992-12-09 International Business Machines Corporation Modular multilayer interwiring structure
CN104603933B (zh) 2012-08-31 2018-09-18 三菱综合材料株式会社 功率模块用基板及功率模块

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007299870A (ja) * 2006-04-28 2007-11-15 Matsushita Electric Ind Co Ltd 中継用基板およびそれを用いた立体的電子回路構造体

Also Published As

Publication number Publication date
JPS63252456A (ja) 1988-10-19

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