JPS63252456A - 多層セラミツク基板構造体とその製造方法 - Google Patents

多層セラミツク基板構造体とその製造方法

Info

Publication number
JPS63252456A
JPS63252456A JP62087660A JP8766087A JPS63252456A JP S63252456 A JPS63252456 A JP S63252456A JP 62087660 A JP62087660 A JP 62087660A JP 8766087 A JP8766087 A JP 8766087A JP S63252456 A JPS63252456 A JP S63252456A
Authority
JP
Japan
Prior art keywords
hole
multilayer ceramic
ceramic substrate
substrate
substrate structure
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP62087660A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0558667B2 (2
Inventor
Yuzo Shimada
嶋田　勇三
Yoshiatsu Yamashita
山下　芳温
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP62087660A priority Critical patent/JPS63252456A/ja
Publication of JPS63252456A publication Critical patent/JPS63252456A/ja
Publication of JPH0558667B2 publication Critical patent/JPH0558667B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Production Of Multi-Layered Print Wiring Board (AREA)
JP62087660A 1987-04-08 1987-04-08 多層セラミツク基板構造体とその製造方法 Granted JPS63252456A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62087660A JPS63252456A (ja) 1987-04-08 1987-04-08 多層セラミツク基板構造体とその製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62087660A JPS63252456A (ja) 1987-04-08 1987-04-08 多層セラミツク基板構造体とその製造方法

Publications (2)

Publication Number Publication Date
JPS63252456A true JPS63252456A (ja) 1988-10-19
JPH0558667B2 JPH0558667B2 (2) 1993-08-27

Family

ID=13921106

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62087660A Granted JPS63252456A (ja) 1987-04-08 1987-04-08 多層セラミツク基板構造体とその製造方法

Country Status (1)

Country Link
JP (1) JPS63252456A (2)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5089880A (en) * 1989-06-07 1992-02-18 Amdahl Corporation Pressurized interconnection system for semiconductor chips
JPH05145006A (ja) * 1991-05-03 1993-06-11 Internatl Business Mach Corp <Ibm> モジユール式多層相互配線構造体
WO2014034245A1 (ja) * 2012-08-31 2014-03-06 三菱マテリアル株式会社 パワーモジュール用基板及びパワーモジュール

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4839950B2 (ja) * 2006-04-28 2011-12-21 パナソニック株式会社 中継用基板およびそれを用いた立体的電子回路構造体

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5089880A (en) * 1989-06-07 1992-02-18 Amdahl Corporation Pressurized interconnection system for semiconductor chips
JPH05145006A (ja) * 1991-05-03 1993-06-11 Internatl Business Mach Corp <Ibm> モジユール式多層相互配線構造体
WO2014034245A1 (ja) * 2012-08-31 2014-03-06 三菱マテリアル株式会社 パワーモジュール用基板及びパワーモジュール
US9615442B2 (en) 2012-08-31 2017-04-04 Mitsubishi Materials Corporation Power module substrate and power module

Also Published As

Publication number Publication date
JPH0558667B2 (2) 1993-08-27

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