JPH056665Y2 - - Google Patents

Description

[Detailed Description of the Invention] [Field of Industrial Application] The present invention relates to a soldering jig for stack-type electronic components.

[Conventional technology]

Most of the dual-in-line type electronic components are mounted on a printed circuit wiring board having through holes, and at the same time constitute a desired circuit together with other electronic components mounted on the wiring board. By the way, from the perspective of three-dimensional packaging, when comparing the dual-in-line type electronic components with large-sized electronic components such as capacitors and volumes that are mounted at the same time, the dual-in-line type electronic components have less space utilization. Inferior.

In view of this, in order to use the three-dimensional mounting space more effectively, a method is generally used in which dual-in-line type electronic components are stacked and the overlapping parts of the electrical leads are soldered. Stack IC in type integrated circuit
It is called. Even with this type of IC, the terminals are generally plated with solder to improve solderability when mounted on a printed circuit board.

This process is called soldering, and will be explained based on FIG. 5. That is, in the conventional soldering of stacked ICs, as shown in the figure, the upper IC 3, which has been pre-soldered, is placed in a soldering jig 1 with a built-in magnet.
and the lower IC 4 are mounted via the spacer 5 in a stacked state within a desired size range. here,
2 is a magnet installed in the soldering jig.

Then, by moving the soldering device 6 disposed below up and down as shown by the arrow, the electrical lead overlap portions 8 of the upper IC 3 and the lower IC 4 are dipped in the molten solder 7. are soldered to realize stacking.

[Problem that the invention attempts to solve]

However, when using the conventional soldering jig to stack dual-in-line electronic components such as ICs, for example, in the case of ICs, it is necessary to stack the upper and lower ICs to the desired dimensions in advance, and to use the soldering jig. The problem was that it required two steps, one for loading the machine, and the work was inefficient.

Therefore, the present invention solves the above-mentioned problems and provides a soldering process for stack-type electronic components that has excellent workability by allowing stacking of upper and lower electronic components and mounting on a soldering jig to be completed at the same time. The purpose is to provide tools.

[Means for solving problems]

The soldering jig for stack type electronic components according to the present invention has a large number of grooves formed in a direction transverse to the length direction so that the main body of the electronic component is inserted, and an upper part to be mounted on the electronic component. A large number of non-solder metal plates are connected in parallel, each having a large number of protrusions facing each other at the upper edge between the grooves so as to hold the electronic components and align with the insertion position.

[Effect]

With the present invention configured as described above, when dual in-line type electronic components are mounted, the lower electronic components are inserted and fixed in the groove, and the upper electronic components are formed facing each other at the upper edge of the metal plate. It is inserted, guided and held by the protrusion. Therefore, the mounting position can be determined naturally, and the misalignment of the electrical leads of the lower and upper electronic components can be kept within an allowable range.

〔Example〕

Hereinafter, one embodiment of the present invention will be described in detail based on the drawings. First, FIG. 1 is a schematic diagram showing this embodiment. In the figure, reference numeral 1 denotes a metal plate made of a metal that is not soldered, for example, titanium, and is sufficiently thick so that it does not bend. On the side edges of the upper surface, plate-shaped protrusions 2 are arranged facing each other at a predetermined interval, and a groove 3 of a predetermined depth is formed between these protrusions 2. and,
By using the metal plate 1 having such a large number of protrusions 2 and grooves 3, it is possible to solder a large number of electronic components at once. The above metal plate 1
are connected in parallel by a connecting plate 4. Reference numeral 5 denotes a side support rod, which is provided with a hole 6 for positioning it in a carrier section (not shown) of a soldering device. Reference numeral 7 denotes a handle for setting in the carrier section of the soldering device, and is connected to the side support rod 5 by a connecting rod 8.

Figure 2 is an enlarged view of the indicated location a in Figure 1, and the IC
FIG. 3 is a sectional view of the mounting portion of FIG. 2c. Figure 4 is a diagram of the completed stack IC. Hereinafter, the dimensions shown in these figures will be explained using an IC as an example of a dual-in-line electronic component.

First, the dimension A shown in FIG. 2a is the dimension between the electrical leads at both ends of the upper IC 13 and the lower IC 14, that is, the dimension B shown in FIG. 4 + about 0.1 mm. Also the second
The I dimension in FIG. c is made larger than the J dimension in FIG. 3 by groove machining in order to prevent misalignment between the leads of the upper IC 13 and lower IC 14. and the second
The C dimension in FIG. 3 is set to about 0.1 mm less than the E dimension in FIG. 3, so that the lower surface of the lower IC 14 abuts against the groove 3.

In addition, the D dimension in Figure 2b is the upper part shown in Figure 4.
Package vertical width G dimension of IC13 and lower IC14 +
It should be about 0.1mm. Furthermore, the H dimension in Fig. 2b is
The spacer 15 is designed to match the upper surface of the upper IC 13 to be mounted, and thereby the spacer 15 with a thickness of about 0.3 mm can be inserted and guided to enhance the heat dissipation effect between the upper IC 13 and the lower IC 14, and the upper IC 13 can be prevented from coming off. The J dimension in figure a is the spacer 15
In order to make it stick closely to the top surface of the lower IC 14 to be inserted,
Lower than the top surface of the lower IC14. Also, 9 in the same figure
4 is a relief part of the groove part 3, which is machined at both corners in order to counter the mold burr indicated by b in FIG. 4 and to avoid interference with the dimension Z in FIG. 4.

Therefore, to mount the IC, first insert the lower IC 14 into each groove 3 of the metal plate 1 as shown in Fig. 2a, place the spacer 15 on top of it as shown in Fig. 2b, and then insert the upper IC 13. This is done through a series of steps: loading (c in the same figure). Here, in order to configure the metal plate 1 as described above, an upper IC is attached to the lower IC 14.
13, positioning is inevitably performed. Then, overlap part 1 of the electrical lead.
0 as described above, the fourth
The stacked IC shown in the figure is obtained.

In this example, the soldering jig was described for dual-in-line integrated circuits, but from the technical idea of this invention, it can be applied to all dual-in-line electronic components such as ultra-small reed relays and resistors. It goes without saying that it is possible. Also metal plate 1
However, the present invention is not limited to the above-mentioned titanium material, and can be applied to a wide range of metal materials that are not soldered.

[Effect of idea]

As explained in detail above, the present invention consists of a number of grooves for inserting and fixing lower electronic components into a metal plate that is not soldered, and a pair of opposing grooves for inserting, guiding and holding the upper electronic components at the upper edges between the grooves. In addition, a large number of these metal plates are connected in parallel.

Therefore, the work of stacking the upper electronic components and the work of mounting them on the soldering jig can be done at the same time.
Furthermore, since a large amount of electronic components can be soldered at once, there is an effect that work efficiency and throughput can be improved.

[Brief explanation of the drawing]

Fig. 1 is a partially cutaway perspective view illustrating an embodiment of the present invention, Fig. 2 is a perspective view of main parts illustrating the IC mounting situation using the same embodiment, and Fig. 3 is shown in Fig. 2c.
FIG. 4 is a sectional view of the IC mounting part, FIG. 4 is a completed diagram of a stacked IC using the same embodiment, and FIG. 5 is an explanatory diagram of a conventional example. 1...Metal plate (titanium material), 2...Protrusion, 3
...Groove portion, 10...Overlapping portion of electrical leads, 13...Upper electronic component (upper IC), 14...
Lower electronic component (lower IC), 15...Spacer.

Claims (1)

[Scope of utility model registration request] In a soldering jig for stack type electronic components used when stacking dual-in-line type electronic components and performing a soldering process, the soldering jig is formed in a direction transverse to the length direction so that the main body of the electronic component can be inserted. and a large number of protrusions formed oppositely at the upper edge between the grooves so as to hold the upper electronic component and match the insertion position of the lower electronic component. A stack-type soldering jig for electronic components characterized by a large number of plates connected in parallel.