JPH0567672B2 - - Google Patents

Info

Publication number
JPH0567672B2
JPH0567672B2 JP11346987A JP11346987A JPH0567672B2 JP H0567672 B2 JPH0567672 B2 JP H0567672B2 JP 11346987 A JP11346987 A JP 11346987A JP 11346987 A JP11346987 A JP 11346987A JP H0567672 B2 JPH0567672 B2 JP H0567672B2
Authority
JP
Japan
Prior art keywords
curing
item
adhesive
temperature heat
temperature
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP11346987A
Other languages
English (en)
Japanese (ja)
Other versions
JPS63278987A (ja
Inventor
Masaaki Ootake
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sekisui Iko Co Ltd
Original Assignee
Sekisui Iko Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sekisui Iko Co Ltd filed Critical Sekisui Iko Co Ltd
Priority to JP11346987A priority Critical patent/JPS63278987A/ja
Publication of JPS63278987A publication Critical patent/JPS63278987A/ja
Publication of JPH0567672B2 publication Critical patent/JPH0567672B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by conductive adhesives

Landscapes

  • Epoxy Resins (AREA)
  • Adhesives Or Adhesive Processes (AREA)
JP11346987A 1987-05-12 1987-05-12 二液式低温加熱硬化型導電性エポキシ系接着剤 Granted JPS63278987A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11346987A JPS63278987A (ja) 1987-05-12 1987-05-12 二液式低温加熱硬化型導電性エポキシ系接着剤

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11346987A JPS63278987A (ja) 1987-05-12 1987-05-12 二液式低温加熱硬化型導電性エポキシ系接着剤

Publications (2)

Publication Number Publication Date
JPS63278987A JPS63278987A (ja) 1988-11-16
JPH0567672B2 true JPH0567672B2 (cs) 1993-09-27

Family

ID=14613040

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11346987A Granted JPS63278987A (ja) 1987-05-12 1987-05-12 二液式低温加熱硬化型導電性エポキシ系接着剤

Country Status (1)

Country Link
JP (1) JPS63278987A (cs)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1041104C (zh) * 1994-04-27 1998-12-09 丁秀福 玻璃棉与贴面装饰材料的粘合剂
JPH1143643A (ja) * 1997-04-11 1999-02-16 Shimizu Corp 低アウトガス性塗料
DE60123256T2 (de) * 2001-10-29 2007-09-13 Ceratizit Luxembourg Sarl Verfahren zum Gelgiessen von Formkörpern aus Keramik, Glas oder Metallpulver
CN113004807A (zh) * 2021-03-11 2021-06-22 无锡帝科电子材料股份有限公司 一种热固化导电胶及其制备方法

Also Published As

Publication number Publication date
JPS63278987A (ja) 1988-11-16

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