JPH0558678B2 - - Google Patents

Info

Publication number
JPH0558678B2
JPH0558678B2 JP1070425A JP7042589A JPH0558678B2 JP H0558678 B2 JPH0558678 B2 JP H0558678B2 JP 1070425 A JP1070425 A JP 1070425A JP 7042589 A JP7042589 A JP 7042589A JP H0558678 B2 JPH0558678 B2 JP H0558678B2
Authority
JP
Japan
Prior art keywords
electrode part
thick film
electrode
wiring board
semiconductor device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP1070425A
Other languages
English (en)
Japanese (ja)
Other versions
JPH02250392A (ja
Inventor
Kikuji Myamura
Michio Asai
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NGK Insulators Ltd
Original Assignee
NGK Insulators Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NGK Insulators Ltd filed Critical NGK Insulators Ltd
Priority to JP1070425A priority Critical patent/JPH02250392A/ja
Publication of JPH02250392A publication Critical patent/JPH02250392A/ja
Publication of JPH0558678B2 publication Critical patent/JPH0558678B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Parts Printed On Printed Circuit Boards (AREA)
  • Structure Of Printed Boards (AREA)
  • Manufacturing Of Printed Wiring (AREA)
JP1070425A 1989-03-24 1989-03-24 配線基板の製造方法 Granted JPH02250392A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1070425A JPH02250392A (ja) 1989-03-24 1989-03-24 配線基板の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1070425A JPH02250392A (ja) 1989-03-24 1989-03-24 配線基板の製造方法

Publications (2)

Publication Number Publication Date
JPH02250392A JPH02250392A (ja) 1990-10-08
JPH0558678B2 true JPH0558678B2 (fr) 1993-08-27

Family

ID=13431113

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1070425A Granted JPH02250392A (ja) 1989-03-24 1989-03-24 配線基板の製造方法

Country Status (1)

Country Link
JP (1) JPH02250392A (fr)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04316394A (ja) * 1991-04-15 1992-11-06 Ngk Insulators Ltd セラミック厚膜配線回路基板の製造方法
WO1998011605A1 (fr) 1995-06-19 1998-03-19 Ibiden Co., Ltd. Carte de circuit permettant le montage de pieces electroniques
US6384344B1 (en) 1995-06-19 2002-05-07 Ibiden Co., Ltd Circuit board for mounting electronic parts
JP3225854B2 (ja) * 1996-10-02 2001-11-05 株式会社デンソー 厚膜回路基板及びそのワイヤボンディング電極形成方法

Also Published As

Publication number Publication date
JPH02250392A (ja) 1990-10-08

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Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees